Vertically Integrated Test/Calibration and Reliability Enhancement ...

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Analog Circuit Wearout vs. Digital Circuit Wearout • Using models <strong>and</strong> techniques from the digital domain is a start • However, wearout patterns may be significantly different – constant t bias vs. smaller stress on Vgs • Does this suggest electromigration is more of an issue than oxide breakdown? – Wearout is not uniform • e.g. RF choke in a power amplifier vs. input inductor in an LNA 14
Analog/RF <strong>Reliability</strong> • Wearout monitors are needed – Local monitors • Bottom-up approach • Duplicating the operating conditions on critical components may be too costly (area, power) • Diagnosis is easy but monitoring is hard – System-level monitors with local diagnosis • Top-down approach • Analog diagnosis is very challenging but possible • Monitoring i is easy but diagnosis i is challenging 15
Page 1 and 2: Vertically Integrated Test/Calibrat
Page 3 and 4: Trends • Integration of digital,
Page 5 and 6: Post-production Calibration • Ana
Page 7 and 8: Digital Processing • With million
Page 9 and 10: Increasing Defectivity • Use of h
Page 11 and 12: How do defects affect the test proc
Page 13: Reliability • Not much attention
Page 17 and 18: Re-calibrating for Reliability Enha
Page 19: Vision • Research is needed at mu

Vertically Integrated Test/Calibration and Reliability Enhancement ...

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