MANUAL WAFER BONDER - SUSS MicroTec

MANUAL WAFER BONDER
SB6L
System Overview
The SB6L wafer bonder is designed specifically for research,
development, and pre-production wafer bonding markets.
Based on field-proven SUSS wafer bonding technology, the
SB6L is well suited for MEMS, advanced packaging and SOI
applications. The SB6L is compatible with SUSS MA/BA mask
aligners for wafer processes requiring precise bond alignment.
There are over 1,300 SUSS manual mask aligners in the field
today.
The SB6L wafer bonder has the same core technology as fullyautomated
SUSS bonders including high-accuracy post bond
alignment, precise temperature and force during bonding, and
computer-controlled wafer processing. The standard machine is
supplied on a metal frame platform with the vacuum chamber,
control electronics, and computer built-in, providing a professional
integrated look to the wafer bonding system.
The typical wafer bonding processes developed on the SB6L
bonder (such as anodic, glass frit, eutectic, thermocompression,
polymer and adhesive bonding), are transferable to
SUSS-automated, high-volume wafer bonding cluster tools.
This allows smooth transition from R&D to pilot line production
through to mass production.
Software
The SB6L wafer bonder incorporates an intuitive graphical user
interface. The recipe editor provides an overview on all parameters
at a glance and enables computer control of the bonding
process. This includes automatic error checking, temperature
ramp programming as well as full manual processing for
research and development applications.
SUSS provides customer technical equipment support with
options for user and service training, 24/7 on-site service staff,
spare parts stocking programs, and expert applications support.
Features and Benefits
Enabling Technology › Up to 7 µm post bond alignment
capability allows better yield and
opens up new applications
› Processes developed on SB6L
bonders are compatible with
high-volume SUSS wafer bonding
cluster systems
› Independent top and bottom
heaters compensates for different
thermal mismatch delivering
optimized bond quality
› Active cooling and fast heating
significantly reduces process
cycle times
› Controlled bond chamber atmosphere
(pressure and/or vacuum)
› SB6L bonders are compatible with
SUSS MA/BA mask aligners for
wafer processes requiring bond
alignment
› Extensive List of optional tooling
Flexibility
Ease of use
› Configurable up to 150 mm wafer
size and stack thicknesses up to
6 mm allows conversion capability
as wafer dimensions change
› One chamber designed for all
types of bond processes—
including anodic, glass frit,
thermocompression, SOI,
polymer and adhesive bonding
› Options for triple-stack bonding
› User-friendly Windows ® -based
graphical software is intuitive and
easily used in minutes
www.suss.com

Technical Data: SB6L Manual Wafer Bonder
Material Size Limits Standard With Special Tooling
Wafer size
150 mm diameter
Substrate size, minimum
10 mm x 10 mm
Wafer or Substrate Stack Thickness, maximum
6 mm
Maximum Elements in stack 2 3
Bond Chamber Specs
Vacuum 5E-1 mbar 1E-4mbar
Pressure Regulation Accuracy, 10 to 100 mbar ± 2.0 %
Pressure Regulation Accuracy, 5E-4 mbar to 10 mbar ± 2.0 %
Purge Time from 1 mbar to Atmosphere