A Test Setup for Probe Card Characterization under âProduction-likeâ
A Test Setup for Probe Card Characterization under âProduction-likeâ
A Test Setup for Probe Card Characterization under âProduction-likeâ
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
• Contents<br />
A test-setup <strong>for</strong> probe card characterization<br />
<strong>under</strong> – Background „production-like“ / Motivation operating conditions<br />
• Third level 16pt<br />
– Fourth level 14pt<br />
Michael Horn, Stephan Fuchs<br />
» Fifth level 12pt<br />
Infineon Technologies - Munich / Germany<br />
TW June-2004<br />
.Horn/ S.Fuchs<br />
0.05.04 Page 1<br />
Presentation <strong>for</strong> SWTW 2004
A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Outline<br />
‣Background / Motivation<br />
‣<strong>Test</strong> Concept Requirements<br />
‣<strong>Test</strong> <strong>Setup</strong><br />
‣<strong>Probe</strong>-<strong>Card</strong> Measurement Results<br />
‣Summary<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Background<br />
• strong need <strong>for</strong> probe card evaluation process <strong>for</strong>:<br />
– new probing technologies ( pad arrangements, pitch, multi DUT)<br />
– new products: (materials, BEOL-stack)<br />
• short „time-to-market“ prohibits iterative improvement process<br />
– evaluation process needs to start earlier<br />
• missing links in the evaluation process:<br />
– reliable prediction of c res per<strong>for</strong>mance<br />
– c res stability <strong>under</strong> manufacturing conditions<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Probe</strong>-<strong>Card</strong> Evaluation - IDEAL flow<br />
New Wfr.<br />
Process or<br />
Product<br />
Requirements<br />
<strong>Test</strong>- <strong>Setup</strong><br />
blank wfr (alu...)<br />
<strong>Probe</strong>-<strong>Card</strong><br />
<strong>Test</strong>er<br />
<strong>Test</strong> Program<br />
<strong>Test</strong>-/Product Wfrs.<br />
<strong>Probe</strong>-<strong>Card</strong><br />
<strong>Test</strong>er<br />
<strong>Test</strong> Program<br />
Product Wfrs.<br />
<strong>Probe</strong>-<strong>Card</strong><br />
New Probing<br />
Requirements<br />
PC<br />
<strong>Characterization</strong><br />
Early Life<br />
Qualification<br />
Production<br />
Evaluation<br />
Production<br />
Release<br />
Specification<br />
Qual‘d<br />
Technologies<br />
Preferred<br />
Vendors<br />
Contact Stability<br />
Cleaning Recipe<br />
PC Planarity<br />
<strong>Probe</strong>r Alignment<br />
Measurement -<br />
Stability<br />
Scrub Analysis<br />
incoming QC<br />
Yield Stability<br />
Cleaning Freq.<br />
Handling Issues<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> Concept - Requirements<br />
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.Horn/ S.Fuchs<br />
• test scenario as close as possible to real probing conditions<br />
– <strong>for</strong>ce current through contacts<br />
– probing parameter variation<br />
• temperature<br />
• overdrive<br />
• chuck-speed<br />
• high number of Touch-Downs<br />
– different contact materials<br />
• Evaluation should be possible w/o specific product or test-chip<br />
– amount of test-chip and/or product wfrs limited<br />
– product schedule can be shifted<br />
• low cost & flexible setup<br />
– use existing equipment & h/w (but no tester)<br />
– flexible channel assignment (Vcc, GND)<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> <strong>Setup</strong>- Overview 1/2<br />
Multimeter<br />
Pwr. Supply<br />
V<br />
Personal Computer<br />
Parallel Port<br />
GPIB<br />
Interface Board<br />
Pogo Tower<br />
<strong>Probe</strong> <strong>Card</strong><br />
<strong>Probe</strong>r<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> <strong>Setup</strong>- Overview 2/2<br />
Interface Board<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong>-<strong>Setup</strong> Main Features<br />
• Wafer handling:<br />
(w/ <strong>Probe</strong>r-Interface Docking Unit)<br />
TSK APM 90 (available prober)<br />
• Nr. of measurement channels: 128<br />
flexible channel assignment of probe contact to Vdd or Gnd via GUI<br />
• Current per needle:<br />
• Repeatability (σ):<br />
• Data Output:<br />
0,1-200 mA<br />
ca. 1,4 mΩ<br />
ASCII <strong>for</strong>mat<br />
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number 1 2 3 4 5 6 7<br />
channel 7 6 5 2 3 1 68<br />
X-coordinate 0 0 0 0 0 0 0<br />
Y-coordinate 7931 7611 7291 6971 6651 6171 3371<br />
comment DAISYDAISYDAISYDAISYDAISYDAISYDAISY<br />
VCC / GND GND VCC GND VCC GND VCC GND<br />
touchdown X Y X_abs Y_abs<br />
2 3 5 166.245 346.0482 1.27 4.86 1.64 1.02 0.91 2.38 30<br />
4 5 5 147.74 346.0482 1.35 4.55 1.92 0.91 0.78 2.54 30<br />
6 7 5 129.235 346.0482 1.27 4.79 2.04 0.87 0.9 2.02 30<br />
8 9 5 110.73 346.0482 1.32 4.82 2.09 0.92 0.96 2.18 30<br />
10 11 5 92.2248 346.0482 1.42 5.68 2.49 0.9 1.02 2.58 30<br />
12 14 4 64.4648 370.2382 1.19 5.37 1.8 0.89 0.83 1.76 30<br />
14 12 4 82.9698 370.2382 1.25 4.76 1.59 0.77 0.91 1.65 30<br />
16 10 4 101.475 370.2382 1.11 4.95 1.69 0.75 0.88 1.7 30<br />
18 9 4 110.73 370.2382 1.4 4.67 1.83 0.74 0.82 1.99 30<br />
Example<br />
Result File
..<br />
A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> Sequence 1/2<br />
...<br />
1. Unactivated State<br />
...<br />
2. <strong>Probe</strong>-<strong>Card</strong> „Aging“<br />
State<br />
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3. Measurement State
A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> Sequence 2/2<br />
Power Supply on<br />
off<br />
Chuck<br />
up<br />
down<br />
∆t<br />
Multimeter<br />
Needle# 1........................128<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> <strong>Setup</strong>- User Interface 1/2<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
<strong>Test</strong> <strong>Setup</strong>- User Interface 2/2<br />
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Mapping of Pins<br />
to Vdd and Gnd<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Measurement Results 1/3<br />
cres<br />
[Ohm]<br />
Comparison of c Res <strong>for</strong> different Probing Technologies (@100mA, 90°C)<br />
6<br />
5<br />
<strong>Probe</strong>-<strong>Card</strong> A<br />
<strong>Probe</strong>-<strong>Card</strong> B<br />
<strong>Probe</strong>-<strong>Card</strong> C<br />
cres<br />
[Ohm]<br />
2.0<br />
4<br />
1.5<br />
3<br />
1.0<br />
2<br />
0.5<br />
1<br />
0<br />
1177<br />
2353<br />
3529<br />
4705<br />
5881<br />
7057<br />
8233<br />
9409<br />
10585<br />
11761<br />
12937<br />
14113<br />
15289<br />
16465<br />
17641<br />
18817<br />
19993<br />
Nr. Touch-Downs
A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Measurement Results 2/3<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Measurement Results 3/3<br />
cres starts to increase<br />
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A <strong>Test</strong>-<strong>Setup</strong> <strong>for</strong> <strong>Probe</strong>-<strong>Card</strong> <strong>Characterization</strong><br />
Summary<br />
• test-setup can identify contact-resistance issues better than using<br />
a product (no interpretation of test-data required)<br />
• test setup enables us to assess per<strong>for</strong>mance trend of <strong>Probe</strong>-<strong>Card</strong>s<br />
in an early project phase<br />
• less resources required during evaluation phase (ATE resources<br />
and test code development resources)<br />
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