SESHA 2011 Program Book - Semiconductor Safety Association

SESHA & SIA PRESENT THE 

33rd ANNUAL INTERNATIONAL 

HIGH TECHNOLOGY ESH (IHTESH) 

SYMPOSIUM AND EXHIBITION 

FINAL PROGRAM 

Hilton Scottsdale 

Scottsdale, Arizona 

May 16-20, 2011

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SESHA 33rd Annual International High 

Technology ESH Symposium & Exposition 

Where ESH and Technologies Converge 

Table of Contents 

Week at a Glance (Committees, Events, Sessions) ....................................................................................2 

Professional Development Courses ...........................................................................................................3 

Planning Team/Board of Directors .............................................................................................................6 

Final Program ............................................................................................................................................7 

Speaker Biographies..................................................................................................................................25 

Exhibitors by Booth Number.....................................................................................................................33 

Hilton Scottsdale 

Scottsdale, Arizona 

Guest Phone: 480-948-7750 

Guest Fax: 480-948-2232 

Symposium attendees are eligible to receive certification 

maintenance points from both BCSP and ABIH. 

Certificates are available at the Registration Desk. 

Registration Hours: 

Salon I Foyer 

Monday, May 16 .................................................................................................................... 3:00-6:00 PM 

Tuesday, May 17 .............................................................................................................7:00 AM-6:00 PM 

Wednesday, May 18 .......................................................................................................7:30 AM-4:00 PM 

Thursday, May 19 ...............................................................................................................7:30 AM-Noon 

Exhibit Hall Hours: 

Salons I/II/III 

Tuesday, May 17..............................................................................................................9:30 AM-7:00 PM 

Break.........................................................................................................................9:30-10:00 AM 

Exhibitor Sponsored Lunch...................................................................................... Noon-1:45 PM 

Break ......................................................................................................................... 3:15-3:45 PM 

Tuesday, May 17 Opening Reception & Raffle Drawing....................................................... 5:15-7:00 PM 

Wednesday, May 18 ........................................................................................................9:00 AM-4:00 PM 

Break .......................................................................................................................9:30-10:00 AM 

Cash & Carry Lunch ........................................................................................ 11:30 AM-1:00 PM 

Break and Raffle Drawing.......................................................................................... 3:15-3:45 PM 

SESHA 33rd Annual International High Technology ESH Symposium & Exhibition 

1

Monday, 16 May 

Board of Directors 

1:00-5:00 pm Sonora D 

PDC 1-Fundamentals and EHS Challenges of Semiconductor 

Manufacturing 

8:00 am-5:00 pm Sonora A 

PDC 2-Vacuum and Cryogen Safety Concerns 

8:00 am-Noon Sonora B 

PDC 3-Silane Safety 

1:00-5:00 pm Sonora B 

PDC 4-Ethics and ESH 

6:00-8:00 pm Sonora B 

Tuesday, 17 May 

Opening Ceremony and Awards Presentation - SESHA 

History Project, Liz Aton 

8:00-9:30 am Sonora A/B/C 

Break 

9:30-10:00 am Salons I/II/III 

Exhibits 

9:30 am-7:00 pm Salons I/II/III 

SIA Regional Updates - SIA, ESIA, TSIA, CSIA, KSIA, 

JSIA 

10:00-11:00 am Sonora A/B/C 

Keynote - Global Semiconductor Industry - Looking Forward, 

David Isaacs; SIA 

11:00 am-Noon Sonora A/B/C 

Complimentary Exhibitor Sponsored Lunch 

Noon-1:45 pm 

Week Schedule 


Concurrent Sessions 

1:45-3:15 pm Sonora A/B/C 

Break - Raffle Ticket Distribution 

3:15-3:45 pm Salons I/II/III 



Opening Reception - Raffle Ticket Drawing 


Wednesday, 18 May 

Exhibitor Breakfast 

7:30 am Salons I/II/III 

Keynote Presentation: IC Insights, Trevor Yancey 

8:30-9:30 am Sonora A/B/C/D 

Exhibits 


2 

Break - 2nd Raffle Ticket Distribution & Raffle Drawing 

9:30-10:00 am Salons I/II/III 


10:00-11:30 am Sonora A/B/C/D 

Cash & Carry Lunch 



1:00-3:15 pm Sonora A/B/C/D 

Break - Raffle Ticket Distribution & Raffle Drawing 




Thursday, 19 May 

5K Race 

6:30 am Meet in Lobby 

Fellows Breakfast 

7:30-8:00 am Sonora D1 

Region Chapter Leader Breakfast 

7:30 am Salon 4 

Keynote - Towards Harmonization of Measuring and 

Reporting Product Sustainability, Kevin Dooley 

8:30-9:30 am Sonora A/B/C 

Break 

9:30-10:00 am Sonora Foyer 


10:00-11:30 am Sonora A/B/C 

Lunch on your Own 

11:30 am-1:00 pm X 



Break 

3:15-3:45 pm Sonora Foyer 

Closing Ceremony & Prize Drawing 



5:00-6:00 pm Sonora D 

Friday, 20 May 

PDC 5-Fundamentals & EHS Challenges of PV Manufacturing 

8:00 am-5:00 pm Salon I 

PDC 6-Exhaust Management, Point-of-Use Abatement Devices, 

Electronics Industry Greenhouse Gas Reporting Rule, 

and Process Emissions and POU Abatement Device DRE/ 

Emissions Testing Methodologies 

8:00 am-5:00 pm Salon II

Professional Development Courses 

Monday 16 May - Friday 20 May 

Monday 16 May 

Full Day, 8:00 am – 5:00 pm 

PDC1 Fundamentals and ESH Challenges of 

Semiconductor Manufacturing - Sonora A 

Susan Creighton 

The 2011 Introduction to Semiconductor ESH 

class is intended for ESH students and professionals 

new to the semiconductor industry and operations. Topics 

covered in the class include: •An overview of the 

semiconductor industry and operations •A virtual tour 

of a semiconductor fab •An introduction to the semiconductor 

manufacturing process •A presentation on occupational 

health and safety issues in a semiconductor 

fab •A review of semiconductor environmental considerations 

•Discussions on SEMI EHS Standards: S2, S8 

and S23 •A summary of global environmental regulations. 

An experienced semiconductor EHS professional 

recognized in their area of expertise presents each topic. 

This will be a full day PDC. Students will be provided 

with handouts of each presentation. 

3 

Half Day, 8:00 am - Noon 

PDC2 Vacuum and Cryogen Safety Concerns 

for Laboratory Applications - Sonora B 

Roger Shrouf 

Vacuum systems can present a variety of hazards 

to the laboratory worker. This course will provide an indepth 

discussion of a wide variety of hazards and mitigation 

techniques related to vacuum systems in a research 

laboratory environment. A thorough discussion of the 

interface between the vacuum system and commonly 

associated pressure sources (such as backfill or process 

gases) will be provided. The limitations and safety 

concerns associated with vacuum purging of associated 

pressure systems will be included. Potential accidental 

overpressure of the vacuum system will be emphasized 

as well as safety concerns for the use of brittle materials 

in vacuum applications. Course discussions will also include 

ancillary hazards commonly associated with vacuum 

applications such as vacuum pump issues, electrical 

safety hazards, and mechanical concerns. Many vacuum 

processes involve the use of cryogenic fluids – and 

nearly all cryogenic fluid applications involve the use of 

vacuum. Therefore, cryogenic fluid properties and hazards 

as well as mitigation techniques will be discussed. 

The primary focus of the cryogen safety segment of the 

course will be on liquid nitrogen and liquid helium applications. 

A wide variety of hazards will be discussed 

including the highlighted hazards of pressure build up 

from the warming of trapped cryogens and asphyxiation 

concerns. The features and safety concerns of cryogenic 

liquid Dewars will also be illustrated. Open discussion 

will be encouraged throughout the course and lessons 

learned from accident scenarios will be included where 

applicable. 

Half Day, 1:00 – 5:00 pm 

PDC3 Silane Safety - Sonora B 

Eugene Ngai 

Unpredictable, delayed ignition and explosive are 

words typically used to describe the behavior of silane. 

Since 2006 significant attention has been focused on 

silane safety because of the increasing number of incidents. 

One day safety seminars and training classes have 

been conducted around the world by leading experts. 

Despite these efforts, silane related incidents continue to 

occur worldwide. Attend this Professional Development 

Course and you will learn the latest on silane from leading 

experts. Agenda items include review of the history 

of silane, how it behaves, insurance/industry funded research 

projects and their importance of how silane systems 

can be designed to drastically reduce the number 

of incidents and/or their severity. A code overview and 

best practices for silane handling will also be presented. 

1:00 – 1:15 Eugene Ngai: Welcome and Introductions 

1:15 – 1:45 Eugene Ngai: Review of recent incidents 

1:45– 2:30 John Cox and Beth Tshudy: Code Case Study 

2:30 – 3:00 Crystal Mjelde: Bulk Installations 

3:00 – 3:15 Break 

3:15 – 3:45 Sue Creighton: Abatement 

3:45 – 4:15 Eugene Ngai: Testing and G13 

4:15 – 4:50 Vinnie DeGiorgio: Best Practices 

4:50 – 5:00 Closing remarks 

Evening, 6:00 – 8:00 pm 

PDC4 Nanoethics: Safety, Risk, and Responsible 

Innovation - Sonora B 

Sarah Davies 

This session offers an introduction to contemporary 

thinking on nanoethics, applying this to the context 

of the industrial laboratory and opening up a discussion 

of what constitutes ethical practice in scientific research 

and development. Throughout, the emphasis will be on 

the critical skills and tools needed to engage in informal 

ethical reflection in the workplace. After giving a

whirlwind tour of key ideas in nanoethics, the focus will 

move to ways in which the ‘ethical’ is being used within 

notions of responsible innovation and corporate social 

responsibility. The continuum between ‘doing no harm’ 

and being a ‘positive social force’ will be introduced, 

with reference to what this continuum will look like in 

the context of the industrial hygiene and safety professions. 

Recent research on lay ethical concerns regarding 

nanotechnology will also be discussed. Finally, the 

group will engage in a discussion of how ‘nanoethics’ 

can be practically applied to the professional contexts 

in which they work. This course is coordinated by Dr 

Sarah R Davies, of the Center for Nanotechnology in 

Society at Arizona State University. 

Friday 20 May 

Full Day, 8:00 am – 5:00 pm 

PDC5 Fundamentals and EHS Challenges of 

PV Manufacturing - Salon I 

PDC Facilitator: Andrew McIntyre, CIH and Managing 

Principal - EORM 

PDC Presenters: EHS and Sustainability experts 

from various companies involved in the manufacture of 

Photovoltaics as well as the Solar Energy Industry Association 

representatives. 

Abstract: Photovoltaic (PV) technologies provide 

energy with distinct environmental benefits over traditional 

energy generating technologies, which have given 

the PV industry a strong reputation as a “green industry.” 

With the rapid increase in demand (both consumer 

and commercial) for PV products, it is essential that the 

PV industry fulfill the promise of being a green industry 

by avoiding many of the past environmental, health & 

safety (EHS) pitfalls encountered during the expansion 

of similar high-technology industries. Experience with 

the semiconductor industry over the last three decades 

has provided a clear EHS roadmap for the PV industry 

to follow. This professional development course will 

provide specific details on the EHS and sustainability 

hazards/controls of the solar cell and module manufacturing, 

installation, maintenance and end-of-life product 

issues. 

Who Should Attend: This PV Professional Development 

Course is intended for conference participants 

interested in learning more about the hazards, hierarchy 

of risk controls and current EHS and Sustainability challenges 

facing the manufacturers of photovoltaic products. 

PDC Agenda 

Welcomes, Introduction and Course Objectives 

Andrew McIntyre, CIH - Managing Principal - Environmental 

& Occupational Risk Management, Inc. (EORM) 

Key Note - Global Regulatory Drivers and Challenges 

Lisa Krueger - Vice President of Sustainability - First 

Solar 

Solar Energy Industry Association (SEIA) EHS Initiatives 

Christine Covington - Manager of Government Affairs; 

Environment, Health, & Safety - Solar Energy Industries 

Association (SEIA) 

Industrial Hygiene, Safety, Fire Protection and Environmental 

Risk Considerations and Controls (Speakers 

from the following Crystalline and Thin Film Process 

Manufacturers) 

Crystalline PV - Jim Larson - EHS Manager, SunPower 

Cadmium Telluride(CdTe) PV - Ken Smigielski - EHS 

Engineering Group, First Solar 

Copper, Indium, Gallium Selenide (CIGS) PV - TBD 

High Efficiency Multijunction Concentrator Cell PV - 

Holly Baez, EHS Manager, Spectrolab, a Boeing Company 

Corporate Social Responsibility - Challenges and Opportunities 

for the PV Industry 

Todd Brady - Global Environmental Manager - Intel 

Corporation 

Supply Chain Management 

Leann Speta - Supply Chain Sustainability Manager - 

SunPower Corporation 

Installer EHS Considerations - Residential, Industrial, 

and Solar Farm/Utility Level 

TBD 

Recycling Processes & End-of-Life Considerations 

Jennifer Woolwich, MA, CPHQ, CSSBB - CEO - PV Recycling, 

LLC 

PDC6 Exhaust Management, Point-of-Use 

Abatement Devices, Electronics Industry Greenhouse 

Gas Reporting Rule, and Process Emissions 

and POU Abatement Device DRE/Emissions Testing 

Methodologies - Salon II 

Mike Sherer 

Semiconductor process and fab exhaust management 

procedures and strategies will be presented. Many 

of these also apply to LCD, solar and related industries. 

Discussion of fluorine, particulate, ammonia and ozone 

4

will be highlighted. Point-of-Use (POU) abatement technologies 

overview will be provided. Important items to 

assist personnel in reducing maintenance and increasing 

uptime will detailed. The EPA Greenhouse Reporting 

Rule for electronics industry will be presented and any 

lessons learned provided. The EPA Testing Protocol for 

POU abatement device Destruction and Removal Efficiency 

(DRE) and the 2009 ISMI Testing Guideline will 

be presented. This overview will allow the attendee to 

understand how testing is conducted and how to work 

with testing suppliers. 

5

Symposium Planning Committee: 

Co-Chairs: Steve Trammell, Laurie Beu, 

Tom Diamond and David Isaacs 

PDC 

Co-Chairs: Laurie Beu, Susan Creighton and 

Dawn Speranza 

Keynote Speaker Coordinators 

Co-Chairs: Vinnie DeGiorgio, David Isaacs and 

Kimberly Smieja 

Global Chemical Regulations Session 

Chair: Tim Yeakley 

Safety/IH Session 

Co-Chairs: John Bucciarelli, Kim Smieja 

Greenhouse Gas Session 

Co-Chairs: Brett Davis, Hilary Matthews 

Corporate Social Responsibility Session 

Chair: Bonnie Peralta 

Symposium Planning Team 

Photovoltaic ESH Session 

Chair: John Cox 

Emerging Codes and Regulations Session 

Chair: Tiffany Giles 

Waste Minimization Session 

Chair: Jennifer Chittick 

Disaster Preparedness Round Table 

Chair: Vinnie DeGiorgio 

Abatement Strategies Session 

Chair: Dale Moore 

Risk Management Session 

Co-Chairs: Andy McIntyre, Pat Tierney 

Energy Conservation Session 

Chair: Doug Thornton 

Executive Committee 

President – Karl Albrecht, 

Fairchild Semiconductor Corp 

President-Elect – Kimberly Smieja, Intel Corporation 

Past-President – Paul M. Connor, 

Dow Electronic Materials 

Treasurer – Steve Roberge, Axcelis 

Secretary – Doug Thornton, 

Fairchild Semiconductor Corp 

Executive Director – Brett Burk 



Sanjay Baliga, SEMI 

Jennifer Chittick, BAE Systems 

John D. Cox, Advanced Technology Solutions 

Vincent A. DeGiorgio, FM Global 

Thomas Diamond, Semiconductor Industry Assoc. 

Dawn Speranza, Intel Corporation 

Steven Trammell, ISMI 

John Visty, Salus Engineering International 

Mary Majors, Editor, Air Products & Chemicals Inc 

6

Tuesday 

8:00-9:30 am 

Opening Ceremony and 

Awards Presentation 

Sonora A/B/C 

10:00-11:00 am 

SIA Regional Updates 

Sonora A/B/C 

11:00 am-Noon 

Keynote - Global Semiconductor 

Industry - Looking Forward 

Sonora A/B/C 

Noon-1:45 pm 

Final Program 

Lunch Break, Exhibit Hall 

1:45-4:30 pm 

Global Chemical Regulations 

Sonora A 

1:45 pm Environmental Regulatory Developments 

in the EU 

Harte, S; ESIA - European Semiconductor Industry Association, 

Belgium 

ISESH 2011 / SESHA 33rd Annual ESH Symposium 

Abstract Title : Environmental Regulatory Developments 

in the European Union Substance restrictions 

or substance related bans on use are an obvious point of 

concern for many sections of the high tech sector. They 

are however not something new for the worldwide semiconductor 

manufacturing supply chain. Nevertheless the 

restriction of substances whether through EU RoHS or 

REACH systems will continue into the forseeable future. 

In addition the industry needs to prepare activity 

and roadmap plans to move away from the exempted 

substance and applications where possible to do so. 

This presentation will be broad ranging in nature and 

aim to update the conference on the regulatory developments 

in Europe in terms of substances restrictions 

through REACH, EU RoHS or potentially PFOA and 

the evolution of potential revised flourinated gas regulations 

within the EU in 2011 and will assess the impact 

on semiconductor industries. The presentation will also 

outline the revised exemption review systems under the 

revised RoHS directive. 

7 

2:30 pm JAMP Activity Update 

Ibuka, S; Tokyo Electron Limited 

JAMP means “Joint Article Management Promotion” 

council for cross-industry. JAMP frmawork is 

applicable to chemical/subsatance information transfer 

through whole supply chain globally, which are required 

by EU REACH, EU CLP, each country’s GHS, 

US TSCA or many international/local legslation. JAMP 

was introduced at the last IHTESH held in Taiwan. Currently, 

JAMP is introduced in ISO26000 and the draft of 

ECHA REACH guidance. JAMP activity update should 

be presented there. 

3:15 pm Break & Raffle Distribution, Exhibit Hall 

3:45 pm Decontamination and Decommissioning 

of Equipment: Roundtable Discussion 

Yeakley, T; Texas Instrumentsu 

Semiconductor manufacturing and research facilities 

regularly ship equipment parts for rebuild or repair. 

These parts could contain chemical and byproducts residues 

that cannot be removed on-site without causing 

irreversible damage to the part. The presence of these 

residues may also require compliance with various regulations 

during transport from DOT, IATA, IMDG, etc. 

The purpose of this roundtable discussion is to share 

information between semiconductor companies on the 

best known methods to classify these parts for transportation. 

We will discuss how to determine whether decontamination 

of a specific part onsite is appropriate; the 

de-minimus quantities above which the part will have to 

be regulated; methods used to determine the hazards of 

byproducts in parts; necessity of testing the byproducts; 

whether regulatory tests can be modified for practical 

application; and methods for managing special cases 

like batteries and magnets. 

1:45-5:15 pm 

Safety-IH 

Sonora B 

1:45 pm Evaluation of Potential Cytotoxicity of 

Nanoscale Inorganic Oxides Utilized in Semiconductor 

Manufacturing 

Sierra-Alvarez, R, Otero, L, Garcia, C, Luna-Velasco, A, 

Cobo, A, Field, JA; University of Arizona, Tucson 

The future success of the semiconductor industry 

is dependent on the capacity to manufacture smaller 

and smaller devices which requires the use of nanopar-

ticles (NPs). Numerous reports have been published in 

recent years expressing concern for the potential toxicity 

of NPs to humans and ecologically important species. 

The objective of this work was to investigate the 

potential cytotoxicity of nanoscale inorganic oxides 

commonly utilized in semiconductor manufacturing 

(SiO2, Al2O3, CeO2) and emerging inorganic oxide 

nanoparticles (HfO2). Other commercially-important 

inorganic oxides (ZnO, TiO2, ZrO2, Mn2O3) were also 

included in the study for comparison. Nanotoxicity was 

assessed using several well-established bioassays (e.g., 

Microtox, yeast respiration measurements, MTT) and 

a recently developed impedance-based Real Time Cell 

Assay (RTCA). The target cells in those bioassays included 

bacteria, yeast, and human cells. Additional assays 

were performed to evaluate the potential involvement 

of reactive oxygen species (ROS), toxic soluble 

species, and/or decrease in cell membrane integrity on 

cytotoxicity. Furthermote, the particle size distribution 

and fraction of inorganic oxide effectively dispersed in 

the various bioassay media was investigated in order to 

get information on the actual hydrodynamic diameter 

and state of dispersion of the nanomaterials. With the 

exception of SiO2 which formed highly stable dispersions, 

the nanoscale inorganic oxides tested showed a 

high tendency to aggregate in most biological media resulting 

in micron-size aggregates that settled out of the 

dispersion. ZnO and Mn2O3 were the most inhibitory 

inorganic oxide nanomaterials evaluated with 50% inhibiting 

concentrations often in the low ppm range. In 

contrast, CeO2 and HfO2 were nontoxic in most assays 

at concentrations as high as 1,000 mg L-1. Nanosized 

SiO2 and Al2O3 showed intermediate to low cytotoxicity. 

The underlying mechanisms involved in the cytotoxicity 

of these nanomaterials are currently under investigation. 

Furthermore, the results obtained indicated the 

potential of impedance based RTCA to rapidly screen 

for nanoparticle toxicity. Future research will address 

validation of the RTCA results using conventional cytotoxicity 

tests. 

8 

2:30 pm Preventing Musculoskeletal Discomforts 

for a Healthy Workplace 

Lin, R-T; Taiwan Semiconductor Manufacturing Company, 

Taiwan 

Musculoskeletal diseases are on top, accounting 

for 73%, of the ranking of compensated occupational 

diseases in 2010 in Taiwan. Previously reported musculoskeletal 

discomforts among fabrication room (fab) 

workers were owing to frequent manual wafer pod handling 

or operating manufacturing equipments with improper 

anthropometric data for users in different countries. 

In addition, sufferers of work-related tendinitis are 

entitled to compensation since 2010 under the new list 

of occupational diseases in Taiwan, leading to an anticipated 

soar of work-related musculoskeletal diseases 

compensation due to long hours of use or repetitive typing 

among computer users. Providing an ergonomic 

working interface for a company with hundreds of thousands 

workers is a challenge to balance the purchase 

specification and cost. Under the changing working 

interface from on-site process equipment operation to 

remote computer monitoring, the report aims to provide 

an overview of prevalent trends, regulatory standards, 

and challenges of musculoskeletal disease among different 

countries. The report demonstrates our systematic 

approach for reducing workers’ awkward postures and 

musculoskeletal complaints through ergonomically redesigned 

fab/office workstations. In addition to statistical 

data, the report also includes an introduction of health 

care programs on solving musculoskeletal discomforts, 

such as massage and traditional Chinese medicine lectures. 

Information on the effectiveness of ergonomic 

programs has been computerized and integrated into e- 

ESH system. Our case studies and experience sharing 

may be of use in both policy and practice for reducing 

ergonomics-related occupational diseases and promoting 

a healthier workplace. 


3:45 pm Tetramethylammonium Hydroxide 

(TMAH): Toxicity and Methods to Reduce Risk in 

the Workplace 

DiZio, K, Melville, R, Timlin, E; IBM, San Ramon, CA 

and Hopewell Junction, NY 

Tetramethylammonium hydroxide (TMAH), CAS 

#75-59-2, is employed in an increasing number of semiconductor 

manufacturing processes. Newer applications 

may use TMAH concentrations as high as 25% at elevated 

temperatures. Contact with concentrated TMAH 

solutions may cause serious intoxication. Several fatalities 

have been reported by the Asia Pacific semiconductor 

and photoelectric industries. Factors that may 

be important in determining the degree of intoxication 

include the concentration of TMAH, the % body surface 

area affected, the period before decontamination, and 

the possibility of concurrent inhalation exposure and 

dermal contact. Early toxicity studies in rats and guinea 

pigs identified TMAH as highly toxic with an oral LD50 

in rats between 34 and 50 mg/kg and a dermal LD50 

in guinea pigs of 25 to 50 mg/kg. Later studies in rats

sponsored by IBM found that contact with less than 1 

milliliter of a 12% or 25% TMAH solution was lethal 

within 3 hours. IBM investigated possible underlying 

mechanisms of acute systemic toxicity including the direct 

effects on neurotransmission and on blood gases. 

IBM took prompt action to assess and, where necessary, 

enhance the health and safety procedures associated 

with TMAH based on the results of these animal studies. 

IBM notified the US EPA under the significant new 

information provisions of the Toxic Substances Control 

Act, Section 8e. Furthermore, IBM modified internal 

chemical labels for formulations containing TMAH, 

sponsored chemical-resistant glove and coverall permeation 

testing on TMAH solutions, performed process 

reviews on specific TMAH-using operations, and notified 

employees and contractors of the potential hazard. 

IBM implemented vigorous controls on the introduction 

of new processes employing concentrated TMAH 

solutions. Senior management is briefed on the potential 

hazards of the process, the tool and engineering 

requirements, and the availability of potential alternatives 

to TMAH. IBM develops work plans to reduce or 

eliminate potential TMAH hazards. In addition, IBM is 

working in cooperation with several development partners 

and suppliers to identify less hazardous alternatives 

to TMAH. 

4:30 pm The Integration of a Toxic Gas Monitoring 

System into the Building Fire Alarm System 

Sweeney, J; Harvard University 

Many facilities have toxic gas monitoring systems 

(TGMS) with local strobes to evacuate just clean rooms 

and affiliated areas. However, many facilities do not integrate 

their toxic gas monitoring systems into the building 

fire alarms systems. This presentation will describe 

three different types of toxic gas monitoring systems in 

a university setting and will describe how all three systems 

are integrated into the perspective building fire alarm 

systems. Topics of interest in this presentation will be as 

follows: 1. Details on TGMS Alarm level set points for 

exhaust and ambient gas sensors and when they trigger 

the building fire alarm systems; 2. Overview of how the 

two systems are integrated 3. Reasons for integrating the 

two systems; 4. Training details for all personnel involved 

in this new integrated system. In a university setting, the 

various working groups involved during emergencies 

are more expansive than in an industry setting. Types of 

people trained on the system (campus police, local fire 

fighters, facilities personnel, university operations center 

(24/7 hotline), EH&S department responders, building 

occupants etc). 

9 

1:45-5:15 pm 

GHG 

Sonora C 

1:45 pm Compliance Techniques for New Greenhouse 

Gas Regulations 

Higgs, T; Intel 

New greenhouse gas regulations pertaining to 

emissions reporting and facility permitting will impose 

multiple new requirements on semiconductor manufacturers 

and others in the electronics industries. The mandatory 

reporting rule for additional sources of fluorinated 

greenhouse gases (40CFR Part 98, subpart I) will 

require new approaches for measuring emissions, tracking 

inventories of fluorinated gases and heat transfer fluids, 

and add extensive new recordkeeping and reporting 

requirements. The Prevention of Significant Deterioration 

and Title V Greenhouse Gas Tailoring Rule (40CFR 

Parts 51, 52, 70 et. al.) will subject many sources to major 

source permitting requirements that have previously 

been able to avoid such requirements. These sources are 

likely to experience greatly increased requirements to 

understand and manage emissions impacts of routine 

changes, and significantly increased monitoring, reporting 

and recordkeeping burden. This presentation will 

examine compliance techniques for meeting the new 

requirements, and possible approaches for reducing the 

burden. 

2:30 pm PFC Stack Emissions Testing 

Inloes, S; WaferTech 

The goal of this testing was to determine if stack 

testing could be used to replace recipe specific testing 

required in the federal reporting rule. During February 

of 2011, the SIA stack testing subcommittee developed 

the various stack testing options for testing emissions 

from electronic manufacturing Fabs. Various test methods 

were considered with the criteria determined to be 

1-10 ppb detection level . This equated to Fab emission 

of 1,000 to 40,000 MT CO2 eq depending on the Fab’s 

exhaust rate. Our site used GM/MS method to determine 

the concentrations of PFC’s and collection the samples 

using Summa containers. This method requires one-two 

days of onsite sample collection by a local emission testing 

company. Our process PFC emissions are routed to 

five acid scrubber stacks. In April of 2011, we tested 

the five acid scrubbers simultaneously to reduce any 

variability of the site wide data. During the collection 

of the samples daily PFC gas usage data was collected 

and tier 2 emissions were compared to stack test results.

The daily rate was also compared to the prior year’s usage 

rate to determine if the test was representative of 

the annual usage rate. The GC/MS analyst was done at 

a remote certified lab with additional QC procedures 

to validate the method. The testing included duplicate 

samples, blanks, ambient samples, and spiked samples. 

These samples are also part of a stability study. The laboratory 

results demonstrate that the samples are accurate, 

stable and reproducible. The process data indicates 

that the tests were done while the plant was operating a 

90-110% of the annual PFC gas usage rate compared to 

the prior year. Part of the cost of the study was paid for 

by ISMI. 


and the non-confidential information available will be 

shared for this presentation. Members of the semiconductor 

industry desire to use this stack testing methodology 

to develop facility wide emissions factors for each 

GHG so that semiconductor fab GHG emissions can be 

estimated in a more accurate and cost effective manner. 

4:30 pm Staying Up to Date with the EPA’s Mandatory 

Reporting for Greenhouse Gases and California’s 

AB32- Regulations as They Relate to Semiconductor 

and Related Devices 

Cook, J; EORM, San Jose CA 

This talk will provide an overview of the EPA and 

the California Air Resources Board (CARB) GHG regulations 

as they relate to the Semiconductor, LCD and PV 

manufacturing industries. The presentation will provide 

a brief regulatory update on significant international, national 

and state issues concerning climate change and 

highlight specific best practices, tools, strategies and 

lessons learned following the March 1, 2011 CARB 

compliance deadline. The presentation will conclude 

with a brief look forward on what the future may hold 

for GHG management in the technology sector. 

3:45 pm Developing a Fluorinated Greenhouse 

Gas Stack Testing Method Using FTIR 

Gilliland, T, Laush, C; Texas Instruments, Inc., IMACC 

Texas Instruments Incorporated (TI) is interested 

in identifying an alternative method to more accurately 

estimate Greenhouse Gas (GHG) emissions from their 

semiconductor fabrication operations(fabs) to reduce 

the cost burden of the final Mandatory Reporting Rule, 

Subpart I (40CFR98). In order to accomplishment this 

5:15-7:00 pm 

goal, TI proposes estimating emissions using a facility 

wide mass balance approach based on emissions characterization 

using familiar analytical equipment such 

Drawing 

Opening Reception & Raffle 

as the Fourier Transform InfraRed mass spectrometer 

(FTIR) and production metrics. Historical data using 


FTIR at the end of line exhaust stacks indicated that 

many of the process greenhouse gas (GHG) concentrations 

were below typical FTIR detection limits of 50 

Wednesday 

8:30-9:30 am 

parts per billion by volume (ppbv). IMACC, a company 

that specializes in designing and manufacture of FTIR 

Keynote 

monitoring systems for industry and government, understood 

the challenges of measuring these compounds at 

Sonora A/B/C/D 

8:30 am IC Insights 

sub-ppbv levels and performed experiments in their lab 

Yancey, T 

with a modified FTIR to achieve lower detection limits. 

The primary objective of this study was to measure in 

the field exhaust stacks at a typical operating semiconductor 

9:30 am Break, Exhibit Hall 

fab to demonstrate the feasibility of measuring 

10:00-11:30 am 

GHGs at sub-ppbv. IMACC, using their enhanced FTIR 

and approved EPA Methods 301 and 320, successfully 

Safety/IH 

measured stack level emissions at three TI fabs with detection 

Sonora A 

limits in the parts per trillion by volume (pptv), 10:00 am Safety and Health Committee 

thus demonstrating the feasibility at both 200mm and Qaio, X; Hynix Semiconductor (China) Ltd. 

300mm semiconductor fabs. The second objective of Hynix semiconductor China Limited (HSCL), 

this study was to reasonably correlate the semiconductor 

headquartered in Icheon, South Korea, is a wholly 

fab operational parameters with measurements at the foreign-owned enterprise located in Export Processing 

exhaust stack. The field data is currently being evaluated Zone Wuxi, Jiangsu province of China. HSCL’s main 

10

product is 12-inches wafer, and it covers an area of 54 

million square meters, of which the gross Investment 

reaches to 5.26 billion dollars. About 3700 employees 

from Korea and China work for HSCL.Safety and Health 

Committee Safety and Health committee is a communication 

bridge between employee and employer, created 

by Hynix and Hynix labor union together for the purpose 

of promoting mutual understanding between the 

labor and the capital, dissolving and improving internal 

issues of environmental, health and safety related to employees, 

making the optimal working environment for 

employees. Specificity 1. Specialty As far as the organization 

structure is concerned, Safety and Health committee 

is a newborn thing. Similar organization structure 

has not been found by now in other related industry. 2. 

Innovation In a point of view of foreign labor unions’ 

operating mode, there is a sharp contradiction in terms 

of interests between labor union and enterprises. But the 

Hynix labor union is designed to protect and coordinate 

the interests of both sides of labor and capital, satisfy 

the employees and promote the enterprise development 

as well. Operation Overview 1.Organization Chairman 

of a committee; Chinese labor union chairman, Korean 

deputy general manager Committee member; Korean 

leaders from manufacturing department, technology 

department, general affairs department, and personnel 

labor union committee Executive:Responsible persons 

from ESH department 2.Operation Mode: Practical 

meeting: We collect advice and suggestions monthly 

from the basic level by various means and hold the practice 

meeting to take them over in the end/beginning of 

a month. Solutions will be taken out and significant issues 

would be submitted to periodic meeting for further 

discussion.Periodic meeting:Periodic meeting is held 

quarterly to debrief the results of practical meeting and 

provide advice and solutions to significant issues. 3.Operation 

Content: Safety: Clean room odor, PPE, toxic 

gas monitoring Environment: Dorm odor, corporate 

environment, sewage treatment Occupational health: 

noise, psychological consult, smoking and drinking, individual 

radiation dosimeter 4.Operation results Safety 

and Health Committee has collected and disposed more 

than 200 advice and suggestions from 2008. Our operating 

environment and the safety consciousness of workers 

has been greatly improved. And the sense of trust 

between labor and capital has been enhanced a lot as 

well. As a result, our employees put more energy into 

production, makes more output and profit. In 2010, We 

Hynix got the historically highest profits. 

10:45 am A Study on Odor Reduction for Semiconductor 

Industry 

Park, NH, Kim, SG, Shin, CS; Hynix Semiconductor, 

Repulic of Korea 

A Study On Odor Reduction for Semiconductor 

Industry No-Hyeok Park, Sung-Gon Kim, Chong-Su 

Shin Cheong-Ju ESH Team, Administrtion Division, 

Hynix Semiconductor Inc. 1,55,125 Hyangjeong-dong 

Hungduk-gu Cheongju 361-725 Repulic of Korea Tel 

: 82-43-280-2615, Fax : 82-43-280-2489, E-mail : nohyuck.park@hynix.com 

Odor is caused by one or more 

volatilized chemical compounds that human being can 

perceive by the sense of olfaction and can feel unpleasant 

and disgusted. It is one kind of sensory pollution that 

results in physical and psychological harm. Especially, 

semiconductor industry have had difficulty in managing 

unclear odor as air pollutants generated by many 

kinds of gasesous chemical compounds and considering 

reduction measures. Hynix Semiconductor Inc. judged 

that odor problems will be issued by residents because 

the residential areas have been created close to Cheongju 

site. Therefore, our company put technical measures 

to practical use for odor management generated from 

semiconductor plant. In first step, the correlation between 

the concentration of exit specific compounds(e.g. 

HF, NH3) and the odor was considered for selecting 

odor index. The complex odors in itself were selected 

for the optimal management index. In second step, reduction 

characterisitics by emission sources for the 

practical use of odor reduction were studied. Especially, 

the exhaust part of the thin film process had the 

highest odor concentration based on the result derived 

from the priority for the classification of the emission 

odors. A wet scrubber in installed to treat the odor intensively 

between the plasma scrubber to decompose 

PFC gas at high temperature and the final wet scrubber. 

Also, the odor removal efficiency of Hume generated 

from SC-1 wastewater(Mixed of NH4OH and H2O2) 

improved with building the wet scrubber (H2SO4 neutralization) 

for NH3. Its process is seperated from existing 

wet scrubber(NaOH neutralization) for acid. Hynix 

Semiconductor Inc. was able to decrease about 70% of 

complex odors in 2010 compared to 2009 with the odor 

reduction technologies as state above. Odor monitoring 

systems for odor quality analysis and real-time management 

are being currently investigated. This research introduces 

our company’s odor reduction control system 

for win-win strategy between the semiconductor industries 

and the nearby residents. 

11:30 am Cash & Carry Lunch, Exhibit Hall 

11

1:00-5:15 pm 

Emerging Codes 

Sonora A 

1:00 pm Air Permitting Wafer Fabs 

Sherer, M; Sherer Consulting Services, Inc. 

Semiconductor fabs have complex processes that 

emit numerous process gases and byproducts. This presentation 

will provide information on developing calculation 

methodologies for air permitting, including 

byproducts. Strategies for air permitting will also be 

presented. 

1:45 pm Complying with 1-Hour NO 2 

NAAQS 

Davis, B; Zephyr Environmental Corp. 

The US EPA has recently promulgated a totally 

new short term National Ambient Air Quality Standard 

(NAAQS) for NO 2 

. This 1-hour standard became effective 

April 12, 2010 and is set at 100 parts per billion 

(ppb) or 188 micrograms per cubic meter (μg/m3). For 

premit activity to authorize new or modified combustion 

sources, site wide modeling to demonstrate compliance 

with the 1-hour NO 2 

NAAQS is likely to be required. 

The presentation will inform the audience that non-compliance 

is common, often due to emissions from emergency 

engines. Techniques for modifying sources and 

operations to improve modeling results will be detailed. 

2:30 pm Implementing ISO 13849-1; An Equipment 

Manufacture’s Perspective 

Fessler, M; Tokyo Electron U.S. Holdings, Inc. 

Performance Level’s: Why Now? Current semiconductor 

equipment design standards already reference 

ISO 13849-1, but not many engineering teams 

have taken the leap to implement yet. Currently both 

EN 954-1 (1996) and ISO 13849-1 (2006) can be used 

by the equipment builders, users and integrators to help 

prove their presumption of conformity to the Machinery 

Directive (2006/42/EC). It’s important for us remember 

that after Dec 31st, 2011, only EN ISO 13849-1(2008) 

may be used for this purpose. There are different arguments 

being made on when we should implement. The 

proponents of the standard say that protective measures 

have evolved to keep pace with the increasing automation 

complexity, and that customer’s want to future proof 

their machines. Additionally, it is specifically mentioned 

multiple places within two semiconductor specific design 

guides (EN 60204-33, Section 9 and SEMI S2 

Sections 11, 12, and RI 13. The “naysayers” say that 

its overkill and not needed, as our equipment leads the 

world in safe design/manufacturing. Additionally, both 

12 

the Machinery Directive and SEMI S2 guideline allows 

for a risk based approach which permits certification 

without following this specific harmonized standard 

(e.g conforms to performance goal versus conforms to 

stated criteria). It has also been viewed as being overlycomplicated 

(fear factor to undertake). TEL U.S’s. Product 

EHS embarked on task of applying ISO 13849-1 to 

one of our new equipment’s design within a US-based 

TEL Engineering Group, and its will be evaluated as a 

learning tool for other TEL Engineering groups in Japan. 

Roadblocks and lessons learned will be shared. 

3:15 pm Break & Raffle Drawing, Exhibit Hall 

3:45 pm Fire Safety Compliance - Why Are My 

Fire Safety Systems Not SEMI S2 Compliant? 

Wyman, M; KFPI 

Fire Protection Safety & Compliance is clearly defined 

by SEMI S2 in Chapter 14. In fact, Chapter 14 

encompasses over 4 pages of the SEMI S2 document to 

detail “Fire Risk Assessment”, “Fire Risk Reduction”, 

“Fire Detection”, and “Fire Suppression” design and 

compliance. Also, SEMI S14 is another entire SEMI 

document dedicated to Fire Risk Assessment & Mitigation. 

However, when it comes to actual fire protection 

system integration into semiconductor equipment, it appears 

that no one actually reviews to make sure the fire 

safety system is compliant. KFPI has performed numerous 

3rd Party inspections and audits of existing semiconductor 

equipment fire protection systems installed 

worldwide. KFPI will uncover the numerous fire protection 

non-compliance issues they have discovered in fabs 

around the world, many of which were supplied by the 

tool manufacturer. We will then explain the resulting fire 

safety hazard for each violation found. Issues include 

inadequate design, lack of supervision, improper application, 

improper installation, and imitation equipment. 

4:30 pm Around the World Chemical Tour 

Graunke, D, Majors, M 

Several countries, including the US, are reviewing 

their chemical strategies, taking a close look at EU 

REACH. Could this mean harmonized global chemical 

regulaitons? Harmonizing chemical legislation in all 

countries would be extremely complicated because of 

variations in government structures. This presentation 

will take a tour of current and pending chemical regulations 

around the globe with a focus on potential impacts 

to the supply chain, importer requirements, and what it 

takes to import/export a chemical around the world.

10:00-11:30 am 

CSR 

Sonora B 

10:00 am The Business Case for Integrating ESG 

Niekerk, G, Fallender, S, Zeller, E; Intel Corporation 

ESG (Environmental, Social and Governance) performance 

indicators and metrics have been used for several 

years by socially minded investors to make investment 

decisions; however, companies have had a difficult 

time applying similar metrics for internal business decisions 

that go beyond traditional ROI. Intel developed a 

framework to review our environmental, social and governance 

activities and practices in terms of their impact 

along four main business dimensions: (1) Risk Management: 

Protecting our license to operate, maintaining 

constructive relationships with local communities, and 

mitigating risk and promoting responsibility throughout 

our supply chain; (2) Operations: Building a strong 

talent pipeline, increasing employee engagement, and 

achieving cost savings and greater efficiency through 

sustainable business practices; (3) Revenue: Contributing 

to growth and product innovation; and (4) Brand: 

Enhancing our reputation and goodwill with stakeholders 

and becoming a trusted partner. This framework provides 

Intel a method of evaluating and describing the 

various ways in which our integrated approach to ESG 

factors creates value for Intel; by making decisions that 

optimize long-term shareholder value and effectively articulate 

internal and external value generated from our 

activities. 

10:45 am Implementation Strategy for Corporate 

Social Responsibility (CSR) at ON Semiconductor 

Evans, K, McCarley, T, Amorin, P; ON Semiconductor 

Implementation Strategy for Corporate Social Responsibility 

(CSR) at ON Semiconductor Keenan Evans, 

Theresa McCarley and Pam Amorin ON Semiconductor 

5005 E. McDowell Rd. Phoenix, AZ 85008 The term 

Corporate Social Responsibility (CSR) encompasses 

corporate governance, environmental due diligence and 

sustainability, worker rights, and health and safety considerations. 

In response to the social needs and desires 

driven by company stakeholders (shareholders, customers, 

employees and the local communities where companies 

do business), there has been a surge of CSR activity 

in all aspects of business (manufacturing, services, 

etc.). This activity requires companies to formally demonstrate 

they are good global corporate citizens wherever 

they do business. In order to align with the global 

electronics community and to formalize and organize 

13 

our various CSR efforts, On Semiconductor became an 

applicant member of the Electronic Industry Citizenship 

Coalition (EICC) in mid-2009 and we became a 

full member of the EICC in December of 2010. We had 

previously endorsed the EICC code of conduct and we 

had a number of programs already in place to ensure 

compliance to the various tenets of the code, including 

a long established code of business conduct and formal 

certification to the ISO14001 environmental management 

system standard. This presentation/discussion will 

explore our ‘current state’ of CSR globally and focus on 

our implementation and management strategy internally 

within our own facilities and externally with our supply 

chain. The presentation/discussion will incorporate an 

overview on the impact of recent legislation regarding 

conflict metals and human rights. 


1:00-5:15 pm 

Waste Minimization 

Sonora B 

1:00 pm Recovering Semiconductor Manufacturing 

Materials 

Parker, R, Atkinson, B, Bradshaw, J; Freescale Semiconductor, 

E2CS, Intel 

Recovering Semiconductor Manufacturing Materials 

Semiconductor Scrap Management Program Objectives 

-Environmental Stewardship -Intellectual Property 

Protection -Maximization of potential revenues How to 

accomplish these objectives -Follow established internal 

corporate policies for reclaim -Contracting with reclaim/ 

recycler (s) that understands complex semiconductor 

scrap materials. -Final scrap recovery through Integrated 

Smelter process. Structure of the Recycling Chain – In 

essence…. There are only six integrated smelters in the 

world that have been modified to process the complex materials 

contained in semiconductor scrap. Environmental 

Stewardship: -The current Best Available Technology for 

final processing of Semiconductor complex scrap to elements 

is an integrated smelter. -Integrated Smelter technology 

represents massive capital investments and these 

smelters exist only in Canada, Germany, Belgium, Sweden, 

Japan and Australia. The Recycling Chain and your 

Company Utilize Best Available Environmental Technology 

Understanding Semiconductor Scrap Materials The 

reasons for and benefits of the lot# system are: Descriptions 

of Semiconductor Scrap Semiconductor Scrap Management 

Program Objectives – Continued The reclaim 

chain of custody: Security can help prevent E-Waste theft

and counterfeiting An example of illegal activity and subsequent 

prosecution. Semiconductor Scrap Management 

Program Objectives – Continued Your Reclaim Program 

You’re Decision The Optimal Reclaim Provider will: Valuation 

of Scrap Materials and Revenue Return One of the 

most difficult concepts to explain is the process of determining 

the value of your materials. YOU must understand 

what it is that you have and what expected returns you 

should be expecting considering transportation, proper 

environmental processing, IP protection and cost of management. 

The dilemma: How do you look at 10,000 Kg 

of scrap material and place a value on it? The Answer: 

Robust Statistical Sampling Single Provider Consolidation 

Benefits Single Largest Benefit of using EcoTech 

Recycling Business Considerations for Selecting Reclaim 

Vendors. 

1:45 pm Improving the End-of-Life for Electronic 

Materials via Sustainable Recycling 

Korzenski, M, Jiang, P; ATMI 

The production of electronic equipment such as 

computers, cell phones, TVs, etc. is one of the fastest 

growing global manufacturing activities. Unfortunately 

this results in substantial quantities of waste electric and 

electronic equipment (WEEE). In 2008, the US generated 

3.16 million tons of e-waste, and of this amount, 

only 430,000 tons or 13.6 % was recycled1. The remaining 

WEEE was sent to landfills, incinerators, or shipped 

overseas to “backyard” smelters. Globally, some 20 to 

50 million metric tonnes of e-waste are generated every 

year2. Rapid economic growth, coupled with urbanization 

and growing demand for consumer goods, has increased 

both the consumption of electronic equipment 

and the production of WEEE. This is a major source of 

hazardous wastes that poses a risk to the environment, 

human health and to sustainable economic growth. To 

address potential environmental problems stemming 

from improper management of WEEE, many countries 

and organizations have drafted national legislation 

to improve their reuse and recycling and to reduce the 

amount and types of materials disposed in landfills. Recycling 

of WEEE is important not only to reduce the 

amount of waste requiring treatment, but also to promote 

the recovery of valuable materials and to save 

natural resources needed to mine and extract new materials 

from the earth. Electronic waste is diverse and 

complex with respect to the materials and components 

used3, thus new technologies are needed for developing 

cost-effective and environmentally sound recycling 

systems. In this talk we will present novel processes/ 

chemistries and enhanced process efficiencies based 

on green chemistry and green engineering methodologies 

for recycling waste electronic materials. We will 

demonstrate that one can recover metals and valuable 

components from end-of-life products using cost effective, 

sustainable, and scalable methods (e.g., systems 

that are closed loop, energy efficient, environmentally 

benign). This includes both chemical desoldering and 

precious metal reclaim with all metals recovered and resold. 

1. “Municipal Solid Waste Generation, Recycling, 

and Disposal in the United States: Facts and Figures for 

2008.” United States Environmental Protection Agency, 

Office of Solid Waste (EPA-530-F-009-021, November 

2009. 2. Press Release, “Basel Conference Addresses 

Electronic Wastes Challenge.” November 27, 2006, 

United Nations Environment Programme (UNEP). 3. 

For example, one ton of used mobile phones (~6,000 

handsets, a tiny fraction of today’s 1 billion annual production) 

contains approximately 3.5 kg of silver, 340 

grams of gold, 140 grams of palladium, and 130 kg of 

copper with a combined value of over US $15,000 at 

today’s prices (http://www.sciencedaily.com/releases/2009/09/090915140919.htm). 

2:30 pm Creating the Green Fab Standard Labeling 

for Taiwan Semiconductor Industries 

Lu, J, Cheng, J-H, Shu, FM; ITRI 

In last year’s, there are many industries invest a lot 

of money and ad-space toward making their products 

more attractive to consumers who were increasingly concerned 

with the environmental impacts of products in Taiwan. 

Because of the need of clean production standards, 

Taiwan government want to set a “Green Fab Labeling” 

for each industry in the future. Taiwan semiconductor industry 

association executes a demonstrated project of the 

Green Fab Labeling which cooperates with the Ministry 

of Economic Affairs cooperation in Taiwan. The standard 

labeling is not like the LEED system, it is focus on the 

clean production manufacturing. The Green Fab Labeling 

criteria items including Ecology (Biodiversity Green 

Plants Sustainable Drainage Systems), Energy (Energy 

Saving Process Energy Saving (Clean Room) Monitoring 

Energy Use Green Transport -Green Modes Renewable 

Energy Source), Waste(Building Waste Reduction and 

Others issues(Environmental Offset Measures and Education 

and Training).This article will introduce the TSIA’s 

member how to assist Taiwan government to create a 

demonstrate “Green Fab Labeling” for semiconductor 

and other industry. This paper will also show the contents 

of standard draft. 

14


3:45 pm Research of Reduction Carbon Dioxide 

Emission by Applying Microalgae Biotech in Semiconductor 

Factory 

Ching-Lung, C; Powerchip Technology 

Industrial activities have improved human life, but 

also have increased greenhouse gases (GHG) emission 

into atmosphere, to cause the rising of the Earths average 

temperature and the other serious environmental 

problems. For solving these problems, there are many 

carbon reduction technologies are under development 

and application fast, such as physical treatment, chemical 

treatment and biological fixation. Today we plant 

a lot of trees to fix and transfer carbon dioxide(carbon 

sink) for the sake of carbon reduction. Therefore, carbon 

capture and storage have also been considered as 

an indispensable option to reduce carbon emission. Extensive 

research has been conducted to evaluate the feasibility 

of large-scale permanent carbon storage in oil 

fields and ocean beds. These carbon storage methods 

appear to be the potential solution for carbon reduction, 

but the highly cost, long-term stability, carbon reduction 

effect remains questionable. Microbial photosynthesis, 

particularly by microalgae, is now being reconsidered as 

a viable technology to reduce carbon. These processes 

are also attractive because the microbial extracts may 

possess substantial commercial values such as dietary 

supplements and fuels. In this study, we design an integrated 

CO2 biofixation system that consists of three 

parts, including CO2 scrubber system, and submerged 

membrane harvesting system. A laboratory-scale system 

was built to investigate the technical feasibility, and the 

pilot-scale system has been subsequently installed on 

semiconductor manufacture factory to reduce CO2 that 

emit from boiler process exhaust. The boiler use nature 

gas as fuel, and its exhaust contain CO2 about rather 

consistent at 16.1% and its temperature fluctuates between 

50 and 60°C. We used wet scrubber to wash CO2 

into water and supplied the carbon resource to grow microalgae 

in the close-loop photobioreactors, and microbial 

photosynthesis processes are designed to achieve 

faster growth rate, better carbon fixation efficiency, and 

greater growth density, then we generate and gain the 

concentrated microalgae in the membrane harvesting 

system. Microalgal CO2 Fixation appear to be a potential 

solution for carbon reduction in the semiconductor 

fab. In the future, we will plan to combine regenerating 

energy to develope a cost-effective energy-saving systems 

and try to test the large module. The test results 

15 

will provide reliable data to reduce carbon emissions in 

the semiconductor fab. 

4:30 pm Environmentally Benign In-Line Cleaning 

Solutions for Advanced Semiconductor Manufacturing 

Chen, T, Hogan, T, Korzenski, M; ATMI, Intermolecular 

The immersion lithography has been critical to the 

continued performance improvements of semiconductor 

devices as well as to the overall economics of the semiconductor 

industry because it offers both a technical solution 

to meeting the minimum resolution for the shrinking 

critical dimension in a device and a cost-effective 

approach to continue using large amounts of the existing 

lithographic tooling infrastructure and patterning materials. 

However in order to achieve similar defectivity 

levels as compared to dry lithography, enormous efforts 

have to be put on identifying, classifying, determining the 

root cause of various defects associated with immersion 

lithography, and eventually addressing the defectivity issues 

without affecting the high process yields. An efficient 

in-line cleaning of the immersion hood periodically is a 

part of the strategy to maintain the low defectivity level 

in semiconductor industry. With the aid of combinatorial 

screening tools, we developed novel, low odor, and environmentally 

benign formulations for a time and cost effective 

in-line cleaning method of the immersion hood. 

10:00 am-3:15 pm 

PV/Solar Manufacturing EHS 

Sonora C 

10:00 am SF6 Massive-Scale Decomposition Technology 

and Clean Development Mechanism Project 

in TFT-LCD Industry, South Korea 

Choi, J; KDIA 

South Korean LCD industry has been investing new 

generation LCD fab since early 2000s, thus it has the line 

up from 2nd generation to 8th generation of LCD fab. As 

production expanded, greenhouse gas emission also has 

been increased. Within the greenhouse gas, SF6 gas is the 

major gas, which is used as an etching agent in dry etching 

process and its global warming potential is over 20,000 

times higher than CO2. SF6 abatement technology was 

already developed, which can treat about 1 cubic meter 

of exhaust per minute. However, as the LCD generation 

increasing, the amount of process exhaust has been increasing 

sharply. In this circumstance, to abate SF6 gas, 

several small-scaled abatements should be installed in 

point-of-use (POU), i.e. right after each process chamber 

of dry etchers. Thus, there are two major problems for SF6

abatement; firstly, decomposition efficiency is difficult to 

be verified, secondly, huge area is needed to install enormous 

POU type scrubbers. To solve these obstacles, Korean 

LCD industry has started to develop a massive-scale 

decomposition facility by itself since 2005. However, the 

technology development was quite risky, because of 3 reasons 

as bellows; 1) Static pressure in dry etchers should be 

secured. 2) Various acidic and corrosive substances from 

dry etching processes should be treated before SF6 gas decomposing 

unit. 3) In SF6 gas decomposing unit, SF6 gas 

should be destructed more than 90% steadily. 4) HF and 

other by-products, which comes from SF6 gas decomposing, 

should be treated after SF6 gas decomposing unit. 

In order to hedge these risks, Korean LCD industry utilized 

CDM projects, for hiring enhanced technology and 

funding investment. As a result of various actions, new 

CDM methodology approved as AM0078 by UNFCCC 

in February 2009, the massive-scale decomposition facilities 

were developed and installed in 2009, and finally 

SF6 decomposition in LCD industry CDM projects were 

registered in UNFCCC. The developed facilities are able 

to decompose more than 90% of SF6 gas steadily and the 

capacity is 40 times larger than conventional abatement 

facility. 

10:45 am Photovoltaic Industry-An Overview of 

EHS Considerations-from Manufacturing to Feeding 

the Utility Grid 

Cyrs, W, Krause, K, McIntyre, A*; Environmental & 

Occupational Risk Management, Inc. (EORM) 

Gallium arsenide (Ga-As) thin film photovoltaic 

(PV) cells have shown promise for large-scale commercial 

production, with conversion efficiencies reaching as 

high as 40.7% using concentrators. Objective: The purpose 

of this study is to present an analysis of the human 

health risks throughout the life cycle of a Ga-As thin film 

PV cell. Methods: A comprehensive analysis of the literature 

was performed, with critical points of human health 

risk identified throughout the lifecycle of Ga-As thin film 1:45 pm Sustainable Energy Solutions Through 

PV cells. In addition, process information for the obtainment 

Product Life Cycle Management 

of raw materials, manufacture of PV cells, module Sinha, P (Ricky); First Solar 

assembly, installation, and commercial deployment were At least 89% of the emissions associated with electricity 

analyzed in order to further refine the risk characterization 

generation could be prevented if electricity from 

by describing exposure potential to hazardous substances. photovoltaics (PV) displaces electricity from the grid. 

Where data was unavailable for Ga-As-based PV cells, (Fthenakis, et al., 2008). The development and implementation 

available information from other thin film PV cell types 

of such renewable energy technologies are critical 

was applied. Results: The manufacture of PV cells is a key to helping achieve a low-carbon economy. However, to 

point of risk during the life cycle of Ga-As thin film PV ensure the long-term sustainability of the solar industry, 

cells, due to the use of process chemicals such as highly it is critical that environmental impacts be addressed at 

toxic metal hydride gases (e.g., arsine) and pyrophoric all stages of the product’s life cycle – from raw material 

metal-organics (e.g., trimethyl indium) as feedstock mate- 

sourcing, manufacturing, installation, operation and 

16 

rials. On the other hand, the incorporation of PV cells into 

modules provides little opportunity for exposure; thus risk 

becomes minimal. In this study, measures used to control 

exposure to potentially hazardous materials are discussed, 

with a focus on engineering controls. Conclusions: From 

this assessment, it is clear that although unique occupational 

hazards exist for the different life stages of Ga-As 

thin film PV cells, experience from the development of 

other PV cell types, as well as a precautionary approach, 

are being used to minimize the associated risks. The results 

of this study provide data necessary for regulatory 

compliance with a number of international regulations 

such as REACH and companion product safety requirements. 


1:00 pm How to Improve the LED ESH Issues 

and GHG Emission Reduction in Taiwan 

Cheng, J-H, Lu, J, Peng, Y-C; ITRI 

LED light bulbs are also part of the solution to the 

energy crisis we are facing. LED light bulbs use less power 

up front and generate less heat. Replacing all of lighting 

with LED lighting will suddenly reduce electrical usage 

and also reduce CO2 emissions from power plants. Because 

LED lights are very efficient when compared to other 

lighting products. It is a good choice for energy saving 

and reducing climate change. It is why this industry grows 

up quickly in the past decade in the world. LED manufacture 

is similar to the semiconductor industry; they use a lot 

of chemical and energy. LED Fab emitting air pollutant, 

producing waste, make waste water and toxic substance 

etc. These pollutants and GHG emission is different from 

semiconductor industry. Taiwan LED industry association 

is the only LED industry organization in the world. This 

association set a ESH committee and supported by ITRI. 

This article will show that the information of GHG emission 

and how to improve the ESH issues in LED industry.

end-of-life disposal and recycling. This presentation will 

provide insight and lessons learned from First Solar’s life 

cycle management approach and it’s leading-edge efforts 

to implement a comprehensive environmental plan. Given 

the significant growth of the CdTe PV technology and its 

rapid deployment in the field it is critical that environmental 

impact data continue to be collected, analyzed, made 

public, and updated. In this presentation First Solar will 

provide an overview of its experiences and best practices 

in developing large-scale PV projects, including detailing 

the benefits and impacts of utility-scale PV projects 

on a life cycle basis. By the end of 2010, a total of more 

than 30GW of PV capacity will have been installed worldwide, 

and what happens to these products at the end of 

their useful life needs to be addressed. With a commitment 

to extended producer responsibility, First Solar, a leading 

manufacturer and developer of large scale projects, has 

implemented a comprehensive pre-funded module collection 

and recycling program. This presentation will provide 

details on how the overall program is designed to be convenient, 

unconditional, and free. First Solar will also share 

updated information on the recycling technology it has 

developed and implemented on a commercial scale ensuring 

that substantially all module components (by mass) 

are recovered for reuse in new solar modules or new glass 

products. By offering a collection and recycling program, 

the largest CdTe PV manufacturer is proving today that it 

is possible to manage waste concerns for the future while 

creating truly sustainable energy solutions today. 

2:30 pm GHG Reporting for the Electronics Industry 

- Determination of Reporting Applicability 

Cotter, D; Capaccio Environmental Engineering, Inc. 

Mr. Cotter will present a review of the U.S. EPA’s 

recently promulgated greenhouse gas (GHG) reporting 

rule for the electronics manufacturing industry (40 CFR 

Part 98, Subpart I). The presentation will include a review 

of the rule’s applicability criteria and how to use 

the equations in the regulation to determine applicability. 

The presentation will also discuss the rule’s requirements 

for monitoring, reporting, and record keeping, 

including the requirement to develop a written GHG 

monitoring plan by April 1, 2011. 


17 

3:45-5:15 pm 

Disaster Preparedness Roundtable 

Sonora C 

3:45 pm Losses in the Semiconductor Industry – 

Case Studies and Lessons Learned 

Acorn , W; Acorn Consulting Services, LLC 

The author will discuss several large losses incurred 

by semiconductor and similar advanced manufacturing 

clients that resulted not only in business interruption, 

but significant out-of-pocket expenses. Case 

studies will address: 1. Fire in wafer fab – catastrophic 

losses, business interruption, lengthy litigation 2. 

Fire in flat panel display manufacturing facility - catastrophic 

losses, business interruption, lengthy litigation 

3. Chemical leak in wafer fab - catastrophic losses, business 

interruption, lengthy litigation 4. Alleged unsafe 

environments in wafer fabs result in employee claims 

and protracted lawsuits The author will address the impact 

of these cases not only from business interruption, 

but distraction of the owners’ employees from more productive 

endeavors. 

10:00 am-3:15 pm 

Abatement Strategies 

Sonora D 

10:00 am Point-of-Use Ammonium Compounds 

Removal - Keeping Exhaust Emission Clear 

Tsou, A, Chen, C-H, Hsiao, H-C; United Microelectronic 

Corp. (Singapore Branch), Singapore 

Hsuan-Chien Hsiao is with the United Microelectronic 

Corp. (Singapore Branch), No. 03, Pasir Ris Dr 

12, Singapore (Paul_Hsiao@umc.com) Chi-Hua Chen 

is with the United Microelectronic Corp. (Singapore 

Branch), No. 03, Pasir Ris Dr 12, Singapore Po-Wen Wu 

is with the United Microelectronic Corp., No. 3, Li-Hsin 

2nd Road, Hsinchu Science Park, Hsinchu, Taiwan 300, 

R.O.C. H-R Lai is with the United Microelectronic Corp., 

No. 3, Li-Hsin 2nd Road, Hsinchu Science Park, Hsinchu, 

Taiwan 300, R.O.C. Abstract – Many wafer fabs face the 

challenge of managing effluent generated from compound 

semiconductor process-specific and that includes ensuring 

Point-of-use (POU) abatement devices meets the required 

or desired performance. For POU abatement systems, we 

usually focus on the main electric/fuel oxidation abatement 

mechanism but not on wet scrubbing section. It was 

found that poor abatement efficiencies of wet scrubbing 

could lead to environmental issues such as generation of 

fine particle at the stack and corrosion of exhaust duct.

Those fine particles from exhaust duct is made of unabated 

completely ammonia (NH3) and hydrogen fluoride (HF) 

combination . We evaluated the NH3 and HF abatement 

efficiency in two major types of POU abatement systems 

by comparing fluoride ion concentration and pH in the 

water supply tank. Based on the study, water quality and 

pH affect the abatement efficiency of water-soluble gases 

significantly, especially for tools that are running high nitrite 

or chamber clean recipes. By introducing fresh water 

supply method and optimized pH adjustment on the wet 

scrubber sections, we are able to improve POU abatement 

efficiency significantly and eliminate the environmental 

issue of fine particles generation at the stacks. 

10:45 am The Cooperation to Reduce SF6 Emission 

between the Electricity and Magnesium Industries 

Lu, J; ITRI 

The bulk of Taiwan’s SF6 emissions come from the 

optoelectronics, semiconductor, power generation, and 

magnesium industries. Since the EPA signed SF6 voluntary 

reduction memorandums with Taiwan’s optoelectronics 

and semiconductor industry associations there 

has been an estimated reduction in emissions in carbon 

dioxide equivalent (CO2e) of24 million tonnes. As for 

the electricity generation industry, their emissions of 

SF6 come mainly from leakages arising from the insulation 

of high-voltage facilities. As a result, since 2006 

the EPA has been actively promoting the recycling of 

SF6 from the electricity generation industry and in 2009 

completed R&D into purification and reuse technology 

for this type of SF6. Testing has shown that when the 

water and impurities are removed and the waste SF6 is 

purified in the correct manner then it can be used directly 

by the magnesium industry, which is of great benefit 

in reducing Taiwan’s emissions of this greenhouse gas. 

This article will introduce how to reduce SF6 cooperation 

between the electricity and Magnesium industries 

of Fluorinated Greenhouse Gas Abatement Equipment in 

Electronics Manufacturing”, several variations to portions 

of this methodology have been found to be reliable and 

cost-effective and will also be discussed. Results and lessons 

learned from a particular study involving a through 

silicon via (TSV) tool process coupled to a burn/wet POU 

abatement system will be covered as well as other challenges 

faced during this type of testing. 

1:45 pm DRE Measurement of POU Scrubber 

through Applying the Dilution Factor of PFCs 

Oh, CH, Ko, SJ, Jeong, YY; ESH R&D Center, Hynix 

Semiconductor Inc, Japan 

The Korean semiconductor industry makes progress 

various PFCs (Perfluorocompounds) reduction activities 

such as optimizing processes, switching to alternative 

gases and installing abatement system. Study on 

correct measurement of PFCs emission is also followed 

at the same time. This study was performed as first assignment 

to evaluate NF3 gas in Hynix semiconductor. 

We measured DRE (Destruction Removal Efficiency) 

on-site of NF3 gas from POU (Point of Use) scrubber 

through applying the EPA (Environmental Protection 

Agency) protocol (EPA 430-R-10-003, 2010). We applied 

method 2b which keeps process variables “unaffected” 

and drives measurement normally. It is applied 

to measure plasma-wet type POU scrubber. We used 

two FT-IR (Fourier Transform Infrared), a QMS (Quadrupole 

Mass Spectrometer) for measurement and measured 

the gas flow and DRE with He gas as a tracer. 

DRE of NF3 gas from two chambers of CVD (Chemical 

Vapor Deposition) cleaning process was measured and 

the results showed more than 90% efficiency and less 

than 5% relative error as well. Based on this study results, 

we will proceed to calculate the exact GHG emission 

with continuous carrying out DRE measurement of 

another PFCs such as CF4, C2F6 and C3F8. Key Words 

: PFCs, DRE, POU Scrubber, Plasma-Wet, FT-IR 

11:30 am Cash & Carry Lunch, Exhibit Hall 2:30 pm Comparison Study of Fourier Transform 

Infrared (FTIR) and Quadrupole Mass Spectroscopy 

(QMS) for Point-of-Use (POU) Abatement 

1:00 pm Lessons Learned from Measuring Destruction 

or Removal Efficiencies (DRE) of Fluorinated 

Greenhouse Gases Across Point-of-Use Abate- 

System Effluent Flow Determination 

Hall, SE, Benaway, B; URS Corporation 

ment Devices 

The recently published “Environmental Protection 

Benaway, BJ, Hall, SE; URS Corporation 

Agency (EPA) Protocol for Measuring Destruction or 

This presentation discusses the various lessons 

Removal Efficiency (DRE) of Fluorinated Greenhouse 

learned and challenges faced for properly measuring 

Gas Abatement Equipment in Electronics Manufacturing, 

Version 1”, March 2010 (EPA Protocol) requires 

DRE for fluorinated greenhouse gases across various 

POU abatement devices. Although emphasis is for performing 

these studies in accordance to the EPA “Protocol 

the use of quadrupole mass spectroscopy (QMS) for determination 

of the total volumetric flow (TVF) of POU 

for Measuring Destruction or Removal Efficiency (DRE) 

18

abatement device effluents. This study directly compares 

an alternative approach using Fourier transform infrared 

(FTIR) spectroscopy to the required QMS method. 

Since the EPA Protocol also requires usage of FTIR for 

emissions characterization, its use for flow determination 

will provide significant cost savings. A study was 

performed by URS Corporation in conjunction with International 

SEMATECH Manufacturing Initiative and 

Sherer Consulting Services where three POU abatement 

systems were tested during normal operation. Two of 

the POU abatement systems were fuel-based thermal 

oxidation/wet scrubbing systems (burn/wet) and one 

POU abatement system was an electric heat oxidation/ 

wet scrubbing system (electric heat/wet). Determination 

of TVF by QMS was performed in strict accordance 

to EPA Protocol and the FTIR determination of TVF 

strictly followed the pertinent sections of the 2009 ISMI 

Guideline for Environmental Characterization of Semiconductor 

Process Equipment – Revision 2 (2009 ISMI 

Guideline). 

Thursday 

8:30-9:30 am 

Keynote 

Sonora A/B/C 

8:30 am Towards Harmonization of Measuring 

and Reporting Product Sustainability 

Dooley, Kevin; ASU 

9:30 am Break, Sonora Foyer 

10:00-11:30 am 

CSR 

Sonora A 

10:00 am Leveraging Existing Semi Guidelines 

to Drive Leading-Edge Supplier Environmental, 

Health, Safety and Sustainability Programs 

Firu, D, McIntyre, A, Sternberg, R; TSMC, EORM 

By utilizing existing SEMI environmental and 

safety standards, EHS professionals can work with 

their sustainability and corporate social responsibility 

counterparts to add scientific basis and depth to corporate 

supplier responsibility programs. Implications are 

that newer industries, such as Photovoltaic (PV) manufacturing, 

can leapfrog the amount of time it took the 

semiconductor industry to establish industry standards 

for manufacturing equipment and labor suppliers. Additionally, 

EHS professionals in all industries can bring 

significant value to their companies’ sustainability programs 

and drive cost and risk reduction in the business. 

Example approaches will focus on the PV industry but 

will be broadly applicable to any emerging process intensive 

market area. Speakers: Speakers will include 

EORM’s Andy McIntyre, CIH and Managing Principal 

and Rebecca Sternberg, Sustainability Practice Lead. 

10:45 am Building Information Modeling: A Process 

to Mitigate Risk, Improve Project Delivery, and 

Integrate Sustainability into Semiconductor Facilities 

Chasey, A; Arizona State University 

Building Information Modeling (BIM) is an approach 

gaining traction in the architect, engineer and 

construction (AEC) industry. BIM combines the ability 

to construct a virtual model with all aspects of a facility, 

from design (space planning) to construction (cost and 

scheduling) to operations and maintenance (planning 

and asset management). BIM is also a process as well as 

a project. Even though the technology for implementation 

of BIM will change, and probably change rapidly, 

the process and underlying concepts will likely change 

very little. BIM directly relates to a project team’s ability 

for Visualization, Understanding, Communication, 

and Collaboration: Visualization to “see” the project, 

Understanding to know the project elements, Communications 

to ensure the understanding, and Collaboration 

to receive all the necessary input at the proper time. BIM 

requires openness amongst the team players for sharing 

information supporting the goals of the project. Building 

Information Modeling (BIM) has become a valuable 

tool in many sectors of the capital facilities industry. The 

fundamental characteristic of BIM is its development 

through an information feedback loop. The development 

of the visual model and the relevant project information 

is iterative in nature as different project team members 

develop the project. During the course of a project, the 

information gradually increases in scope, depth, and relationship 

to the project. This presentation will focus on 

the benefits of BIM and how this process can be used 

to mitigate risk and improve project delivery for both 

new facilities and upgrades, introduce sustainability efforts 

and determine impacts during both construction 

and operations. The reduction of risk and value-added 

sustainability comes through improved understanding, 

coordination, and material use in the management of the 

project as well as reduced conflicts, waste, and cost. We 

will introduce the concept of Intelligent Tool Models 

and Intelligent Fab Models. 

19

11:30 am Lunch on your Own 

1:00-3:15 pm 

Energy Conservation 

Sonora A 

1:00 pm Practical Application of SEMI S23 

Evanston, C; Salus Engineering International 

This presentation will cover the practical use of 

SEMI S23, “The guide for conservation of energy, utilities, 

and materials used by semiconductor manufacturing 

equipment.” It will start by covering state of the art 

measurement techniques for key utilities required to be 

measured by SEMI S23: three phase electrical energy 

measurements, intrusive and non-intrusive N2 and CDA 

measurements, exhaust measurements, non-intrusive 

cooling and DI water measurements. Next, the use of 

this raw data to calculate overall equipment energy 

consumption will be explained. Finally, the SEMI S23 

requirement for developing an improvement road map 

will be discussed, along with the ultimate confirmation 

of reduction by a second set of measurements on equipment 

modified to reduce energy consumption. All of this 

information will be put in the context of where the semiconductor 

industry is at with regard to implementation 

of these requirements, and where it may be going in the 

future. 

1:45 pm Energy Savings by Air Coil Efficiency 

Improvement 

Deschenes, S, Bernard, R, Galbreath, LG; Nalco Company 

Energy savings by air coil efficiency improvement 

Stephen Deschenes, Ron Bernard, Gregg Galbreath, 

Brian Jenkins, Nalco Company The primary heat transfer 

surfaces between the air inside a fab (semiconductor 

fabrication facility) and the HVAC (heating, ventilation 

and air conditioning) system are the air cooling 

and heating coils. Consistent climate control is critical 

to a fab’s reliable manufacturing environment. Air cooling 

coils are also a large consumer of fab electrical & 

fossil energy; yet often times, these systems’ cleanliness 

receives a lower priority due to competing maintenance 

tasks, or, the tools available to clean the systems are not 

effective. Most major semiconductor companies have 

goals for continuous improvement in energy operations. 

In the example cited in this presentation, a large semiconductor 

manufacturer, seeing the potential savings 

opportunity, worked with Nalco to implement an HVAC 

Performance Improvement program. Working together, 

Nalco and the fab obtained baseline data, and then 

20 

Nalco cleaned and disinfected the air handler coils and 

associated drain pans. After the work was completed, 

performance measurements were taken to validate the 

efficiency improvements in the HVAC systems. The average 

heat transfer efficiency improvement was 11.5%, 

and the fan energy saved was 194.8 amps enabling the 

fab to pay for all of the program costs via reduced energy 

costs in just over 13 months. Associated with improvements 

in heat transfer, chilled water & heating water 

flow requirements to the air coils were also reduced. 

The paper discusses a range of cleaning methods, and 

reviews in detail the approach used by Nalco at the fab. 

Fan energy data as well as details on thermal energy savings 

calculations are also presented. Future savings potential 

is discussed, as well. 

2:30 pm Save Energy and Reduction of Greenhouse 

Gas by Energy Recovery System 

Jeong, YT, Park, JB, Lee, MH, Jeong, YY; Hynix Semiconductor 

Inc., Korea 

In 2010, Hynix Semiconductor introduced Energy 

Recovery System to save Energy and reduce Emission of 

Greenhouse gases. Usually industrial water temperature 

for Semiconductor Manufacturing is at least 21 degrees 

but law water temperature was only 4 degrees in winter. 

So we had to raise the law water temperature by steam 

boiler before using water. On the other hand, discharge 

water temperature was about 25 degrees all the time. So 

local residents had experienced inconvenience because 

of fog in winter. Energy Recovery System uses thermal 

energy of discharge water to heat up law water until 21 

degrees by heat exchanger. By introducing Energy Saving 

System Hynix Semiconductor has saved 76,000 ton 

of steam in one year (equivalent 12% of total steam usage) 

and reduced 18,000 ton of CO2 emission. (equivalent 

4300 pine trees absorb in one year.) Also fog was 

disappeared in winter season. This presentation includes 

quantitative/qualitative analysis of economic effects of 

saving energy and decrease in CO2 emission by introducing 

Energy Recovery System. Also important matters 

should be considered before introducing this system 

are specified. Many companies feel the need to reduce 

greenhouse gases but they hesitate aggressive Activities 

because of huge investment cost compared to small economic 

benefits. We think our Energy Recovery System 

could be a good case shows that efforts to reduce greenhouse 

gases make economic benefits and save earth. 

3:15 pm Break, Sonora Foyer

10:00 am-3:15 pm 

Risk Management 

Sonora B 

10:00 am Safety of Personnel Working Near Track 

for “Overhead Transportion Vehicle” 

Ibuka, S; Tokyo Electron Limited, Tokyo Japan 

Recently unmanned transportion vehicle systams 

running overhead (OHV:overhead transportion vehicle) 

are often used in almost 300mm wafer IC fabrication 

plants. On the other hand, height of equipment becomes 

higer and higher. Personnel has to work upperside of 

the equipment such as a furnace, wet station or coaterdeveloper. 

OHV is running near the personnel. How 

to protect the personnel not to crush into the OHV is 

very high concern. Recent updated SEMI S17 is one approach 

for vehicle safety design. At the last bSEMICON 

Japan, a workshop to share concerns of facts, and to discuss 

ideas to improve the situation among industry people. 

SEMI Japan and SEAJ is collaborating to plan next 

workshop. I would like to introduce Japanese activities 

for the subjects and know global audience suggestions 

for our approach hereafter. 

10:45 am Integrated e-ESH System 

Hsu, F-M; Hsinchu, Taiwan 

Integrated e-ESH System Fang-Ming Hsu Deputy 

Director, Risk Management and Corporate ESH Division 

Taiwan Semiconductor Manufacturing Company, 

Ltd. Chair, ESH Committee, SIA in Chinese Taipei ESH 

management in semiconductor industry is essential but 

very complex. In order to make it effective, experts 

may have to spend quite long time, maybe for years, 

for trial and error. And, after semiconductor companies 

with its daily management have both become mature, 

people often find they have lots of, or too many, ESH 

sub-systems in place, and some of those sub-systems are 

even overlapping with others. Therefore, it’s time for the 

companies to enhance their systems’ efficiency. A way 

of enhancing ESH management efficiency is computerizing 

and integrating all ESH management systems. Finally, 

an integrated e-ESH system can benefit the company 

not only with enhanced management effectiveness 

and efficiency, but also reduced cost and mitigated risks. 

TSMC has adopted PDCA cycles into this system and 

will share its experiences at this session. 


1:00 pm Safety Analytics: The Future of Workforce 

Safety and Health 

Hohn, T, Duden, D; PureSafety 

What Is Safety Analytics? Safety analytics is an 

emerging science that is helping to drive improvements 

not only in workforce safety and health programs, but 

also in overall business performance. Deloitte Consulting, 

a leading practitioner in this field, defines safety 

analytics as “the science of studying the underlying 

causes of and contributing factors to workplace accidents.” 

On the surface, that may sound similar to what 

top workforce safety and health professionals have done 

all along. But what’s new — facilitated by software 

tools and systems like PureSafety’s — is the amount and 

range of data that can be analyzed. For example, part of 

what distinguishes safety analytics from past practices is 

the use of external data (demographics, lifestyle indicators, 

industry financial data, etc.), as well as traditional 

historical and observed data. Among other benefits, this 

approach helps to ensure that human variables are appropriately 

weighted in identifying risk and taking appropriate 

preventive actions. Combined with the growing 

use of leading indicators, leveraging safety analytics 

gives you a more complete, and more current, picture of 

everything from specific work processes and locations 

up to the health of your safety culture in general. This, 

in turn, leads to a more targeted, proactive allocation of 

available resources and opens the path to continuous improvement 

in critical areas, including: • Workplace accidents 

and injuries • Compliance • Productivity • ROI 

on safety expenditures • Employee satisfaction, morale, 

loyalty and retention • Absenteeism • Product/material 

damage • Managerial efficiency and effectiveness • Corporate 

reputation 

1:45 pm Surface Contamination of Dummy Wafer 

and its Health Effect in Semiconductor Manufacturing 

Industry 

Choi, K; Samsung Electronics Co. LTD 

Dummy wafer has been effectively used to monitoring 

of equipment and process in semiconductor 

manufacturing industry. However, it has been predicted 

human health impacts by hazardous by-products which 

could be generated on the wafer surface by chemical 

reaction of various precursors such as toxic gases and 

chemicals. Although there has been much attention on 

the issue, it has not been studied yet. In this study, therefore, 

we have explored the surface contamination of the 

dummy wafers which have been used in semiconductor 

processes by quantitative and qualitative analysis meth- 

21

ods. From the results of the organic contamination analysis 

of the dummy wafers at room temperature, it could 

not be confirmed some specific compounds, except that 

a few components such as toluene and siloxane were 

detected less than 1 ppbv. Further, we also found that ion 

(NH4+, F-, NO2- etc.) and metal contaminations (Al, 

Si etc.) of the dummy wafer surface are similar to those 

of blank(i.e., bare wafer), whereas it was detected ca. 

70~90 ppb of Si on the surface of wafers used Etch and 

Diff decap process. From the TDS(50~900℃) results, 

meanwhile, the dummy wafer used only Etch process 

out-gassed CxFy, CxOy and CxHy contaminants which 

are induced by process gases such as CF4, CHF3, C3F8 

etc. However it could be mentioned that the operator’s 

exposure by the CxFy, CxOy and CxHy has little possibility 

because the dummy wafer becomes de-gassed 

and room temperature after finished process and/or 

monitoring. The present results showed that the surface 

of dummy wafer had not contained by-products which 

are hazardous to human health. The dummy wafer used 

only Etch process out-gassed CxFy, CxOy and CxHy 

contaminants which are induced by process gases such 

as CF4, CHF3, C3F8 etc. However it could be mentioned 

that the operator’s exposure by the CxFy, CxOy 

and CxHy has little possibility because the dummy wafer 

becomes de-gassed and room temperature after finished 

process and/or monitoring. 

2:30 pm Prevention Maintenance Protection and 

Hazards Exposure Control of Thermal Type Local 

Scrubber MAT 

Tsou, H-M; United Microelectronic Corp.(UMC), Taiwan, 

R.O.C. 

No matter how much effort and investment has 

been taken by a semiconductor FAB to reduce the nuisance 

odor, the problems always exist. The reasons we 

found are there is no applicable investigation equipment 

and proper methodology, furthermore, the unusual odor 

will disappear rapidly before an emergency response 

staff handles it. Therefore, it is better to take prevention 

of odor in advance than to deal with it upon it occurs. 

Prevention maintenance(PM) is one of the main 

causes of odor in FAB. This paper presents a method to 

identify the main reason for causing odor during thermal 

type local scrubber(L/S) PM and reduce its influence. A 

plan was proposed for understanding the environment 

air quality and controlling hazards exposure risk over 

PM task of MAT thermal type L/S by using Job Safety 

Observation(JSO) and measuring gases concentration 

escaped. The result we got were there were hazardous 

gases, hydrogen fluoride(HF) being produced and the 

peak concentration was high enough to reach the level 

of Threshold Level Value-Time Weight Average(TLV- 

TWA) during the survey. Therefore an improvement 

equipment, Gas Separating Mask and a standard safety 

PM procedures for L/S were developed. It had been 

proved that by using the Mask, we could protect the 

health of operators and reduce the exposure risk for over 

79.3%(as HF gas) effectively. 

3:15 pm Break, Sonora Foyer 

10:00-11:30 am 

Safety/IH 

Sonora C 

10:00 am Mitigation of Hazards Associated with 

Disilane in Semiconductor Manufacturing 

Westmoreland, D; Micron Technology 

Disilane use in semiconductor manufacturing is 

not uncommon although it represents only a small fraction 

of manufacturing process materials that contain silane. 

Manufacturing requirements which specify lower 

overall processing temperature make disilane an attractive 

alternative and it is finding a greater presence in the 

industry. From an application and safety perspective, it 

is easy to think of disilane as similar in most respects 

to silane and therefore could require similar handling 

procedures. We have experienced that the differences 

between disilane and silane are significant. Disilane usage 

requires unique consideration in system design and 

safety. Micron will share our experiences with disilane. 

We will also review the safe handling methods and system 

designs that we have developed to mitigate the potential 

hazards associated with disilane usage. 

10:45 am Electronic Industry Code of Conduct 

Viera, S; Intel 

The Electronic Industry Code of Conduct was established 

in 2004 to promote a common code of conduct 

for the electronics, and Information and Communications 

Technology (ICT) industry. EICC members participate 

on Work Groups to develop the association’s 

programs and tools. EICC members are committed to 

collaboration, and a common approach to corporate social 

responsibility (CSR) practices as they relate to the 

global ICT supply chain. EICC is also committed to collaboration 

with stakeholders to improve environmental 

and work conditions in the(ICT) industry. EICC hosts 

22

stakeholder events and solicits input from stakeholders 

for continuous improvement of the Code of Conduct. 

The Code of Conduct provides guidance in five critical 

areas of CSR performance: • Labor • Health and Safety 

• Environment • Management System • Ethics 


1:00-3:15 pm 

GHG 

Sonora C 

1:00 pm PCS PIRANHA Plasma Abatement System: 

Update of Evaluation on 300mm Etch Process 

Kopatzki, E, Guerin, J; CS Clean Systems 

Introduction by the EPA in mid 2010 of Reporting 

rules on greenhouse gases has led to a heightened level 

of interest in PFC reduction within the semiconductor 

and related industries. In view of the limited number of 

practical options available to the typical semiconductor 

manufacturing facility for the curtailment of CO2 equivalent 

emissions, PFC abatement offers a convenient 

route to more environmentally-friendly manufacturing 

as well as compliance with present and future EPA policies. 

The PCS PIRANHA plasma conversion system 

uses a 2kW or 3kW microwave plasma to decompose 

PFC gases into reactive fluorine/ fluoride species which 

are readily removed by a downstream scrubber. The unit 

is fitted inline within the vacuum foreline between the 

etch chamber exhaust and dry roughing pump. A 2.45 

GHz microwave is generated by a magnetron and conducted 

into the exhaust gas stream. This setup ensures 

that the full microwave power is focussed on the PFC 

gases prior to dilution by the N2 ballast of the dry pump, 

allowing very high PFC destruction efficiencies to be 

achieved. This presentation will discuss the results of 

current testing carried out using a 3kW pre-pump microwave 

plasma device. The evaluation is being carried out 

in conjunction with a vendor of Etch tools using stateof-the 

art 300 mm recipes over a wide range of PFC gas 

flows and foreline pressure regimes. 

1:45 pm Guideline for GHG Emission Measurement 

and Management 

Kagino, M; Toshiba, Tokyo Japan 

JEITA thinks that we need grasp of the amount of 

emission of F-GHG in order to advance a battle against 

global warming, and the technique of the suitable and efficient 

amount grasp of F-GHG emission contributes to 

progress of the battle. The IPCC 2006 guideline requests 

that the performance is measured and checked under a 

use situation as the conditions which can use a default 

value at the abatement efficiency of F-GHG abatement 

equipment. JEITA had already exhibited the guideline 

for measurement. Since JEITA revised this extensively 

this time, I will introduce this. This guideline provides 

the efficient measuring method and the management 

method such as time and frequency of the efficient measurement 

to users of the equipment which use F-GHG. 

And it will assist users to grasp exactly the amount of 

emission of F-GHG which oneself has discharged, and 

to make plan for reduction based on these results, and to 

carry out. 

2:30 pm Global Warming Evaluation of Chamber 

Cleaning Gases by New Indicators, CEWN and 

CETN 

Sekiya, A, Okamoto, S; National Institute of Advanced 

Industrial Science and Technology (AIST), Japan 

Dealing with the global warming is still big issue 

because the Earth temperature has been rising. Semiconductor 

and liquid crystal industries have been used longlived 

fully fluorinated compounds that have high global 

warming effects. The long-term evaluation of global 

warming caused by the use of these gases has to be paid 

much more attentions. On the other hand, evaluation 

metric is quite important to get scientifically reliable 

results. In this paper, using LCCP (Life Cycle Climate 

Performance) data of our previous work, CVD chamber 

cleaning gases are evaluated by new global warming indicators, 

CEWN1) (Carbon Dioxide Equivalent Warming 

Number), CETN2) -(Carbon Dioxide Equivalent 

Temperature Change Number), and s-CETN2) (square- 

Carbon Dioxide Equivalent Temperature Change Number 

). CEWN evaluates based on radiative forcing as 

GWP3). CETN and s-CETN are based on the global 

surface temperature rise by Shine’s equation4). CEWN 

and CETN compare GHGs by unifying the removal rate 

of each gas from the atmosphere, while s-CETN unifies 

the ratio to the total amount of the global warming of 

each gas. They provide fair index of global warming to 

each GHG. LCCP data is analyzed using GWP, CEWN, 

CETN, and s-CETN and compared. Results show that 

CEWN, CETN, and s-CETN are as easy-to-use as GWP. 

Further, the relation of CEWN, CETN, s-CETN values 

with the climate impact is clearer than that of GWP 

values. According to those new indicators, the order of 

global warming is C2F6 > C3F8 > NF3>> COF2. In 

the case where 16% 5) of NF3 production releases into 

23

atmosphere, the global warming of NF3 is comparable 

with C3F8. The paper includes: a) the explanation about 

CEWN, CETN, and s-CETN. b) the LCCP results of 

global warming analyses by various indicators, such as 

CEWN, CETN, s-CETN, GWP, and so on. Literature: 

1) A. Sekiya, and S. Okamoto, J. Fluorine Chem., 131 

(2010) 364-368. 2) A. Sekiya, and S. Okamoto, 20th 

Winter Fluorine Conference, St. Pete Beach, FL, Jan. 

9-15, 2011. 3) IPCC Climate Change 2007. 4) Shine, et 

al., Clim. Change, 68, (2005), 281-302. 5) R. F. Weiss, 

et al., Geophys. Res. Lett., 35 (2008) L20821. 

3:15 pm Break, Sonora Foyer 

3:45-5:00 pm 

Closing Ceremony & 

Prize Drawing 

Sonora A/B/C 

24

William R. Acorn, PE, FASHRAE 

William Acorn is Founder and Principal of Acorn 

Consulting Services, LLC. For over 35 years, he has 

provided innovative analysis, engineering consultation 

and project design and delivery services for hundreds of 

projects ranging from institutional laboratories to cleanroom 

facilities for the semiconductor industry. During 

his more than 20 year tenure as founder and principal of 

a multi-office, multi-disciplined design firm providing 

engineering services on projects throughout the country, 

he developed successful techniques for evaluating and 

solving the most complex of project design and management 

issues. He received numerous awards for technical 

excellence and has been recognized for ongoing technical 

achievements, innovation and foresight by peers, 

associates and clients, including election to the level of 

Fellow in the industry-leading organization ASHRAE. 

His consulting expertise has been influential in shaping 

the approach to code compliance and life safety in semiconductor 

and similar advanced technology facilities. 

Bryan J Benaway 

Bryan is currently a senior scientist in the FTIR 

group at URS Corporation. His primary focus is in application 

of optical systems for gas-phase measurements 

in support of environmental testing. Bryan earned a MS 

in Physics from the University of Texas where he used 

molecular beam techniques to study rare gas clusters. 

Allan D. Chasey 

Dr. Allan D. Chasey is an associate professor in the 

Del E. Webb School of Construction, at Arizona State 

University. He is the Director of CREATE, Construction 

Research and Education for Advanced Technology 

Environments, a research and education consortium representing 

advanced technology design and construction 

industry. Dr. Chasey is a registered Professional Engineer 

in Arizona and a LEED AP. 

Chi-Hua Chen 

Safety manager ESH Department, experienced in 

semiconductor process-specific and abatement performance 

study. 

Tianniu Chen 

Tianniu Chen received his PhD in Organometallic/ 

Materials Chemistry from the University of Tennesse 

(Knoxville), where he studied chemistry of high-oxidation-state 

groups V and VI complexes. Tianniu joined 

Advanced Technology Materials, Inc. (ATMI) in 2002 

Speaker Biographies 

25 

and started as a principle investigator on discovering 

and developing novel deposition materials surrounding 

copper-based advanced interconnects for both logic and 

memory applications in semiconductor industry. Tianniu 

currently holds the position of senior technologist 

at ATMI where he is leading the efforts on developing 

novel cleaning formulations in wet-processes for both 

semiconductor and photovoltaic applications. Tianniu 

has authored twelve issued patents, thirty-four peerreviewed 

publications and twenty-six conference proceedings/presentations. 

Ju-Hsiu Cheng 

Ju Hsiu Cheng have been working at Industrial 

Technology Research Institute about 4 years Ms.Cheng 

attended many project on environmental management, 

including Montreal and Kyoto Protocol on international 

environmental issue, abatement of PFCs、HFCs 

and SF6 , cleaner production etc. Now, she is a consultant 

of the Taiwan Semiconductor Industrial Association 

, Taiwan photo electronic industry association and Taiwan 

TFT-LCD association. She is response to execute 

the three association Environment Safety and Health 

committee work. 

Cheng Ching-Lung 

My name is Andy. I am graduated from National 

C.K. University in Taiwan and majored in Environmental 

Engineering. I work at Powerchip Technology Corp 

in Taiwan, and we manufacture DRAM. I do this job 

since 2002, and my job function is environmental protection 

and ISO14001 management system. The working 

area are including air pollution control, water pollution 

control, and solid waste management. 

Junghyun Choi 

He has worked for KDIA(Korea Display Industry 

Association) since 1999. 

Kwangmin Choi 

Jeremy Cook 

Jeremy Cook is an experienced environmental 

manager with a focus in air and water resources, risk 

management and sustainability. He is currently Principal 

Consultant with EORM. In this role, he consults with 

organizations on sustainability strategy, environmental 

management, air and water resource management and 

product lifecycle issues. His past experience includes 

serving as Managing Director of Ecovine Solutions and 

Project Management roles with Parsons and CH2M

Hill. Jeremy has worked on high profile environmental 

projects on behalf of clients such as US EPA, NASA, 

USAF and private sector clients in the technology, aerospace, 

energy and agricultural sectors. Jeremy holds a 

BS in Geology from Louisiana State University and is 

currently enrolled in Presidio Graduate School’s MBA 

in Sustainable Management Program. 

David M. Cotter, PE 

Mr. Cotter is the Engineering Group Manager at 

Capaccio Environmental Engineering Inc. and has over 

twenty years experience as an environmental consultant. 

His specialty is air quality and he has extensive experience 

in ambient monitoring, source testing, air pollution 

control design, dispersion modeling, auditing, and 

permitting. David has a B.S. Degree in Mechanical Engineering 

from Wentworth Institute of Technology and 

is an active member of the Air and Waste Management 

Association. 

Brett Jay Davis, PE 

Brett Davis is currently a Project Engineer and 

Manager for Zephyr Environmental Corporation in 

Austin. Before entering the consulting profession, Brett 

provided EHS consulting and project management support 

for Motorola Semiconductor Products Sector sites 

worldwide. Brett’s current professional interests include 

process and electrical hazards risk management and air 

emissions issues, including air permitting, ozone precursor 

emissions reduction and climate change business 

planning. Brett earned a B.S. in Chemical Engineering 

from the University of Texas at Austin and an M.S. in 

Hazardous Waste Management from National Technological 

University, now Walden University. He has been 

a registered professional engineer in Texas since 1991. 

Kathleen DiZio 

Kathleen DiZio, MA, DABT, is a senior toxicologist 

in IBM’s Toxicology and Chemical Management 

group. She has served as the process toxicology team 

lead in IBM for more than 20 years. 

Chris Evanston 

Chris Evanston, PE Registered Electrical PE, California 

Employment History, (7/09-Present) President, 

Salus Engineering International Salus provides SEMI 

S2 and related services to the largest semiconductor 

equipment manufacturers in the US, Pacific Rim, and 

Europe, (11/97 - 7/09) Managing Director, Earth Tech 

Microelectronics This was the predecessor organization 

to Salus Engineering (8/92 , 11/97) Semiconductor 

Product Safety Engineer - Conducting reviews and providing 

expertise on SEMI S2 and related standards for 

SGS, Lam Research, and ITS Education, BS, Electrical 

Engineering, University of Colorado, MA, University 

of Colorado, BS, Illinois State University Professional 

Memberships, SEMI NA EH&S Committee Co-Chair, 

SEMI Co-Chair Electrical Safety Task Force IEC TC44 

US TAG Training Experience Have conducted training 

on SEMI S2 and related standards in US, Europe, and 

throughout Asia (Japan, Taiwan, Korea, China, Singapore, 

Malaysia, Philippines, and Thailand). 

Mark Fessler 

Mark received his Bachelor’s and Master’s degree 

in Mechanical Engineering and has worked for over 

18 years as an engineer in the semiconductor industry. 

Mark’s background started in the area of Reliability 

Engineering and then progressed as the semiconductor 

industry expanded in the 1990’s to also include Product 

Safety Engineering. Mark has used well proven reliability 

methodologies (Risk Assessments’, Life Testing, 

FMEA and HAZOP’s) and readily incorporated them 

into the semiconductor’s Product Safety Engineering 

field. Mark’s current role has focused in supporting both 

TEL’s Japanese and US factories in product safety issues, 

especially with new R&D equipment programs. 

Tina Gilliland 

Tina Gilliland received her B.S. in Chemical Engineering 

in 1983 at the University of Arkansas. Her 

expertise is semiconductor exhaust systems abatement 

technology and emissions measurement along with air 

emission quality. Tina is licensed profession engineer 

in the state of Texas and was elected to the Texas Instruments 

Incorporated (TI) Senior Member Group Technical 

Staff in 1998. She leads the Greenhouse Gas (GHG) 

Strategy team for TI. Also, she has over 27 years experience 

in the defense and semiconductor processes, facility 

systems, and environmental air quality. Currently, 

Tina is responsible for all aspects of air quality at TI 

both locally and worldwide. 

Steven Hall 

Steven Hall is currently employed as a project manager 

and Senior Scientist at URS Corporation in Austin, 

Texas. His responsibilities include gas-phase emissions 

monitoring using various optical techniques. His work 

has been focused on emissions testing using FTIR, analysis 

and validation of FTIR data, and training others on 

the usage of the FTIR equipment and test protocols. Before 

joining URS, Steven was conducting undergraduate 

research at the University of Illinois under Dr. James 

26

Lisy. His research involved implementation of molecular 

beam techniques for the formation of alkali metal/ 

solvent clusters and probing them with a color center 

laser. Steven earned a Bachelor of Science in Chemistry 

and graduated with distinction from the University of 

Illinois Urbana-Champaign. 

Shane Harte 

Biography - Shane Harte Shane Harte is the Environment 

Safety and Health manager for the European 

Semiconductor Industry Association (EECA-ESIA) 

in Brussels, Belgium. His responsibilities there focus 

on; EU environmental legislation relevant for device 

manufacturers, product compliance and sustainability 

issues and advising companies on the impact of EU legislation. 

Mr Harte also coordinates global cooperation 

programmes as part of the European delegation to the 

World Semiconductor Council’s Environment Safety 

and Health task force. Previous to this he has worked 

as a legal adviser on EU environmental policy in the 

European Parliament in Brussels.He began his career 

working in the private sector in Ireland. Mr Harte graduated 

with a BA International from the National University 

of Ireland, Dublin.He also obtained a Masters.Econ. 

Science in European Economic Science and an M.A. in 

Public Affairs from the Dublin European Insitute, NUI. 

Tim Higgs 

Tim Higgs is an environmental engineer with Intel’s 

corporate environmental organization. He received 

his B.S. degree in chemical engineering from Michigan 

State University in 1983 and is a registered professional 

engineer (chemical) in the State of Arizona. Tim has 

been with Intel for 27 years in a variety of environmental 

positions at the site and worldwide levels, and has 

extensive experience in matters related to air permitting, 

air emissions control, energy efficiency and climate 

change. He has worked with state and local regulatory 

agencies across the U.S. as well as in other nations on air 

pollution control programs, and has frequently consulted 

with U.S. EPA on air program matters of importance 

to the semiconductor industry. 

Todd Hohn 

Mr. Hohn is Vice President of Strategic Resources 

at PureSafety. He has nearly 20 years of experience in 

safety and loss control. Prior to joining PureSafety, he 

worked with DBO2, assisting businesses in creating and 

implementing predictive modeling solutions to help prevent 

worker injuries, avoid catastrophic loss, and reduce 

liabilities. Before that he was Assistant Vice President of 

Risk Control at CNA, where he managed national prod- 

27 

ucts and services for the multi-billion-dollar Casualty 

and Commercial Segments business. He holds a B.S. in 

Safety from Illinois State University and is a graduate of 

the Advanced Executive Education Program at the University 

of Pennsylvania’s Wharton School of Business. 

He is also a frequent presenter, facilitator and speaker 

on topics ranging from management accountability to 

efficiency and productivity. 

Fang-Ming Hsu 

Mr. Hsu is the current head of RM&ESH Division 

of TSMC. Meanwhile, he chairs ESH Committee of 

Semiconductor Industrial Association in Chinese Taipei 

and co-chairs the ESH Committee of SEMI Taiwan. 

Starting from 1995, Mr. Hsu entered Semiconductor industry. 

While working for Vanguard and TSMC, his jobs 

covered technical and managerial consolidation of facilities 

and ESH. In this time period, he also chaired the 

professional committee of Science Park’s Water-Electricity-Gas 

Supply. Before 1995, he worked for industrial 

gas industry and petrochemical industry for a long 

time. In recent years, Mr. Hsu has been in charge of corporate 

social responsibility affairs in TSMC. Mitigating 

climate change, building green supply chain and carbon 

disclosure are part of fields he is closely supervising. 

Shigehito Ibuka 

Director for TEL EHS SEMI EHS Executive 

Committee member SEMI International GHG WG cochair 

SEMI ICRC Japan co-chair Taskforce co-leader 

for SEMI S13, S16, S17, S19, S23 and S24 EcoDesign 

2011 international symposium vice-chair JAMP Business 

Committee chair 

Scott Inloes 

I have a BS in Chemical Engineering from Oregon 

State. For eight years I worked for the local air agency 

inspecting, permit and managing the Title V and Air 

toxic programs. The last ten years I have working for industry 

covering various environmental issues, including 

Title V, emission testing, and new source review. 

Brian V Jenkins 

Brian has been employed by Nalco since 1978 in 

a variety of technical sales and marketing positions including 

District Sales Manager, Marketing Manager, 

and Senior Product Manager. He is currently an Industry 

Development Manager in Nalco’s Light Industrial Strategic 

Business Unit. He has published in several different 

technical forums including the American Society of 

Heating, Refrigeration and Air-Conditioning Engineers, 

Industrial Energy Technology Conference, International

District Energy Association, International Tire Exhibition 

and Conference, International Water Conference, 

National Association of Corrosion Engineers, Semiconductor 

Environmental Safety and Health Association, 

Ultra Pure Water Conference, and the Western Regional 

Boiler Association. He has a Bachelor of Science in 

Chemical Engineering from the Technological Institute 

of Northwestern University. He holds 6 US patents, and 

has 2 patents pending. 

Yong Taek Jeong 

I have been an environment engineer at Hynix 

Semiconductor for four years since 2008. As an environment 

engineer I have been in charge of air pollution 

control, Chemical management. 

Minoru Kagino 

Toshiba Semiconductor Company, Productivity 

Improvement Planning Division, Environment Planning 

Promotion Group and JEITA Semiconductor Environmental 

Committee, Administrator of Expert Committee 

on PFC 

Dr. Eckard Kopatzki 

Michael B. Korzenski 

Michael B. Korzenski received his PhD in Inorganic/Materials 

Chemistry from Clemson University 

where he studied greener reaction pathways for the 

crystal growth of novel micro-porous materials using 

Supercritical Fluids such as water and carbon dioxide. 

Michael joined Advanced Technology Materials, 

Inc. in 2001 and led their Supercritical Carbon Dioxide 

(SCCO2) program focusing on developing SCCO2 

technologies to be used as environmentally benign alternatives 

to traditional toxic solvent systems used in the 

microelectronics industry. ATMI was honored for this 

work by being awarded the Presidential Green Chemistry 

Award in 2002 in collaboration with SC Fluids, Inc. 

Michael has since served as Director of Research and 

Development for ATMI’s Surface Preparation Division 

where his teams focused on developing “greener” product 

formulations for various semiconductor cleaning applications. 

Michael currently holds the position of Director 

of Sustainable Technologies at ATMI where he is 

responsible for the coordination of ATMI’s sustainability 

activities including minimizing hazardous materials 

usage during new product development as well as developing 

external partnerships related to green initiatives to 

support ATMI’s corporate sustainability strategy. 

Curtis Laush 

Dr. Curtis Laush received a Ph.D. of Physical 

Chemistry in 1994 at the University of Illinois – Urbana/ 

Champaign. His expertise is in the optical spectroscopy 

of gases. Dr. Laush has been working the last 20 years 

on the development of FTIR, UV, chemiluminescence 

and laser-based remote sensing techniques towards the 

quantitative analyses of various environmental and process 

gas systems. His client base includes the semiconductor, 

oil, gas, petrochemical and power industries. He 

is currently a senior scientist for Industrial Monitor and 

Control Corporation (Imacc). 

Ro-Ting Lin 

Ro-Ting Lin is a senior engineer of Corporate ESH 

Department in Taiwan Semiconductor Manufacturing 

Company. She received her bachelor’s degree (BSc) in 

public health and master’s degree (MSc) in industrial 

hygiene from National Taiwan University and became 

PhD candidate in 2009. She has been working at University 

of Occupational and Environmental Health in 

Japan, conducting global asbestos researches and assessing 

ergonomic hazards among workers of Toyota 

Motor Kyushu in Japan. Now at TSMC, she is in charge 

of company-wide health-related projects and heath risk 

assessments. 

Joey (Ching-Hui) Lu 

Joey Lu have been working at Industrial Technology 

Research Institute about 19 years Mr Lu attended 

many project on environmental management, including 

Montreal and Kyoto Protocol on international environmental 

issue, abatement of PFCs、HFCs and 

SF6 , cleaner production etc. Now, he is a consultant of 

the Taiwan Semiconductor Industrial Association , Taiwan 

photo electronic industry association and Taiwan 

TFT-LCD association. He is response to execute the two 

association Environment Safety and Health committee 

work. Joey Lu is also the project leader of the Taiwan 

EPA fluorinate GHG management and Taiwan Halon 

management center. 

Andrew McIntyre 

Mr. McIntyre has thirty years of experience as 

an Environmental Health and Safety Professional in 

high technology industries and is a co-founder of Environmental 

and Occupational Risk Management, Inc 

(EORM). His industry experience started with Xerox 

Corporation’s Electronics Division in 1981 and continued 

with the Hewlett Packard Company’s Component’s 

Group in 1994. While at Xerox and HP, Andy’s experience 

included the development and implementation of 

28

health and safety programs in both Compound Semiconductor 

and Silicon microelectronics manufacturing. 

Project focus included industrial hygiene characterization 

and exposure assessment of chemical contaminants 

in the work place, conducting hazard analyses of new 

equipment, and specification of engineering controls to 

enhance the safety of hazardous gas storage and delivery 

systems. During his tenure with HP, Andy was awarded 

Certification in Industrial Hygiene by the American 

Board of Industrial Hygiene. After co-founding EORM 

in 1990, Andy has supported a variety of market areas 

including semiconductor, communications, biotechnology, 

pharmaceutical and most recently, the photovoltaic 

industry where he has focused on assisting clients in optimizing 

their EHS programs by improving operational 

compliance, reducing cost, enhancing productivity and 

strengthening business advantage. Currently, Andy holds 

the position of Executive Vice President and Managing 

Principal with EORM. Andy’s industry association involvement 

has centered on the Semiconductor Environmental 

Health and Safety Association (SESHA) where 

his involvement dates back to 1982. After joining HP in 

1984, Andy became very active in the Northern California 

Chapter, and was given the opportunity to take on a 

Regional Director role for Northern California in 1987 

and was elected to the Board of Directors in 1989. Andy 

had the privilege of serving the Association as a member 

of the Board from 1989 to 1996, holding a series of 

leadership positions to include serving as President from 

1995 - 1996. He received the Presidents Award in 1999 

and was elected in 2001 as a Fellow by SESHA. He is 

the second recipient of Pacific Industrial and Business 

Association (PIBA) Health and Safety Professional of 

the Year Award (1999). Over the last twenty years, he 

has authored numerous articles and had the opportunity 

to present at international conferences and symposiums 

in both North America and Asia. Andy holds a Bachelor’s 

Degree in Environmental Toxicology from the 

University of California, Davis and a Masters Degree in 

Environmental and Occupational Health/Industrial Hygiene 

from California State University, Northridge. 

Richard Melville 

Richard Melville, MS, CIH, is an advisory industrial 

hygienist with responsibility for upstream chemical 

reviews, regulatory compliance, asbestos, lasers, ergonomics, 

epidemiology study support, hazard communication, 

and chemical security support. 

Gary Niekerk 

Gary Niekerk has spent twenty-five years working 

with employees, customers, and stakeholders to protect 

and build the brand and reputation of some of the 

world’s leading high-tech companies. Gary has worked 

for Hewlett-Packard, Apple and Intel where he has spent 

the past sixteen years. During his career, Gary has held a 

variety of leadership positions, including: Regional Environmental 

Health & Safety Director, HR Communications 

Manager and External Affairs Manager. Gary’s 

current position is Director, Global Citizenship in Intel’s 

Corporate Affairs organization where he works on corporate 

strategy related to sustainability, corporate reputation 

and stakeholder management. Gary has a BS degree 

in Occupational Safety and Health and a MS degree in 

Industrial Hygiene. 

Chang Hyun Oh 

Mr. Oh has been a senior engineer at Hynix Semiconductor 

for five years since 2007. As a senior engineer 

he has been in charge of CDM project, study on 

reduction of PFCs emission, energy efficiency TF and 

FI-IR measurement of POU scrubber efficiency. Prior to 

joining ESH R&D center where he is currently working 

for, Mr. Oh had been working for hynix as a process 

engineer, especially in the field of Thinfilm area in the 

300mm fab as well as 200mm. Mr. Oh had received a 

master degree in the field of electronic materials from 

the university of Sungkyunkwan, Suwon, South Korea. 

No Hyeok Park 

Mr Park has been an assistant manager at hynix 

semiconductor for five years since 2006. As an assistant 

manager he has been in charge of Wastewater treatment, 

Wastewater Recycling and Air quality management. Mr 

Park had recieved a bachelor’s degree in the field of environmental 

engineering from the univirsity of seoul, 

South Korea 

Reg Parker, MS PMP 

Reg Parker, MS, PMP ‚Ä¢ 30 years in Medical and 

Electronics industry with General Electric, Motorola 

and Freescale specializing in Process and Manufacturing 

Engineering. Currently Freescale’s Semiconductor’s 

Global Reclaim Manager in the Corporate Office 

of Operational Excellence. *****Bob Atkinson, CIH, 

CSP ‚Ä¢ 31 years in EHS, 26 years in semiconductor 

manufacturing with GTE Microcircuits, Motorola and 

ON Semiconductor. Certified Safety Professional and 

Certified Industrial Hygienist and currently Consultant 

for E2CS. *****Jeff Bradshaw, MAOM ‚Ä¢ 20 years in 

EHS, Hazardous Materials and Metal Reclaim Program 

29

Management. EHS Manager for Karsten Manufacturing 

Corporation (PING Golf). Environmental Engineer for 

Intel Corporation’s WW EHS. Currently with Intel Resale 

Corporation as IRC’s Recycling Program Manager. 

Leon Qiao 

Leon Qiao, 35 years‚Äô old, senior supervisor in 

safety & fire-fighting part, ESH department of Hynix 

Semiconductor China Ltd. ( Wuxi plant). More than 10 

years experience in the field of safety & fire-fighting, 

in charging of safety system team, fire-fighting system 

team and safety engineering team as well. 

Akira Sekiya 

Dr. Akira Sekiya is the Guest Research Scientist 

of the Research Institute for Innovation in Sustainable 

Chemistry in National Institute of Advanced Industrial 

Science and Technology (AIST), Japan. In 1989, he 

started the research on the development of new alternatives 

to CFCs. Since 1990, he has led five national 

projects including the development of novel semiconductor 

CVD chamber cleaning gases as a replacement 

for perfluorocompounds. He has also developed new 

evaluation methods of global warming. Those methods 

are applicable to Life Cycle Analyses (LCA) and have 

a close relation to climate change. PhD：Tokyo 

Institute of Technology in 1977. The Research Center 

for Developing Fluorinated Greenhouse Gas Alternatives 

of AIST as a deputy director of the center in 

2001-2005. He has received 7 awards including two 

EPA’s ozone protection awards. He has published 200 

academic papers 120 reviews, and 150 invited presentations. 

Research area: Fluorine Science, synthesis and 

environment. 

Mike Sherer 

Mike Sherer, P.E. is an environmental consultant 

supporting semiconductor fabs and related industries. 

Reyes Sierra-Alvarez 

Dr. Reyes Sierra is a professor in the Department 

of Chemical and Environmental Engineering at the 

University of Arizona since 2001. Previously she was 

in the faculty of the Department of Environmental Sciences 

of the Wageningen University in the Netherlands. 

For over 20 years, Prof. Sierra’s research has focused 

on the fate, (bio)remediation and toxicity of hazardous 

contaminants. Dr. Sierra is a principal investigator 

of the SRC/Sematech Engineering Research Center for 

Environmentally Benign Semiconductor Manufacturing 

(ERC). She has participated in numerous research projects 

focusing on environment, health and safety aspects 

of semiconductor manufacturing. 

30 

Parikhit Sinha, PhD 

Dr. Sinha is Director of Sustainable Development, 

Environmental at First Solar where he manages projects 

related to life cycle management, risk assessment, and 

greenhouse gas emissions. He is a former study director 

in the Board of Atmospheric Sciences and Climate at 

the National Research Council. He holds a B.A. in environmental 

engineering from Harvard University and 

a Ph.D. in atmospheric sciences from the University of 

Washington, Seattle. 

Dawn Speranza Graunke 

Dawn E. Speranza has over 20 years of EHS experience. 

She has held various positions if the EHS field 

and currently manages regulatory supply chain issues 

such as the REACh, CLP, GHS for the Intel Global Fab 

Materials EHS organization in Portland Oregon. Prior to 

this, Dawn was on assignment at International SEMAT- 

ECH where she project managed various global chemical 

initiatives and the ESH assessments of new materials 

and processes for the advanced technologies. She also 

has managed Fab Construction Safety projects from the 

design phase & tool installation to de-install and demolition. 

She has a B.S. degree from Tulane University and 

a M.S. degree from the University of Massachusetts at 

Amherst. Dawn is a certified Industrial Hygienist and 

Safety Professional. Dawn is past president of the SE- 

SHA and is currently a member of the board. . Dawn has 

TWIN girls that keep her busy in her not so spare time. 

Rebecca Sternberg 

Ms. Rebecca Sternberg is a experienced corporate 

strategist and consultant with a focus on environmental 

and social sustainability. She is currently the Sustainability 

Practice Lead with EORM. In her role, she 

consults with corporations on sustainability strategy, 

supplier responsibility, sustainability reporting and operational 

and product lifecycle issues. Her past experience 

includes acting as Vice President of Sustainability 

Solutions for an ESS (now IHS), consulting to Waste 

Management, Microsoft, PG&E, Pao de’Acucar and 

Suncor on their environmental sustainability strategies, 

and as the founder of management consulting company 

Accenture’s global Sustainability practice. In those 

roles, she helped companies identify environmental and 

social innovations and develop goals, metrics and approaches 

to deliver upon them. Rebecca holds an MBA 

in Sustainable Management from the Presidio School of 

Management, a Masters in Health Science from Johns 

Hopkins School of Public Health, a graduate Certificate 

in Economics from the University of York, England, and

a BA cum laude in Philosophy and Anthropology from 

Mount Holyoke College. 

John Sweeney 

Father of 4 wonderful kids and one amazing wife. 

Received a BS degree from University of Massachusetts 

Amherst MA and took several graduate level courses at 

Harvard Extension School and University of Massachusetts 

at Lowell in Industrial Hygiene and Public Health. 

I am a Certified Safety Professional with 12 years of 

experience in the Seminconductor business as an Industrial 

Hygienist. Employee exposure assessments and 

toxic gas monitoring systems is what I enjoyed learning 

about the most. I have been at Harvard University since 

April 2007 and prior to working at Harvard I worked 

for Skyworks Solutions in Woburn Massachusetts and 

Tycoelectronics in Lowell Massachussetts. I recently 

published an article in IEEE on integrating toxic gas 

systems in to building fire alarm systems. 

Ernest Timlin 

Ernest Timlin MS CIH CSP is formerly the Corporate 

IH Program Manager. He has over 20 years experience 

working as a chemical safety engineer, industrial 

hygienist and safety/health team leader in five semiconductor 

fabs at IBM. 

Hsiang-ming, Tsou 

My name is Hsiang-ming, Tsou. I am a Master 

in Environment Engineering of National Chiao Tung 

University(NCTU). I work in United Microelectronic 

Corporation(UMC) where is located in Hsinchu Science 

Park, Hsinchu, Taiwan, R.O.C. now. My position is ESH 

staff engineer. I have been in charge of JSO(Job Safety 

Obervation), equipment management, inspection management, 

odor control and improvement around Fab, 

risk/insurance management, EMS and OHSAS. Now I 

focus on Air Pollution Control, Waste Manegement, and 

GHG (Green House Gas) Management. 

Steve Viera 

Steve Viera, Intel Supplier Corporate Responsibility 

Manager Steve has spent twenty seven years at Intel 

Corporation in the Supply Chain with Manager Assignments 

in manufacturing (Fab and Assembly/Test), site 

Maintenance, Repair, Operations, capital equipment, 

construction, warehousing, information systems, new 

product introduction, and Risk Prevention & Controls, 

International sites, and operations management. As Intel’s 

current Supplier Corporate Responsibility Manager 

his responsibilities have him involved with Ethics, Corporate 

Social Responsibility, and Green efforts (via the 

Electronic Industry Citizenship Coalition), worldwide 

benchmarking, market intelligence, strategic planning, 

and general purchasing policies and procedures. 

Don Westmoreland 

Don Westmoreland Received a Ph.D. in inorganic 

chemistry from the University of Texas at Austin in 

1989. Prior to the he received a Masters and a Bachelors 

degree from Texas State University. He worked for 2 

years on glass substrate, thin film technology development 

at Libby-Owens-Ford in Toledo, Ohio before 

taking a position at Micron in Boise. For 16 years Don 

managed the material science research lab at the Micron 

R&D center in Boise. Four years ago he changed positions 

to work in the Corporate Enviromental, Health, 

Safety and Security group. Today he works with all of 

the Micron sites worldwide developing and implementing 

EHSS poicies. 

Matt Wyman 

Matt Wyman is Managing Director of the KFPI 

Advanced Technologies Division specializing in Semiconductor, 

TFT-LCD, and Photovoltaic industries with 

offices in the USA, Taiwan, Japan, and China. Matt 

Wyman currently leads the SEMI Standards International 

Fire Protection Task Force and is also member of the 

NFPA 318 Committee. Matt Wyman began his career 

with Factory Mutual (FM Global) and was part of the 

Semiconductor Loss Prevention Specialist team in the 

1990s. Matt Wyman has provided fire protection design 

and consulting to the semiconductor industry for over 

15 years. Matt Wyman has provided numerous industry 

presentations and training classes on equipment fire protection 

design and compliance. Matt Wyman works with 

OEMs, Fabricators, and Consultants around the world. 

Tim Yeakley 

Tim is a member of TI’s Worldwide ESH Team and 

is reponsible for ESH Policy and consortia activity. Tim 

is a chemist and is currently the SIA Chemical Committee 

Chair and TechAmerica’s China RoHS co-chair. 

Tim is also responsible for implementing strategic ESH 

programs within TI to ensure product compliance. 

31

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104 

203 

211 

Coffee Break 

Food 

Lounge 

112 

204 

209 

210 

302 303 304 306 308 310 312 

32

Exhibitors 

Don’t Miss these 

Exhibit Hall Events!! 

Exhibit Hall Raffle: 

We will be holding a raffle with some very nice 

prizes in the Exhibit Hall on Tuesday and Wednesday. 

Starting Tuesday you will be able to get tickets 

at each exhibit booth in exchange for a business 

card. You must be present to win. 

Exhibit Hall Schedule and Activities: 

Tuesday: 

tMorning break in the Exhibit Hall from 9:30 to 10:00 

AM; Distribution of Raffle Tickets 

t Exhibitor Sponsored Lunch in the Exhibit Hall from 

Noon-1:45 PM; Continue Distribution of Raffle 

Tickets 

tAfternoon break in the Exhibit Hall from 3:15 to 

3:45 PM - Continue Distribution of Raffle Tickets 

tEvening Welcome Reception in the Exhibit Hall 

from 5:15 to 7:00 PM - Raffle Drawing 

Wednesday: 

tMorning break in the Exhibit Hall from 9:30 to 10:00 

AM; Distribution of Raffle Tickets 

tCash and Carry Lunch, Continue Distribution of 

Raffle Tickets in the Exhibit Hall from 11:30 AM 

to 1:00 PM 

tAfternoon break in the Exhibit Hall from 3:15 to 

3:45 PM - Raffle Drawing 

Exhibitor Listing By Booth Number 

SGS Consumer Testing Co ................ Booth: 100 

SST Equipment Inc............................ Booth: 101 

DOD Technologies............................. Booth: 103 

Dakota Software................................. Booth: 104 

MKS Instruments............................... Booth: 109 

Sensor Electronics Corporation..........Booth: 110 

MIDAC Corporation...........................Booth: 111 

CS Clean Systems, Inc........................Booth: 112 

Environmental Response.................... Booth: 203 

Pure Safety.......................................... Booth: 204 

Belfor USA......................................... Booth: 209 

Honeywell.......................................... Booth: 210 

Salus Engineering International..........Booth: 211 

Clean Harbors..................................... Booth: 302 

Enhesa................................................. Booth: 303 

Matheson............................................ Booth: 304 

Ebara Technologies Inc...................... Booth: 306 

ATMI.................................................. Booth: 308 

IHI Environmental.............................. Booth: 310 

KFPI Inc............................................. Booth: 312 

Exhibit Hall Hours: 


Tuesday, May 17.......................................................................9:30 AM-7:00 PM 

Break................................................................................. 9:30-10:00 AM 

Exhibitor Sponsored Lunch............................................... Noon-1:45 PM 

Break ..................................................................................3:15-3:45 PM 

Tuesday, May 17 Opening Reception & Raffle Drawing................5:15-7:00 PM 

Wednesday, May 18 .................................................................9:00 AM-4:00 PM 

Break ............................................................................... 9:30-10:00 AM 

Cash & Carry Lunch .................................................11:30 AM-1:00 PM 

Break and Raffle Drawing...................................................3:15-3:45 PM 

33

ATMI Booth: 308 

2151 E Broadway Rd, Suite 101 

Tempe, AZ 85282 

480-736-7621; FAX: 480-966-9544 

www.atmi.com 

ATMI is a global leader in enabling process materials 

and process technology for semiconductor, display 

and life science industries. ATMI focuses on delivering 

process efficiency through fast access to technology innovation, 

effective production of deliberate outcomes 

and efficient conversion of process input to process output. 

Delivering breakthrough improvements in these areas 

drives innovations in the most demanding high-volume 

manufacturing environments. 

Belfor USA Booth: 209 

2425 Blue Smoke Court South 

Fort Worth, TX 76105 

800-856-3333; FAX: 817-536-1167 

www.belforusa.com 

Semiconductor fab and tool decommissioning and 

decontamination services, along with complete disaster 

planning and recovery services. 

Clean Harbors Booth: 302 

Environmental Services 

1340 West Lincoln Street 

Phoenix, AZ 85007 

480-294-2134 

www.cleanharbors.com 

Clean Harbors Environmental Services (CHES) 

specializes in hazardous material and substance decontamination 

for the semiconductor and microelectronics 

industry. We handle all forms of hazardous and industrial 

chemical contamination associated with semiconductor, 

wafer, circuit board, plating lines, and other microelectronics 

manufacturing processes. 

CHES provides certified removal of hazardous 

substances from process tooling, chemical systems, 

clean room chases, bays, sub-floors, and environmental 

systems such as scrubbers, AWN systems and building 

structures. 

With over 45 years of hazardous waste and material 

handling experience CGES has the pre-requisite qualifications 

to perform complex decontamination and chemical 

removal tasks safely, compliantly, and economically 

Exhibitors 

CS Clean Systems, Inc Booth: 112 

41583 Albrae Street 

Fremont, CA 94538 

510-651-2700; FAX: 510-651-2702 

www.cscleansystems.com 

Refillable CLEANSORB ® & Disposable NO- 

VAPURE ® dry bed exhaust purification of wafer process 

effluents. NOVASAFE purifier for ion implant applications. 

CLEANVENT purifier for gas cabinet vent lines. 

CLEAN-PROTECT for emergency gas release protection. 

PIRANHA Plasma Conversion System for removal 

of perfluorinated compounds (PFC’s) such as CF 4 

, CHF 3 

, 

SF 6 

, NF 3 

, etc. 

Dakota Software Booth: 104 

23240 Chagrin Blvd, Ste 620 

Cleveland, OH 44122 

216-765-7100; FAX: 585-244-3301 

www.dakotasoft.com 

Dakota Software Corporation has been providing 

EHS management software to regulated industries, 

consultants and government since 1988. Dakota’s primary 

differentiator is the integration of regulatory content 

with the software tools. Dakota’s ProActivity Suite 

of software ensures that enterprises are identifying all 

applicable requirements, communicating substantive 

regulatory changes that directly affect site operations 

and providing executive dashboard visibility into EHS 

compliance and carbon management activities across the 

enterprise. Dakota’s Suite of products, Profiler, Auditor, 

Tracer, Scout and Metrics can be used in combination 

or independently to proactively manage compliance at 

the point of control. For more information about Dakota 

Software, visit www.DakotaSoft.com or call 216-765- 

7100 ext. 2. 

DOD Technologies Booth: 103 

740 McArdle Dr Unit C 

Crystal Lake, IL 60014 

815-788-5200; FAX: 815-788-5300 

www.dodtec.com 

DOD Technologies manufactures and distributes 

gas detection life safety systems. DOD Technologies offers 

a complete line of gas detection systems and related 

services such as calibration, training and system integration. 

As gas detection technologies become more sophisticated 

it takes an expert to sort through them and select 

the correct technology for your applications. DOD Technologies 

staff has over 50 years of experience consulting 

and satisfying customers gas detection needs. Keeping 

34

up with new technologies and never forgetting the proven 

technologies of the past. We help you to explore the 

best of all worlds in gas detection.DOD Technologies offer 

a variety of low level toxic, corrosive and flammable 

gas detection solutions. This includes personal, portable 

and fixed systems for your safety and protection. DOD 

Technologies also offers a complete service package 

which includes startup assistance and calibrations. Contact 

DOD Technologies for further information at 815- 

788-5200 or visit www.dodtec.com. 

Ebara Technologies Inc. Booth: 306 

51 Main Ave 

Sacramento, CA 95838 

916-920-5451; FAX: 916-925-6654 

www.ebaratech.com 

EBARA is a global innovator/local provider of 

vacuum pumps and advanced exhaust management solutions 

for semiconductor, photovoltaic, thin films and 

R&D. EBARA’s products are backed by a superior global 

service network. EBARA continues to expand its role 

by bringing to the market: Dry Vacuum Pumps, Turbomolecular 

Pumps, and Point-of-Use Abatement. 

Enhesa Booth: 303 

1411 K St NW, Suite 503 

Washington, DC 20005 

202-552-1090; FAX: 202-747-2874 

www.enhesa.com 

Enhesa is an international EHS consulting firm, 

providing EHS regulatory compliance assurance support 

to businesses worldwide. With headquarters in Brussels 

and Washington, DC, and over 20 years of experience, 

their team of highly trained and experienced, multilingual 

consultants has the expertise to keep companies 

ahead of the latest regulatory and policy issues in over 

150 countries and jurisdictions around the globe. 

Environmental Response Booth: 203 

2202 W Medtronic Way, Suite 108 

Tempe, AZ 85281 

480-967-2802; FAX: 480-967-2735 

www.environmentalresponse.com 

Currently in our 17th year and with 9,000+ response 

operations completed, ERI is a full-service contractor 

with the experience, equipment and staff to offer 

our clients a comprehensive range of environmental 

services, including 24-hour Emergency Spill Response, 

Lab Packing, Hazardous Waste Disposal, Facility Decontamination, 

Soil Remediation, Hood Decontamination, 

UST Removal. 

Honeywell Booth: 210 

405 Barclay Boulevard 

Lincolnshire, IL 60069 

847-955-8344; FAX: 847-955-8208 

www.honeywellanalytics.com 

Honeywell Analytics has added Airborn Molecular 

Contamination (AMC) monitoring solutions to its comprehensive 

offering of gas detectors. The AMC technology 

by Picarro TM uses a patented Infrared cavity-ring 

down spectroscopy to identify contaminants down to 

parts per billion levels, improving safety, uptime and 

yields of silicon wafers. Honeywell Analytics toxic gas 

detection solutions include patented ChemcassetteÆ 

colorimetric paper technology, FTIR and electrochemical 

cell technologies found at some of the most critical 

applications around the world. Call 800-538-0363. Visit 

Honeywell Analytics at SESHA’s ESH Symposium and 

Exposition, Booth #210. 

IHI Environmental Booth: 310 

1260 45th Street 

Emeryville, CA 94608 

510-923-1661; FAX: 510-923-1468 

www.ihi-env.com 

IHI Environmental, an employee-owned business 

with 31 years of experience performing industrial hygiene, 

occupational safety, and environmental consulting 

services. IHI investigates and identifies the environmental, 

health, and safety hazards that can affect employees, 

investments, and the bottom line. Specializing in the 

proactive prevention of EHS hazards; offering solutions 

to mitigate hazards and challenges 

KFPI Inc. Booth: 312 

10351 Olympic Drive 

Dallas, TX 75220 

214-755-9937; FAX: 214-350-9930 

www.koetterfire.com/international 

KFPI provides complete fire safety solutions for the 

global Semiconductor, FPD, & Solar industries. KFPI 

specializes in equipment fire protection system design 

and compliance for SEMI S2, FM, & NFPA as well as 

critical items such as reliability, performance, and longevity. 

KFPI also provides Risk Management Consulting, 

Loss Control Engineering, IR Thermography 

Inspection, & Safety Training. KFPI is a global leader 

with offices in USA, Taiwan, Japan, & China. 

35

Matheson Booth: 304 

166 Keystone Drive 

Monteomeryville, PA 18936 

215-648-4026; FAX: 215-641-2714 

www.mathesongas.com 

MATHESON is a single source for industrial, welding 

and safety supplies, medical, specialty and electronic 

gases, gas handling equipment, high performance purification 

systems, engineering and gas management services, 

and on-site gas generation with a mission to deliver 

innovative solutions for global customer requirements. 

MIDAC Corporation Booth: 111 

130 McCormick Ave, Suite 111 

Costa Mesa, CA 92626 

714-546-4322; FAX: 714-546-4311 

www.midac.com 

MIDAC Corporation has over 30 years of experience 

manufacturing rugged industrial FTIR gas analyzers 

for PFC emissions monitoring, process gas purity/ 

end point determination, ambient air monitoring, and 

open path analysis. Systems range from compact singleline 

analyzers to NEMA enclosed, fully-automated systems 

with up to 36 sample lines. 

MKS Instruments Booth: 109 

2 Tech Drive, Suite 201 

Andover, MA 01810 

978-645-5500; FAX: 978-557-5100 

www.mksinst.com 

MKS Instruments MultiGas FTIR Spectrometry 

gas analyzer instruments are capable of ppb to ppm sensitivity 

for multiple gas species in a variety of gas analysis 

applications. 

AIRGARD® ambient air analyzer is an ultra-sensitive, 

FTIR-based gas analyzer designed to rapidly detect 

toxic gases. AIRGARD® is capable of detecting parts 

per billion (ppb) levels of most CWAs and TICs below 

toxic, Immediately Dangerous to Life or Health (IDLH) 

levels within 20 seconds. 

Pure Safety Booth: 204 

730 Cool Springs Blvd 

Franklin, TN 37067 

615-277-3148 

www.puresafety.com 

Born out of a workplace tragedy, PureSafety understands 

the safety and health risks that threaten an organization’s 

people and profits. Our innovative, web-based 

solutions empower over 2,000 companies in more than 

20 major industries to more efficiently and effectively 

manage those risks, improve business performance, and 

keep their people safe, healthy and on the job. 36 

Salus Engineering International Booth: 211 

3004 Scott Blvd 

Santa Clara, CA 95054 

www.salusengineering.com 

Salus Engineering International provides the highest 

quality equipment safety services and aid to equipment 

manufacturers in satisfying the environmental 

health and safety requirements of this marketplace. In addition 

to SEMI S2 and related supporting standards, the 

experienced Salus team provides the complete breadth 

of services to meet the safety needs of the high tech and 

semiconductor industry. Our experienced staff of professionals 

includes electrical & mechanical professional 

engineers, certified industrial hygienists, environmentalists, 

ergonomists and ventilation specialists. 

Sensor Electronics Corporation Booth: 110 

5500 Lincoln Drive 

Minneapolis, MN 55436 

952-938-9486; FAX: 952-938-9617 

www.sensorelectronic.com 

Fixed Gas Detection Products and Systems. Toxic 

Gas Detectors designed for Semiconductor Industry Infrared 

HC, HCFC, PFC Gas Detectors. Unique cost saving 

features are designed in to all Sensor Electronics gas 

detection products. 

SGS Consumer Testing Company Booth 100 

291 Fairfield Avenue 

Fairfield, NJ 07004 

661-670-9483 

www.sgs.com 

SGS Consumer Testing Services is a division of the 

SGS Group, the world’s leading verification, testing and 

certification company, recognized as the global benchmark 

for quality and integrity. Our comprehensive testing, 

product inspection and technical services cover the 

entire supply chain from product development to retailing 

for consumer products. 

SST Equipment, Inc Booth 101 

179 N Blick Road #114 

Paso Robles, CA 93446 

805-467-9753, Fax: 805-467-3531 

We provide emission control equipment and consulting 

on emission control projects. We specialize in 

VOC, NOx and Particulate control. Expert SCR systems 

and other forms of NOx control; VOC Zeolite Filters, 

Bag houses and Precipitators for Particulate control; 

absorbers and scrubbers for Acid gas control. Licensed 

Professional Engineer. Licensed Contractor.

SESHA 2011 Program Book - Semiconductor Safety Association

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