lIne DIFFuSIOn Furnace - Despatch Industries

INSPIRED INNOVATION
u DF In-line Diffusion System
Diffusion for highly uniform emitters
The Despatch In-line Diffusion Furnace incorporates advanced infrared
thermal technology that provides the tight temperature uniformity
needed for increased cell efficiencies. Air is passively preheated as it
enters the chamber and lamps on top and bottom along with edge
heaters effectively transfer heat to the wafers. Automated drop-down
access to the chamber reduces maintenance time and the insulation
in the first zones of the furnace is easily removed if it becomes
contaminated. The furnace provides advanced profile capability
and a fully comprehensive software system.
In-line processing offers reduced wafer handling and greater throughput
than batch processing. With less handling you will have less breakage
and increased yield. The Despatch Diffusion Furnace combined with
USI’s Deposition tool consistently produces highly uniform emitters
using aqueous-based doping. This repeatability enables
higher sheet resistances, excellent yields and optimum
cell efficiency.
features at a glance
u High volume production
u Exceptional thermal uniformity
± 1°C in the dwell region
u Closed loop temperature controls
u Advanced graphical user interface
u Safe, simple chamber accessibility
u High production up-time
u Ease of maintenance
High ohm emmiter capability
Industry best emitter uniformity
Best-in-class uptime and yield
Minneapolis • Shanghai • Berlin • Singapore • hsinchu • TOKYO

PRODUCT CONFIGURATION
System size
(length x width x height)
Standard entrance table
Heated length
Cooling length
Standard exit table
Conveyor type
Conveyor height above floor
Product clearance
Number of Lanes (156 x 156 mm) 5
Conveyor width
PROCESS CAPABILITIES
Maximum temperature
Approx. throughput (156 x 156 mm)
Conveyor speed range
Conveyor speed accuracy ± 0.5%
Conveyor speed control
Wafer size
Sheet resistance
DF 3630 production scale
15,329 × 1,870 × 1,750 mm (603.5 x 74 x 69 inches)
914 mm (36 inch)
10,516 mm (414 inch)
1,829 mm (72 inch)
914 mm (36 inch)
Lightweight balance spiral weave, Nichrome V material
97.8 cm +/-3.6 cm (38.4 in +/-1.5 in)
6.4 mm (0.25 inch)
914 mm (36 inch)
1000 °C (1832 °F)
1200-1400 wafers/hr
10–100 cm/min (4-40 ipm)
Closed loop feedback
100x100, 125x125, 156x156 mm (4, 5, 6 inch)
Option for 210 x 210 mm (8 inch) support
40 to >120 ohm/sq configurable
In-line diffusion furnace
u Tight temperature control for maximum
process window
u Maximum up-time for higher yields
u Process profiles for high efficiency solar cells
OPTIONS
u Water-cooled heat exchanger
u Failed element monitor
u Master production control interface
u Profiling systems
u Ultrasonic belt cleaner/dryer
u Uninterruptible power supply
u Extended process profiles
u Conveyor table extensions
u CE Compliance
A plasma system is
available for chemicalfree
conditioning of the
wafer surface.
Integrated Process
Control System
u Doper/Furnace recipe creation
u Process window monitoring with
audible and visual alarming
u Real-time process window display
u Data logging
u Process repeatability
The Despatch Diffusion Furnace combined with USI’s Deposition
tool is a reliable system for highly uniform emitters.
global offices
Germany: +49 30 629 073 410 / europe@despatch.com
China: +86-21-62365868 / shanghai@despatch.com
Taiwan: +886-3-6588484 / taiwan@despatch.com
Japan: +81-42-729-5355 / japan@despatch.com
USA headquarters
Phone: 1-952-469-5424
toll free usa: 1-888-337-7282
fax: 1-952-469-4513
sales@despatch.com
service@despatch.com
www.despatch.com
8860 207th Street West
Minneapolis, MN 55044 USA
© 2011 Despatch Industries. All rights reserved. Despatch is a registered trademark of Despatch Industries in the U.S. and other countries. DF-6-11