DFN(PLP)1612-4 - Ricoh
DFN(PLP)1612-4 - Ricoh
DFN(PLP)1612-4 - Ricoh
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
PACKAGE INFORMATION<br />
PE-<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4-101014<br />
• <strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4<br />
Unit: mm<br />
PACKAGE DIMENSIONS<br />
1.0±0.1<br />
A<br />
1.2<br />
B<br />
0.6<br />
3 4<br />
0.2±0.1<br />
× 4<br />
0.05<br />
1.6<br />
0.7±0.1<br />
INDEX<br />
2 1<br />
0.3±0.1<br />
0.05 M AB<br />
0.05Min.<br />
0.6Max.<br />
Bottom View<br />
S<br />
0.05 S<br />
) Tab in the parts have VDD or GND level.<br />
(They are connected to the back side of the IC.)<br />
Do not connect to other wires or land patterns.<br />
TAPING SPECIFICATION<br />
0.2±0.1<br />
1.5 +0.1<br />
0<br />
4.0±0.1<br />
2.0±0.05<br />
3.5±0.05<br />
8.0±0.3<br />
1.75±0.1<br />
0.5±0.1<br />
1.8<br />
4.0±0.1<br />
1.2Max.<br />
User Direction of Feed<br />
TR<br />
1.45<br />
TAPING REEL DIMENSIONS REUSE REEL (EIAJ-RRM-08Bc)<br />
(1reel=5,000pcs)<br />
11.4±1.0<br />
9.0±0.3<br />
2±0.5<br />
∅13±0.2<br />
∅ 60<br />
+1 0<br />
0<br />
−1.5<br />
∅180<br />
21±0.8
PACKAGE INFORMATION<br />
PE-<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4-101014<br />
POWER DISSIPATION (<strong>DFN</strong>(<strong>PLP</strong>)<strong>1612</strong>-4)<br />
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.<br />
This specification is based on the measurement at the condition below:<br />
Measurement Conditions<br />
Standard Land Pattern<br />
Environment<br />
Mounting on Board (Wind velocity=0m/s)<br />
Board Material<br />
Glass cloth epoxy plastic (Double sided)<br />
Board Dimensions<br />
40mm × 40mm × 1.6mm<br />
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%<br />
Through-holes<br />
φ0.54mm × 24pcs<br />
Measurement Results<br />
Power Dissipation<br />
Thermal Resistance<br />
(Topt=25°C, Tjmax=125°C)<br />
Standard Land Pattern<br />
610mW<br />
θja=(125−25°C)/0.61W=164°C/W<br />
θjc=48°C/W<br />
800<br />
762<br />
40<br />
700<br />
Power Dissipation PD (mW)<br />
600<br />
500<br />
400<br />
300<br />
200<br />
100<br />
610<br />
40<br />
0<br />
0 25 50 75 85 100 125 150<br />
Ambient Temperature (°C)<br />
Measurement Board Pattern<br />
Power Dissipation<br />
IC Mount Area (Unit: mm)<br />
The above graph shows the Power Dissipation of the<br />
package based on Tjmax=125°C and Tjmax=150°C.<br />
Operating the IC in the shaded area in the graph might<br />
have an influence it's lifetime.<br />
Operating time must be within the time limit described in<br />
the table below, in case of operating in the shaded area.<br />
RECOMMENDED LAND PATTERN<br />
0.6<br />
0.35<br />
0.45<br />
Product Name<br />
Operating<br />
time<br />
Estimated<br />
years∗<br />
0.7<br />
1.0<br />
2.1<br />
RP100K RP101Kxx1 13,000hrs<br />
9 years<br />
∗The volume is calculated on the supposition that<br />
operating four hours/day.<br />
(Unit: mm)