MANUAL WAFER BONDER - SUSS MicroTec
MANUAL WAFER BONDER - SUSS MicroTec
MANUAL WAFER BONDER - SUSS MicroTec
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Technical Data: SB6L Manual Wafer Bonder<br />
Material Size Limits Standard With Special Tooling<br />
Wafer size<br />
150 mm diameter<br />
Substrate size, minimum<br />
10 mm x 10 mm<br />
Wafer or Substrate Stack Thickness, maximum<br />
6 mm<br />
Maximum Elements in stack 2 3<br />
Bond Chamber Specs<br />
Vacuum 5E-1 mbar 1E-4mbar<br />
Pressure Regulation Accuracy, 10 to 100 mbar ± 2.0 %<br />
Pressure Regulation Accuracy, 5E-4 mbar to 10 mbar ± 2.0 %<br />
Purge Time from 1 mbar to Atmosphere<br />
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