Product Design Guide - Diodes, Inc.
Product Design Guide - Diodes, Inc.
Product Design Guide - Diodes, Inc.
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<strong>Product</strong> Packaging Information<br />
Figure 24<br />
Dimensions<br />
TO252-3L /<br />
DPAK<br />
X2<br />
TO263-3L /<br />
D 2 PAK<br />
Z 11.6 16.9<br />
X1 1.5 1.1<br />
X2 7.0 10.8<br />
Y1 2.5 3.5<br />
Y2 7.0 11.4<br />
C 6.9 9.5<br />
E1 2.3 2.5<br />
Figure 25<br />
Dimensions<br />
TO252-5L<br />
X 5.6<br />
X1 0.6<br />
Y 11.0<br />
Y1 5.6<br />
Y2 2.0<br />
C1 7.2<br />
C2 1.27<br />
X<br />
Y2<br />
Y1<br />
C<br />
Z<br />
Y<br />
C1<br />
Y1<br />
Y2<br />
X1<br />
E1<br />
Fig. 24<br />
C2<br />
Fig. 25<br />
X1<br />
Figure 26<br />
Dimensions<br />
TO263-5L<br />
X 10.9<br />
X1 1.05<br />
Y 15.7<br />
Y1 9.1<br />
Y2 2.5<br />
C 1.7<br />
Figure 27<br />
Dimensions<br />
TSSOP-14L<br />
X 0.45<br />
Y 1.45<br />
C1 5.9<br />
C2 0.65<br />
X<br />
X<br />
Y1<br />
Y<br />
C1<br />
C2<br />
Y2<br />
Y<br />
C<br />
X1<br />
Fig. 26<br />
Fig. 27<br />
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS<br />
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on<br />
application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired<br />
for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,<br />
Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.<br />
Appendix 30<br />
All data is subject to change. Please check our datasheets at www.diodes.com for updates.
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