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International Technology Roadmap for PV - PVMC

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<strong>International</strong> <strong>Technology</strong> <strong>Roadmap</strong> <strong>for</strong> Photovoltaic<br />

(ITR<strong>PV</strong>) - 4 th Edition - Results 2012<br />

Stephan Raithel, SEMI Europe, Director <strong>PV</strong> Europe<br />

10 July, 2nd Annual c-Si <strong>PV</strong>MC Workshop, San Francisco


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

2<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> history and structure<br />

- Started w/ 9 European cell-manufacturing companies in June 2009<br />

- Publication of 1st edition at the <strong>PV</strong> FMF 2010 (supported by SEMI <strong>PV</strong> Group)<br />

- Extended along the value chain + including of new companies<br />

- data of participants are processed by SEMI agreed results are published<br />

- Today: publication of the 4 th edition with results collected 2012<br />

- Working group now includes important players from Asia and Europe<br />

ITR<strong>PV</strong> working group structure<br />

ITR<strong>PV</strong> Steering<br />

Committee<br />

(2 co-chairs from each region &<br />

SEMI representative*)<br />

c-Si wafermodule<br />

<strong>PV</strong><br />

System<br />

Inverter<br />

Silicon<br />

Other technical topics deppend on input of the industry<br />

3<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Methodology and structure<br />

Parameters in main areas are discussed<br />

along the value chain <strong>for</strong>:<br />

Materials<br />

- Poly-Silicon, Crystallization & Wafering<br />

- Cell processing<br />

- Module manufacturing<br />

Process<br />

Products<br />

SILICON CRYSTAL. WAFER CELL MODULE SYSTEM<br />

Poly-Si<br />

Ingot wafer cell module system<br />

value chain elements considered by the 4 th edition of the ITR<strong>PV</strong><br />

4<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

5<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


The challenging price race of the <strong>PV</strong> industry<br />

1976<br />

2006<br />

06 - 2011<br />

06 - 2012*<br />

01 - 2013<br />

clear goal: competitive <strong>PV</strong>-based power generation<br />

What measures have to be taken to keep path?<br />

The ITR<strong>PV</strong> roadmap describes the way<br />

6<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Cost considerations<br />

Price drop below cost challenges the <strong>PV</strong> industry<br />

mc-Si module price – 01/13: 0,694 US$/Wp*<br />

PRICES ALONG THE<br />

VALUE CHAIN<br />

(in USD/ Wp)<br />

How to improve the cost position further w/o sacrificing quality and efficiency?<br />

ITR<strong>PV</strong> helps to set the right markers<br />

* Avg. Module prices end of January 2013 source: BNEF (Bloomberg New Energy Finance), Energy Trend, <strong>PV</strong> Insights.<br />

7<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Cost considerations<br />

Poly Si price dropped during the last years:<br />

2010: 67$/kg<br />

E 2011: 30$/kg<br />

2H 2012 20$/kg<br />

Module price dropped during the last years:<br />

01 2010: 1.87 $/Wp<br />

01 2013 : 0.69$/Wp<br />

01 2013 : 17$/kg<br />

prices drop below cost<br />

…. in a tough battle<br />

•Avg. Module prices source: BNEF (Bloomberg New Energy Finance), Energy Trend, <strong>PV</strong> Insights.<br />

8<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

9<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Materials – Poly - Si / Wafering<br />

Poly-Si:<br />

<strong>PV</strong> grade poly-Si quality between 8N and 9N sufficient, also <strong>for</strong> high eta cells<br />

Poly-Si technologies will improve and<br />

compete <strong>for</strong> cost reductions<br />

umg –Si expected w/ small share<br />

Wafering:<br />

Diamond wire based sawing will become dominant <strong>for</strong> Mono from 2017 on<br />

Synchronization in cell processing needed<br />

Slurry based sawing will be dominating in mc-Si wafering<br />

Kerf less technologies not yet seen as cost competitive against matured technologies<br />

10<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Materials – Cell<br />

Wafer thickness trend had to be revised again<br />

180 …160 µm wafers preferred due to cost benefits vs. material savings<br />

But: gap between module and wafer/cell manufacturer expectations<br />

But: gap between<br />

Requirements of<br />

Manufacturers <strong>for</strong><br />

module and<br />

wafer/cell<br />

11<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Materials - Cell<br />

Reduction of Silver consumption per cell<br />

- necessary as Silver is most expensive material - Cu is supposed to replace<br />

Silver starting in 2015<br />

but <strong>for</strong> Cu, solutions <strong>for</strong> reliability and adhesion have to be available<br />

- mainstream technology in metallization : screen printing <strong>for</strong> years to come<br />

plating will compete from 2015<br />

200mg @1000$/kg = 4.9$cent/Wp<br />

30% of cell convertion cost!<br />

12<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Materials – Modules<br />

Costs of module manufacturing are sensitive to all materials (aprox. equal share)<br />

improvements are implemented in per<strong>for</strong>mance and costs<br />

Approaches <strong>for</strong> per<strong>for</strong>mance increase:<br />

- Reduction of optical losses<br />

i.e. Reflection / Absorption<br />

- Reduction of interconnection losses<br />

Solutions <strong>for</strong> per<strong>for</strong>mance increase<br />

- reduced Glass absorption and Frontside reflexion by AR coatings<br />

- improvement of UV per<strong>for</strong>mance of encapsulants<br />

13<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

14<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Processes – Manufacturing (1)<br />

Crystallization:<br />

- Using economy of scale requires<br />

high throughput approaches<br />

accelerated trend to larger ingots<br />

Gen 6 dominates high volume casting<br />

- higher throughput in mono pulling by<br />

increased ingot mass<br />

Wafering:<br />

- increased troughput by<br />

continouse improvement (slurry)<br />

New technology roll out (diamond)<br />

15<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Processes – Manufacturing (2)<br />

Cell production:<br />

- tools have to get increased throughputs<br />

current situation requires<br />

- maturing the per<strong>for</strong>mance of installed base<br />

- focusing on upgrades vs. new invests<br />

the gap between front- and back end should be closed<br />

in-line and clustered fab concepts are possible<br />

Year<br />

Front end [wafer/h]<br />

(chemical + thermal)<br />

Single line back end [wafer/h]<br />

(metallization + classification)<br />

2012 3600 2800<br />

2013-2015 5000 3200<br />

2017 6400 4200<br />

2023 7200 7200<br />

- Improvements result in reduction of relative invest <strong>for</strong> new cell fabs<br />

over the next<br />

16<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Processes – Manufacturing (3)<br />

Module :<br />

- throughput of module tools is expected to increase<br />

Introducing


ITR<strong>PV</strong> Results – Processes – <strong>Technology</strong> ( Cell 1)<br />

Recombination losses have to be reduced<br />

- in the crystalline Si bulk material<br />

- at the front side of the cell<br />

- et the back side of the cell<br />

AL-BSF not suitable below 200fA/cm²<br />

color coding indicates the progress<br />

rear side passivation concepts are ramping in mass production<br />

new production machines need to become mature<br />

improved mc-Si casting boosts material per<strong>for</strong>mance <strong>for</strong> processes w/ lower CoO<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012<br />

18


ITR<strong>PV</strong> Results – Processes – <strong>Technology</strong> ( Cell 2)<br />

Cell front side (n-doped emitters ):<br />

- emitter sheet resistance increase is needed<br />

reduced FS J0 to below 100 fA/cm²<br />

enable contacting by new pasts and/or SE<br />

- Reduction of finger width w/o losses in<br />

conductivity down to 40µm<br />

screen printing improves<br />

new techniques <strong>for</strong> fine line print<br />

CoO has to be competitive<br />

- Improved alignment accuracy <strong>for</strong> SE,<br />

double printing and new cell concepts<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012<br />

19


ITR<strong>PV</strong> Results – Processes – <strong>Technology</strong> (Module)<br />

Trend of cell to module power loss according to ITR<strong>PV</strong><br />

- Improvements in 2013 due to wide introduction of AR glass<br />

- new interconnect<br />

- improved encapsulation techniques<br />

power gain by encapsulation is possible<br />

Gap between alkaline and acidic texturing will remain valid<br />

20<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

21<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Products – Crystallization<br />

Material landscape <strong>for</strong> c-Si is expected to diversify (market shares o/a)<br />

Casted mc–Si will develop from<br />

classic mc- Si<br />

HPmc – Si<br />

mono–Si will split<br />

n- type will increase share<br />

p-type will reduce share<br />

share casted / mono is expected shift from 60:40 to 50:50 in 2023<br />

n-type mono material will be used <strong>for</strong> high eta cell concepts<br />

new mc-Si products (HPmc-Si)gain market share vs. conventional mc-Si casting<br />

mono-like material has less share due to non maturation<br />

22<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


ITR<strong>PV</strong> Results – Products – Cell / Module (1)<br />

Trends <strong>for</strong> Double sided contact c-Si cells<br />

Efficiencies of p-and n-type c-Si cells will rise<br />

- stabilized efficiencies only are considered<br />

- shown are cells out of a state of the art mass<br />

production line<br />

- gap between mono and multi remains valid<br />

Trend of output power of 60 cell modules<br />

- cell efficiency + module improvements included<br />

- trend implies shift to full square Mono<br />

- alkalic texturing is assumed <strong>for</strong> mono/mono-like<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012<br />

23


ITR<strong>PV</strong> Results – Products – Cell / Module (2)<br />

Diversification in c-Si cell concepts and Module products is expected<br />

Double sided contact cells remain main stream<br />

- rear side contact cells up to 35% in 2023<br />

- bi-facial cell concepts are expected<br />

Module size is expected to diversify<br />

- 60 cell modules remain main stream<br />

- > 20% share <strong>for</strong> large modules (≥72)<br />

- 10% share special sizes <strong>for</strong> niche markets<br />

- frameless modules gain market share<br />

(>20% from 2015 onwards)<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012<br />

24


ITR<strong>PV</strong> Results – Products – <strong>PV</strong> Systems<br />

Considerations of BOS cost trend <strong>for</strong> <strong>PV</strong> Systems >100kWp in different reagions<br />

BOS – cost excluding Module cost<br />

- Mounting, wiring, and inverter are most expensive elements<br />

- <strong>PV</strong> system set up is in competition w/ non <strong>PV</strong> industry<br />

i.e. cost reductions compete w/ increasing prices<br />

- Special solutions will reduce mounting cost<br />

Example: EU<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012<br />

25


AGENDA<br />

• Introduction of the 4 th edition of the ITR<strong>PV</strong><br />

• <strong>PV</strong> learning curve and cost considerations<br />

• ITR<strong>PV</strong> 4 rd edition - some results 2012<br />

- Materials<br />

- Processes<br />

- Products<br />

• Summary and Outlook<br />

26<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Summary Challenges – near term<br />

Basic challenge <strong>for</strong> near term: upgrades vs. new invest<br />

• Further reduction in process costs <strong>for</strong> poly-Si<br />

• cell-to-module conversion w/o power loss<br />

• Througput increase (front-end & back-end)<br />

• Efficiency increase with existing lines / technologies<br />

• Ongoing cost reduction<br />

• Silver reduction / plating technologies<br />

27<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Summary Challenges – mid term / long term<br />

• Further reduction in process costs <strong>for</strong> poly-Si<br />

• Wafer thickness reduction<br />

• Automation & cell-to-module integration<br />

• „new cell concepts“ vs. Standardizes processes<br />

• Ongoing cost reduction<br />

• Silver replacement (printing vs. Plating)<br />

• Different module types<br />

• Glass-glass / frameless<br />

• Efficiency increase as <strong>for</strong>ecasted<br />

• Picking the right / most promising technology (process)<br />

• Implementation of new sawing technologies<br />

28<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Summary ITR<strong>PV</strong><br />

ITR<strong>PV</strong> shows:<br />

- ways to reach cost reduction of <strong>PV</strong> generated electricity<br />

- Efficiency improvements have to be implemented without huge cost increases<br />

- costs per piece have to be reduced continuously in parallel to efficiency increases<br />

ITR<strong>PV</strong> is a common plat<strong>for</strong>m <strong>for</strong> manufacturers, suppliers, and customers<br />

Conclusion:<br />

- Further reduction of Si-<strong>PV</strong> manufacturing cost is possible<br />

without sacrificing quality and reliability<br />

- Increasing cell efficiencies will support the cost reduction<br />

Next Steps of ITR<strong>PV</strong>:<br />

- Include more manufactures from Asia and America<br />

- Create subgroups w/ focus on high-eta / rear-side concepts<br />

- Include equipment and material suppliers to provide solutions<br />

- Consider more system trends 29<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Outlook<br />

ITR<strong>PV</strong> parameter trends considered in different learning scenarios<br />

1) eta gain @ constant cost, 2) cost increase, 3) cost reduction + eta gain<br />

06/2012 12/2012 12/2013 12/2015 12/2017 12/2020 12/2023<br />

Cum. volume shipped (GWp)* 92 110 140 210 310 460 640<br />

Avg. Wp increase - 2% 4% 4% 6% 7% 7%<br />

Scenario 1 ($/Wp) 0.83 0.81 0.78 0.75 0.70 0.65 0,61<br />

Increased complexity - 0% 0% 3% 0% 0% 0%<br />

Scenario 2 ($/Wp) 0,83 0.83 0.83 0.85 0.85 0.83 0,83<br />

Cost reduction - 1% 5% 5% 10% 10% 10%<br />

Scenario 3 ($/Wp) 0,83 0.80 0.73 0.67 0.55 0.46 0,38<br />

Module pricing in June 2012<br />

Module pricing in January 2013<br />

= cost level (EU/US/J 0.8 $/Wp; PRC 0.65 $/Wp)**<br />

= below cost<br />

Possible and needed cost reductions will meet prices around 2015<br />

<strong>Roadmap</strong> identifies focus points<br />

efficiency gain is needed; cost reduction is mandatory<br />

* Yearly shipment volume between 30 GWp and 60 GWp<br />

** S. Mehta, GTM Study, Global <strong>PV</strong> Module Manufacturers 2013: Competitive Positioning, Consolidation and the China Factor”October 15, 2012<br />

30<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


<strong>Roadmap</strong> outlook: <strong>PV</strong> learning continues<br />

Efficiency gains and cost reductions per piece have to be combined<br />

31<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012


Questions?<br />

Stephan Raithel<br />

SEMI Europe<br />

Director <strong>PV</strong> Europe<br />

Helmholtzstrasse 2-9<br />

D-10587 Berlin, Germany<br />

sraithel@semi.org<br />

Cell: +49.170.4731126<br />

Phone:<br />

+49.30.3030807712

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