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International Technology Roadmap for PV - PVMC

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Summary Challenges – mid term / long term<br />

• Further reduction in process costs <strong>for</strong> poly-Si<br />

• Wafer thickness reduction<br />

• Automation & cell-to-module integration<br />

• „new cell concepts“ vs. Standardizes processes<br />

• Ongoing cost reduction<br />

• Silver replacement (printing vs. Plating)<br />

• Different module types<br />

• Glass-glass / frameless<br />

• Efficiency increase as <strong>for</strong>ecasted<br />

• Picking the right / most promising technology (process)<br />

• Implementation of new sawing technologies<br />

28<br />

2nd Annual c-Si <strong>PV</strong>MC Workshop,<br />

10 July 2013, San Francisco, USA<br />

ITR<strong>PV</strong> 4 th Edition – Results 2012

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