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DFN(PLP)1612-4 - Ricoh

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PACKAGE INFORMATION<br />

PE-<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4-101014<br />

• <strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4<br />

Unit: mm<br />

PACKAGE DIMENSIONS<br />

1.0±0.1<br />

A<br />

1.2<br />

B<br />

0.6<br />

3 4<br />

0.2±0.1<br />

× 4<br />

0.05<br />

1.6<br />

0.7±0.1<br />

INDEX<br />

2 1<br />

0.3±0.1<br />

0.05 M AB<br />

0.05Min.<br />

0.6Max.<br />

Bottom View<br />

S<br />

0.05 S<br />

) Tab in the parts have VDD or GND level.<br />

(They are connected to the back side of the IC.)<br />

Do not connect to other wires or land patterns.<br />

TAPING SPECIFICATION<br />

0.2±0.1<br />

1.5 +0.1<br />

0<br />

4.0±0.1<br />

2.0±0.05<br />

3.5±0.05<br />

8.0±0.3<br />

1.75±0.1<br />

0.5±0.1<br />

1.8<br />

4.0±0.1<br />

1.2Max.<br />

User Direction of Feed<br />

TR<br />

1.45<br />

TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc)<br />

(1reel=5,000pcs)<br />

11.4±1.0<br />

9.0±0.3<br />

2±0.5<br />

∅13±0.2<br />

∅ 60<br />

+1 0<br />

0<br />

−1.5<br />

∅180<br />

21±0.8


PACKAGE INFORMATION<br />

PE-<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4-101014<br />

POWER DISSIPATION (<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4)<br />

This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.<br />

This specification is based on the measurement at the condition below:<br />

Measurement Conditions<br />

Standard Land Pattern<br />

Environment<br />

Mounting on Board (Wind velocity=0m/s)<br />

Board Material<br />

Glass cloth epoxy plastic (Double sided)<br />

Board Dimensions<br />

40mm × 40mm × 1.6mm<br />

Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%<br />

Through-holes<br />

φ0.54mm × 24pcs<br />

Measurement Results<br />

Power Dissipation<br />

Thermal Resistance<br />

(Topt=25°C, Tjmax=125°C)<br />

Standard Land Pattern<br />

610mW<br />

θja=(125−25°C)/0.61W=164°C/W<br />

θjc=48°C/W<br />

800<br />

762<br />

40<br />

700<br />

Power Dissipation PD (mW)<br />

600<br />

500<br />

400<br />

300<br />

200<br />

100<br />

610<br />

40<br />

0<br />

0 25 50 75 85 100 125 150<br />

Ambient Temperature (°C)<br />

Measurement Board Pattern<br />

Power Dissipation<br />

IC Mount Area (Unit: mm)<br />

The above graph shows the Power Dissipation of the<br />

package based on Tjmax=125°C and Tjmax=150°C.<br />

Operating the IC in the shaded area in the graph might<br />

have an influence it's lifetime.<br />

Operating time must be within the time limit described in<br />

the table below, in case of operating in the shaded area.<br />

RECOMMENDED LAND PATTERN<br />

0.6<br />

0.35<br />

0.45<br />

Product Name<br />

Operating<br />

time<br />

Estimated<br />

years∗<br />

0.7<br />

1.0<br />

2.1<br />

RP100K RP101Kxx1 13,000hrs<br />

9 years<br />

∗The volume is calculated on the supposition that<br />

operating four hours/day.<br />

(Unit: mm)

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