Product Design Guide - Diodes, Inc.

Product Packaging Information
Figure 20
Dimensions
SOT-523 SOT-323 SOT-23 SC-59
Z 1.8 2.8 2.9 3.4
X 0.4 0.7 0.8 0.8
Y 0.51 0.9 0.9 1.0
C 1.3 1.9 2.0 2.4
E 0.7 1.0 1.35 1.35
Figure 21
Dimensions
SOT-363 /
SOT-353
SOT-26 / SC-74R /
SOT-25
SOT-563
Z 2.5 3.20 2.2
G 1.3 1.60 1.2
X 0.42 0.55 0.375
Y 0.6 0.80 0.5
C1 1.9 2.40 1.7
C2 0.65 0.95 0.5
Y
C2
C2
Z
C
X
E
Z
G
C1
Fig. 20
Y
X
Omit this pad
for SOT-353 and SOT-25
Fig. 21
Figure 22
Dimensions
SOT89-3L
X1 1.7
X2 0.9
X3 0.4
Y1 2.7
Y2 1.3
Y3 1.9
C 3.0
X1
Figure 23
Dimensions
X1
SOT89-5L
X1 1.7
X2 0.55
X3 0.4
Y1 4.6
Y2 1.2
Y3 0.5
Y4 1.1
C 3.0
Y1
Y4
X3
X2
Y1
Y3
Y2
X2
Y2
X3
Y3
C
C
Fig. 22
Fig. 23
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on
application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired
for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
All data is subject to change. Please check our datasheets at www.diodes.com for updates. Appendix 29