Nokia 12 GSM Module Hardware Integration ... - KORE Telematics

NOKIA 12 GSM MODULE 

HARDWARE INTEGRATION MANUAL 

Copyright © 2003-2004 Nokia. All rights reserved. Issue 1.3 9231230

Contents 

ACRONYMS AND TERMS ......................................................................................................1 

1. ABOUT THIS DOCUMENT ................................................................................................3 

2. INTRODUCTION ................................................................................................................4 

3. MECHANICAL INTEGRATION...........................................................................................5 

3.1 DIMENSIONS ...............................................................................................................5 

4. ELECTRICAL INTEGRATION ............................................................................................7 

4.1 M2M SYSTEM CONNECTOR......................................................................................7 

4.1.1 Electrical characteristics ........................................................................................8 

4.1.2 Connector pin-out ..................................................................................................9 

4.2 GROUNDING .............................................................................................................16 

4.3 POWER SUPPLY .......................................................................................................16 

4.4 SERIAL COMMUNICATION.......................................................................................17 

4.4.1 PORT1.................................................................................................................17 

4.4.2 PORT2.................................................................................................................18 

4.4.3 PORT3.................................................................................................................18 

4.5 SIM INTERFACE ........................................................................................................18 

4.6 AUDIO INTERFACE ...................................................................................................19 

4.6.1 Analog audio........................................................................................................19 

4.6.1.1 Analog audio example ..................................................................................21 

4.6.1.2 Acoustic echo ...............................................................................................23 

4.6.2 Digital audio .........................................................................................................23 

4.6.2.1 Sign-extended linear code ............................................................................24 

5. RF AND ANTENNA INTEGRATION.................................................................................26 

5.1 ANTENNA INSTALLATION ........................................................................................26 

6. TEST BOARD FOR THE NOKIA 12 GSM MODULE .......................................................28 

6.1 POWERING................................................................................................................28 

6.2 SIM CARD READER ..................................................................................................28 

6.3 RS-232 CONVERTERS..............................................................................................28 

6.4 AUDIO ........................................................................................................................29 

7. CERTIFICATIONS............................................................................................................32

7.1.1 RX-2.....................................................................................................................32 

7.1.2 RX-9.....................................................................................................................32 

7.2 TECHNICAL REQUIREMENTS .................................................................................33 

7.2.1 SIM testing...........................................................................................................33 

7.2.2 Power supply .......................................................................................................33 

7.2.3 EMC/ESD and safety tests ..................................................................................33 

7.2.4 RF testing ............................................................................................................33 

7.2.5 RF exposure ........................................................................................................34 

7.2.6 Additional type approval notes.............................................................................34 

REFERENCES.......................................................................................................................35 

APPENDIX: NOKIA 12 TEST BOARD PART LIST, ASSEMBLY DRAWING AND 

SCHEMATICS ..................................................................................................................36

Legal Notice 

Copyright © 2003-2004 Nokia. All rights reserved. 

Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form without the 

prior written permission of Nokia is prohibited. 

Nokia and Nokia Connecting People are registered trademarks of Nokia Corporation. Java and all Java-based 

marks are trademarks or registered trademarks of Sun Microsystems, Inc. Other product and company names 

mentioned herein may be trademarks or trade names of their respective owners. 

Nokia operates a policy of continuous development. Nokia reserves the right to make changes and improvements 

to any of the products described in this document without prior notice. 

Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental, 

consequential or indirect damages howsoever caused. 

The contents of this document are provided "as is". Except as required by applicable law, no warranties of any 

kind, either express or implied, including, but not limited to, the implied warranties of merchantability and fitness 

for a particular purpose, are made in relation to the accuracy, reliability or contents of this document. Nokia 

reserves the right to revise this document or withdraw it at any time without prior notice. 

RX-9: 

FCC/INDUSTRY CANADA NOTICE 

Your device may cause TV or radio interference (for example, when using a telephone in close proximity to 

receiving equipment). The FCC or Industry Canada can require you to stop using your telephone if such 

interference cannot be eliminated. If you require assistance, contact your local service facility. This device 

complies with part 15 of the FCC rules. Operation is subject to the condition that this device does not cause 

harmful interference.

ACRONYMS AND TERMS 

Acronym/term 

A 

AC 

A/D 

API 

AT 

Description 

Ampere 

°C Celcius 

CE 

CORBA 

CMOS 

CSD 

CTS 

dB 

dBi 

DC 

DCD 

DCE 

DSR 

DTE 

DTR 

EARN 

EARP 

EDGE 

EGSM 

EMC 

ESD 

F 

Alternating Current 

Analog-to-Digital 

Application Programming Interface 

ATtention (command language) 

Mark for a product that fulfils the EU safety and 

R&TTE requirements 

Common Object Request Broker Architecture 

Complementary Metal-Oxide Semiconductor 

Circuit Switched Data 

Clear To Send 

Decibel 

Antenna Gain 

Direct Current 

Data Carrier Detect 

Data Circuit Terminating Equipment 

Data Set Ready 

Data Terminal Equipment 

Data Terminal Ready 

Earphone Amplifier Inverting Input Pin 

Earphone Amplifier Non-Inverting Input Pin 

Enhanced Data Rates for Global Evolution 

Extended GSM 

Electromagnetic Compatibility 

Electrostatic Discharge 

Farad 

°F Fahrenheit 

FCC 

GGSN 

GPRS 

Federal Communications Commission 

Gateway GPRS Support Node 

General Packet Radio Service 

1/44

Acronym/term 

GPS 

GSM 

HBM 

Hi-Z 

HSCSD 

HW 

Hz 

IC 

IP 

M2M 

MICN 

MICP 

MMCX 

PCB 

PCM 

RF 

RI 

RS-232 

RTS 

RX-2 

RX-9 

SIM 

SMS 

SW 

TCP 

UART 

UDP 

V 

W 

Description 

Global Positioning System 

Global System for Mobile Communication 

Human Body Model 

High Impedance 

High Speed Circuit Switched Data 

Hardware 

Hertz 

Integrated Circuit 

Internet Protocol 

Machine-to-machine 

Microphone amplifier inverting input pin 

Microphone amplifier non-inverting input pin 

Miniature Microax 

Printed Circuit Board 

Pulse Code Modulation 

Radio Frequency 

Ring Indicator 

Interface, standardised by the Electronic Industries 

Alliance (EIA), for communication between 

computers, terminals, and modems 

Request to Send 

Type designation for the Nokia 12 GSM module 

(EGSM 900/GSM 1800 MHz bands) 

Type designation for the Nokia 12 GSM module 

(GSM 850/GSM 1900 MHZ bands) 

Subscriber Identity Module 

Short Message Service 

Software 

Transmission Control Protocol 

Universal Asynchronous Receiver/Transmitter 

User Datagram Protocol 

Volt 

Watt 

2/44

1. ABOUT THIS DOCUMENT 

This document provides instructions for the Nokia 12 GSM module (hereafter 

Nokia 12 module) hardware integration. The document is intended to help the 

system integrator to integrate the Nokia 12 module into a remote end hardware 

application and to gain the necessary type approvals. 

The document describes the mechanical, electrical and radio frequency (RF) 

integration as well as antenna installation. In addition the document describes 

the technical characteristics of the Nokia 12 test board, and lists the 

certifications and technical requirements needed for type approval. 

Note: For more information on the Nokia 12 module usage and software 

integration, see the Nokia 12 GSM Module Product Specification, Nokia M2M 

Platform Software Developer’s Guide and Nokia M2M Platform Nokia 12 GSM 

Module IMlet Programming Guide. 

3/44

2. INTRODUCTION 

The Nokia 12 module has been designed for M2M (machine-to-machine) 

applications and other wireless solutions. There are two versions of the Nokia 

12 module: 

• RX-2 dual-band GSM device supporting EDGE, GPRS, HSCSD, CSD, and 

SMS in EGSM 900/GSM 1800 MHz bands 

• RX-9 dual band GSM device supporting EDGE, GPRS, CSD, SMS in GSM 

850/GSM 1900 MHZ bands. 

The Nokia 12 module can be used in several applications due to its three 

different operating modes. Simple I/O applications can be easily implemented 

by using the Nokia 12 module in the User control mode that offers message 

personalising, secure messaging, and timing functionality for SMS controlled 

I/O applications. In the AT command mode, the Nokia 12 module can be used 

as a GSM modem. In modem use, all supported bearers are available. The 

Nokia 12 module is Nokia M2M Platform compatible. In the M2M system mode, 

the Nokia 12 module communicates with the server application through the 

Nokia M2M Gateway, and all the compatible features of the Nokia 12 module 

are available for developing a wide range of M2M applications. 

In addition to the different operating modes, the Nokia 12 module has an 

integrated TCP/IP stack which enables direct GPRS or GSM data connection 

between a remote end application and a server application. Due to the 

integrated TCP/IP stack, the HTTP and Socket APIs of the Nokia 12 are 

available for application development. 

In addition to the bearers and operating modes listed above, the Nokia 12 

supports several Java APIs, location service for external GPS module 

integration, reliability features like AutoPIN, GSM encryption and security 

codes, reset mechanism and Nokia M2M Platform authentication. Java 

technology support enables upgrading the application software over-the-air, 

and smart messaging makes the installation flexible. GSM phase 2+ 

supplementary services enable voice application development. 

Note: All data bearers as well as TCP/IP are dependent on network support. 

4/44

3. MECHANICAL INTEGRATION 

The Nokia 12 module contains two holes for mounting screws. The screws can 

be used in mounting, but are not compulsory. The Nokia 12 module has been 

tested according to the automotive standard DIN 72300-3 (although not in 

various temperatures), and it can be integrated into various applications without 

the screws. 

3.1 DIMENSIONS 

The general dimensions and overall area of the Nokia 12 module are listed in 

Table 1 and Table 2. 

Table 1. General dimensions of the Nokia 12 GSM module (in millimetres 

and inches) 

Height 36 mm 1.41 inch 

Width 45 mm 1.77 inch 

Thickness 9 mm 0.35 inch 

Table 2. Overall area of the Nokia 12 GSM module (in square centimetres 

and square inches) 

Area 16.2 cm 2 2.48 inch 2 

The detailed physical dimensions (in millimeters) of the Nokia 12 module are 

shown in Figure 1. 

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Figure 1. Detailed physical dimensions of the Nokia 12 GSM module (in 

millimetres) 

6/44

4. ELECTRICAL INTEGRATION 

4.1 M2M SYSTEM CONNECTOR 

All signals are routed through the M2M System Connector, except the antenna, 

which is routed through the miniature microax (MMCX) RF connector. 

The M2M System Connector is a 60-pin (2 rows, 30 pins per row), 1.27 

mm/0.05 inch pitch pin header connector. It has a frame that helps in the 

physical integration and also holds the Nokia 12 module firmly in position. 

The possible mating connector is described in Table 3. 

Table 3. Possible mating connectors for the Nokia 12 module 

Supplier Part number Description 

SAMTEC SFMC-130-02-S-D Female connector. Board-to-board 

SAMTEC SFM-130-02-S-D Female connector. Board-to-board. 

With alignment mark. 

Table 4 defines the recommended operating conditions for the actual device 

and/or interface operation, and Table 5 defines the absolute maximum ratings. 

Table 4. Recommended operating conditions 

Parameter Value Note 

Supply Voltage (V BB ) 3.6…4.0 V (3.8 V typical) Voltage must never 

drop below the low 

limit. 

Logic voltage (I/O 

voltage) 

DC output source or sink 

current (any I/O pin, user 

adjustable) 

Operating temperature 

range 

1.8…5.0 V 

0…5 V Upper limit 

depending on I/O 

voltage. 

-10…+55 °C 

+14…+131 °F 

Table 5. Absolute maximum ratings 

Parameter 

Supply voltage 

DC input voltage (any signal pin) 

Value 

+4.2 V 

-0.5…5.5 V 

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Parameter 

Value 

Operating temperature range -25…+55 °C 

-13…+131 °F 

Storage temperature range -40…+85 °C 

-40…+185 °F 

4.1.1 Electrical characteristics 

All digital outputs (1-9) are open drain outputs, and all pins have a 10 kohm 

pull-up resistor to I/O voltage. 

Table 6. Digital output characteristics 

Parameter 

Application load resistance 

Application load capacitance 

High level output voltage minimum (Io=-20µA) 

Low level output voltage maximum (Io=1mA) 

Value 

>100 kohm 

Table 8. Digital input characteristics 

Parameter 

Application driving impedance 

Low level input voltage (IO VOLTAGE/pin 52 

1.8 - 5V) 

High level input voltage ((IO VOLTAGE/pin 52 

1.8 - 5V) 

Value 

Figure 2. Pin numbering of the Nokia 12 M2M System Connector 

The pin-out of the M2M System Connector in shown in Table 11. 

Table 11. M2M System Connector pin-out 

Pin Name Pin Name 

1 VBB 2 GND 

3 VBB 4 GND 

5 VBB 6 GND 

7 VBB 8 GND 

9 VBB 10 GND 

11 NC 12 NC 

13 NC 14 NC 

15 MICP 16 EARP 

17 MICN 18 EARN 

19 AD3 20 AD2 

21 PCMDCLK 22 PCMSCLK 

23 PCMTX 24 PCMRX 

25 RESET T 26 RESET A 

27 PORT1RX 28 NC 

29 PORT1TX 30 OUTPUT2 

31 OUTPUT3 32 OUTPUT4 

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Pin Name Pin Name 

33 OUTPUT5 34 INPUT6 

35 INPUT5 36 AD1 

37 BSI 38 PORT2RX 

39 PORT2TX 40 PORT2RTS 

41 PORT2CTS 42 OUTPUT8 

43 INPUT8 44 OUTPUT9 

45 SLEEPX 46 INPUT11 

47 VSIM 48 SIMRST 

49 SIMCLK 50 SIMDATA 

51 SIMDET 52 IO VOLTAGE 

53 OUTPUT1/P3RX 54 INPUT4/P3TX 

55 INPUT10 56 INPUT7 

57 OUTPUT6 58 OUTPUT7 

59 INPUT9 60 NC 

The pin functions are described in Table 12. 

Table 12. M2M System Connector pin descriptions 

Pin Name Description 

1 VBB Device power. Voltage nominal 3.8 V, 3.6 V – 4.0 V, 

maximum current 2A peak. Regulated power input for 

the Nokia 12 module. 

All V BB pins must be connected together at the 

application end. The device end is not fuse-protected, 

so the application should provide sufficient overload 

protection. 

Current consumption can be as high as 2 A when 

transmitting at full power. When the Nokia 12 module 

is transmitting data, there is a current peak (max. 2A ) 

at 4.6 ms intervals that lasts 0.577ms (1 TX slot) or 

1.154 ms (2 TX slots). Average power consumption is 

about 500 mA. The power supply should be designed 

according to this. 

If the operating voltage falls below 3.4 V, the Nokia 

12 module automatically shuts down. For more 

information on the power supply, see Chapter 4.3. 

2 GND Return ground for device power. These pins are used 

for device power (V BB ) return ground. Connect to 

common ground. All GND pins must be connected at 

11/44


3 VBB See PIN 1 

4 GND See PIN 2 







11 NC Not used 

12 NC Not used 



the application end. For more information on 

grounding, see Chapter 4.2. 

15 MICP MICP is used with analog audio as differential 

positive input. The line is AC coupled at the device 

end. Frequency response is 300 - 3400 Hz. For more 

information on the analog audio, see chapter 4.6.1. 

16 EARP EARP is used with analog audio as differential 

positive output. Frequency response is 300 - 3400 

Hz. For more information on the analog audio, see 

Chapter 4.6.1. 

17 MICN MICN is used with analog audio as differential 

negative input. The line is AC coupled at the device 

end. Frequency response is 300 - 3400 Hz. For more 

information on the analog audio, see chapter 4.6.1. 

18 EARN EARN is used with analog audio as differential 

negative output. Frequency response is 300 - 3400 

Hz. For more information on the analog audio, see 

chapter 4.6.1. 

19 AD3 Input for 10 bit analog-to-digital (A/D) converter. The 

application end must scale voltage level between 0 - 

2.8 V. 

20 AD2 See PIN 19 

21 PCMDCLK PCMDCLK is a 512 kHz digital audio clock from the 

application module. Logic level is set by the IO 

VOLTAGE pin (pin 52). For more information on the 

digital audio, see Chapter 4.6.2. 

22 PCMSCLK PCMSCLK is one PCMDCLK cycle that repeats itself 

every 64 PCMDCLK cycles. Frame sync frequency is 

thus is 8 kHz. The logic level is set by the IO 

12/44


VOLTAGE pin (pin 52). For more information on the 

digital audio, see Chapter 4.6.2. 

23 PCMTX Digital audio, transmits data from the device to the 

application. Logic level is set by the IO VOLTAGE pin 

(pin 52). For more information on the digital audio, 

see Chapter 4.6.2. 

24 PCMRX Digital audio, receives data from the application to the 

device. Logic level is set by the IO VOLTAGE pin (pin 

52). For more information on the digital audio, see 

Chapter 4.6.2. 

25 RESET T Reset input for the Nokia 12 module, active low. The 

Nokia 12 module is reset when this line is low. Logic 

level is set by the IO VOLTAGE pin (pin 52). 

Minimum duration is approximately 500 ms. 

26 RESET A Reset output for the application, active low. Reset 

goes high after approximately 170 ms of power-up. 

Logic level is set by the IO VOLTAGE pin (pin 52). 

27 PORT1RX PORT1 receive. PORT1RX is an asynchronous serial 

channel receive pin. Functionality otherwise as in pin 

29, PORT1TX. Logic level is set by the IO VOLTAGE 

pin (pin 52). 


29 PORT1TX PORT1 transmit. PORT1TX is an asynchronous 

serial channel transmit pin that can be used with pin 

27 (PORT1RX) to form a full duplex serial link. Pins 

30-35 can be used to provide handshaking functions. 

Logic level is set by the IO VOLTAGE pin (pin52) 

30 OUTPUT2 Digital output from device. Logic level is set by the IO 

VOLTAGE pin (pin 52). If the AT command mode is 

active, this pin is used as a Data Carrier Detect 

(DCD) output for Port 1. 

31 OUTPUT3 Digital output from module. Logic level is set by the 

IO VOLTAGE pin (pin 52). If the AT command mode 

is active, this pin is used as Data Set Ready (DSR) 

output for Port 1. 


I/O voltage pin (pin 52). If the AT command mode is 

active, this pin is used as Clear To Send (CTS) output 

for Port 1. 


IO VOLTAGE pin (pin 52). If the AT command mode 

is active, this pin is used as Ring Indicator (RI) output 

for Port 1. 

34 INPUT6 Digital input to module. Logic level is set by the IO 


active, this pin is used as Request To Send (RTS) 

13/44


input for Port 1. 

35 INPUT5 Digital input to module. Logic level is set by the IO 


active, this pin is used as Data Terminal Ready (DTR) 

input for Port 1 

36 AD1 Input for 10 bit A/D converter. The application end 

must scale voltage level between 0 to 2.8 V. 

37 BSI Input for 10 bit A/D converter. The application end 

must scale voltage level between 0 to 2.8 V. 

38 PORT2RX PORT2 receive. PORT2RX is an asynchronous serial 

channel receive pin and it is used with pin 39. Logic 

level is set by the IO VOLTAGE pin (pin 52). 

39 PORT2TX PORT2 Transmit. PORT2RX is an asynchronous 

serial channel transmit pin that is used with pin 38. 

Logic level is set by the IO VOLTAGE pin (pin 52). 

40 PORT2RTS RTS for PORT2. PORT2RTS provides handshaking 

signal for asynchronous communication between the 

Nokia 12 module and the application when using 

PORT2. Works together with pin 41. Logic level is set 

by the IO VOLTAGE pin (pin 52). 

41 PORT2CTS CTS for PORT2. PORT2CTS provides handshaking 

signal for asynchronous communication between the 

Nokia 12 module and the application when using 

PORT2. Works together with pin 40. Logic level is set 


42 OUTPUT8 Digital output from the Nokia 12 module. Logic level is 

set by the IO VOLTAGE pin (pin 52). 

43 INPUT8 Digital input to the Nokia 12 module. Logic level is set 




45 SLEEPX Sleep indicator of the Nokia 12 module. When the 

Nokia 12 module is in the sleep mode, the level of 

this output pin is low, otherwise high. The sleep mode 

is automatic. Logic level is set by the IO VOLTAGE 

pin (pin 52). 



47 VSIM Operating voltage for the SIM card, generated by the 

Nokia 12 module. For more information on the SIM 

interface, see Chapter 4.5. 

48 SIMRST Reset signal for the SIM card, generated by the Nokia 

12 module. For more information on the SIM 


14/44


49 SIMCLK Clock signal for the SIM card, generated by the Nokia 

12 module. For more information on the SIM 


50 SIMDATA Data line between the SIM card and the Nokia 12 

module. For more information on the SIM interface, 

see Chapter 4.5. 

51 SIMDET SIM card detection signal. For more information on 

the SIM interface, see Chapter 4.5. 

52 IO VOLTAGE This pin sets logic level for the application. Voltage 

must be 1.8 V - 5.0 V. For more information on the 

power supply, see Chapter 4.3. 

53 OUTPUT1 / 

PORT3RX 

Digital output from the Nokia 12 module. Logic level is 

set by the IO VOLTAGE pin (pin 52). If PORT3 is 

configured for serial communication, this is a receive 

(input) signal. 

54 INPUT4 / 

PORT3TX 

Note! Direction changes if pin 53 is configured for 

serial communication. 

Digital input to the Nokia 12 module. Logic level is set 

by the IO VOLTAGE pin (pin 52). If PORT3 is 

configured for serial communication, this is a 

transmitter (output) signal. 

Note! Direction changes if pin 54 is configured for 

serial communication. 












15/44

4.2 GROUNDING 

There is only one common ground for the power supply and I/Os in the Nokia 

12 module. That is, there are no separate analog/digital ground pins in the M2M 

System Connector. 

All ground pins must be connected together at the application end. Grounding 

through screws is not allowed. The mounting screws must be isolated from the 

application ground. 

4.3 POWER SUPPLY 

The Nokia 12 module is powered by the hardware application to which it is 

integrated. The operating voltage must not fall below the specification limit 

under any circumstances. The recommended operation conditions are shown in 

Table 4. For example, at full power, the TX can be up to 2 A, when current is 

drawn from the power supply. There are no capacitors on the power supply line 

of the Nokia 12 module, so the application must provide sufficient filtering. 

The power supply must be capable of supplying at least 3 W average power, 

but it is recommended that the power supply also provides the peak current. 

Otherwise a large capacitor bank is needed to compensate the voltage drop 

during transmit bursts. 

The Nokia 12 module does not have protection for over-voltage of current, so 

the hardware application must be equipped with one if there is a possibility for 

over-voltage. The hardware application should at least include a fuse. 

The ripple on the operating voltage must not exceed 100 mV and the voltage 

must never drop below 3.6 V during operation. 

The application must also produce I/O voltage. The logic levels of digital inputs 

and outputs correspond to this I/O voltage. I/O voltage can be supplied from a 

linear regulator. 

16/44

Figure 3. Example powering with simple DC/DC converter and linear 

regulator 

4.4 SERIAL COMMUNICATION 

The Nokia 12 module is accessible through three different asynchronous serial 

interfaces with different protocols. The pins provide one asynchronous channel 

with a simple handshaking capability. The usage of the 3 ports can be 

configured with the Nokia 12 Configurator software. The Nokia 12 Configurator 

is downloadable at www.forum.nokia.com/m2m free of charge. 

The Nokia 12 module supports the industry standard DB9 RS-232C connection, 

but an external level converter is required. For more information on the 

available handshake signals for different ports, see Chapters 4.4.1, 4.4.2 and 

4.4.3. 

The Nokia 12 module is a DCE (Data Communication Equipment) and the 

hardware application to which it is integrated is a DTE (Data Terminal 

Equipment). One possible method of implementing the level conversions is to 

use a MAX3237 transceiver or an equivalent integrated circuit (IC) level 

converter. 

Note: When port settings are changed, the new settings will not become valid 

until the Nokia 12 module is restarted. 

4.4.1 PORT1 

PORT1 provides the first asynchronous channel. This port can be used with full 

8 signal RS-232 handshaking signals. The baud rate for PORT1 can be 

between 1200 and 230400 bit/s. 

17/44

Note: Baud rate 230400 bit/s can be used only with AT command mode and 

autobauding. 

There are several settings for PORT1. The default setting for PORT1 is ‘HW 

Detection’. This means that when a 68 kohm resistor is set between the BSI 

(pin 37) and the ground, the Nokia 12 module enters the AT command mode 

when it is started. It is also possible to set the AT command mode on by using 

the Nokia 12 Configurator (the connection type is set to ‘AT’). 

The Nokia 12 module provides all signals for the industry standard DB9 RS- 

232C connection, but an external level converter is required. 

4.4.2 PORT2 

PORT2 provides the second asynchronous channel with a simple handshaking 

capability (only RTS and CTS). The baud rate for PORT2 can be set to 9600, 

19200, 38400, 57600 or 115200 bit/s. PORT2 is the default port for using the 

M2M System Protocol. However, if PORT1 is configured to use the M2M 

System Protocol, PORT2 cannot be used. 

4.4.3 PORT3 

PORT3 provides the third asynchronous channel with no hardware 

handshakes. The baud rate for PORT3 can be set between 1200 and 115200 

bit/s. 

4.5 SIM INTERFACE 

All leads from the M2M System Connector to the SIM card reader must be 

shorter than 15 cm/5.9 inches, because the voltage drop and increasing 

capacitance will affect timing. Furthermore, it is recommended that a 100 nF 

bypass capacitor is placed as close as possible to the SIM reader on the VSIM 

(pin47) line. 

The leads between the M2M System Connector and the SIM card reader must 

be protected against interferences, and that is why the striplines must always 

be placed within the interlayers of the printed circuit board (PCB). 

Note: The striplines must never be placed to the overlayer of the PCB. 

A possible SIM card reader supplier is listed in Table 13. 

Table 13. Possible SIM card reader supplier 

18/44

Supplier Part Number Description 

Amphenol M-C707_10M006_522_2 SIM reader with a lid open 

indication switch. 

DATA NC GND 

7 5 5 

3 2 1 

CLK RST VSIM 

Figure 4. SIM card connections (using Amphenol) 

The Nokia 12 module supports 1.8 V and 3 V SIM cards, and it automatically 

sets the correct voltage according to the SIM card that is used. 

Note: The SIM card reader must have a switch that indicates when the SIM card 

is being removed, so that the Nokia 12 module can shut it down correctly. The 

switch must open when the card is removed or the lid is open. The Nokia 12 

module has a pull-up in the SIM detection line, so the hardware application must 

connect the other end of the switch to the ground. 

4.6 AUDIO INTERFACE 

4.6.1 Analog audio 

The M2M System Connector provides possibilities to build different kind of 

audio applications around the Nokia 12 module. 

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The analog TX path (from the external application to the Nokia 12 module) has 

a DC isolation inside the Nokia 12 module with 100 nF capacitors, and these 

capacitors together with the microphone preamplifier input impedance form a 1 st 

order high pass filter with 32 Hz roll-off (-3 dB). 

Table 14. Microphone audio characteristics 

Name Symbol Min Type Max Units 

Differential input 

voltage range for 

microphone input 

(MICP & MICN) 

Microphone amplifier 

input resistor 

Common mode voltage 

level 

0.316 2.0 V PP 

RMIC 30 50 kohm 

VCM 1.3 1.35 1.4 V 

The earphone lines from the Nokia 12 module are driven differentially to 

achieve the best possible audio quality, free of radio frequency noise. In the 

differential mode, positive output is driven from EARP and negative signal from 

EARN output. 

Table 15. Earphone audio characteristics 

Name Test condition Min Type Max Units 

Output voltage swing 

in fully differential 

mode 

EARP to EARN 0.316 2 V PP 

Output resistance 1 ohm 

Load resistance 

Load resistance 

Load capacitance 

Common voltage level 

for Earphone output 

EARP to EARN 

(with dynamic 

transducer) 

EARP to EARN 

(with external 

audio circuitry) 

EARP to EARN 

(with external 

audio circuitry) 

30 45 ohm 

1 kohm 

10 nF 

VCMEar 0.75 0.8 0.85 V 

Offset voltage -50 50 mV 

20/44

The following chapter gives an example of using the audio properties of the 

Nokia 12 module for voice communication purposes. The circuits presented in 

the example illustrate the connection methods. 

There are also other possibilities for using the Nokia 12 audio interface. The 

presented component values are examples only; the customer can adjust the 

application-specific values to achieve the best performance for the application 

in question. 

4.6.1.1 Analog audio example 

Analog TX path: Due to the small audio signal level of the electret microphone, 

it is recommended to use a preamplifier for the microphone before connecting it 

to the Nokia 12 module. It is strongly recommended to protect the differential 

connection against RF noise. A microphone preamplifier with 20 dB input gain 

is recommended for reasonable uplink audio levels. 

Microphone input: See Figure 5. 

VANA 

R5 

R4 

VANA 

C1 

VANA 

R3 

- 

C2 

MicP 

R1 

+ 

R6 

R7 

VANA 

R2 

- 

+ 

C3 

MicN 

Figure 5. Single-ended microphone pre-amplifier 

Analog RX path: In voice applications, the Nokia 12 module is able to drive an 

earphone application without external electronics. However, it is also possible 

to build a high-volume loudspeaker application by using an external power 

amplifier with a high sensitivity loudspeaker. The following paragraphs show 

example circuits for both cases. 

21/44

Earphone application: An earphone can be connected to the Nokia 12 module 

without external components. In Figure 6 external components are used for 

EMC purposes to optimise audio quality and reliability. 

R1 

L1 

R2 

C1 

C2 

J1 

J2 

Figure 6. Earphone application circuit 

The recommended earphone type is dynamic. The maximum allowed load for 

this application is 32 ohm. In the example circuit, L1 is the common mode 

choke for the suppression of common mode disturbance in the earphone lines. 

J1 and J2 are surge protector gaps for ESD protection. These can be replaced 

with varistor or any other state-of-the-art ESD protection component. C1 and 

C2 are used for RF noise filtering. 

R1 and R2 are used as an attenuator if the signal level from the Nokia 12 

module is too high for the application. These resistors can be replaced with 

linear potentiometers and thus get adjustable volume control for the earphone 

application. The following component list gives example values for the circuit: 

• L1= 1000ohm@100MHz 

• C1=C2=27pF 

• R1=R2= Must be defined together with the sensitivity of the earphone 

External Audio Power amplifier: External audio power must be used if there 

is a need to drive low impedance load as loudspeaker. Figure 7 shows an 

example connection circuit for differential audio boomer. In this application only 

the connection interface to the Nokia 12 module is presented. For more detailed 

information on the boomer connections and specification, see the boomer 

manufacturer application note. 

22/44

VDD 

C4 

R2 

Differential Audio 

Boomer 

VDD 

EarP 

EarN 

C1 

C2 

R1 

R3 

- 

+ 

R5 

R4 

VDD 

R6 

Bypass 

- 

C3 

Bias 

+ 

Shutdown control 

Figure 7. Differential external power amplifier connection 

Refer to the audio boomer manufacturer and loudspeaker application notes for 

information on maximum safe ratings for the selected components. Also keep in 

mind the limitation of V DD to avoid overdriving the audio boomer and thus 

distorting the output signal unnecessarily. 

4.6.1.2 Acoustic echo 

Because in a GSM voice call the uplink and downlink audios are activated at 

the same time, it is recommended to use common sense when evaluating a 

suitable distance between the loudspeaker and the microphone. The acoustic 

echo canceller inside the Nokia 12 module is tuned so that the optimum result 

is achieved with 20 cm or longer distance between the microphone and the 

speaker. It is also advisable to locate the microphone and the loudspeaker so 

that they are pointed away from each other to achieve the best possible doubletalk 

performance. 

4.6.2 Digital audio 

There is a pulse code modulation (PCM) codec interface in the Nokia 12 

module for digital audio support. The digital audio interface supports signextended 

13-bit linear code (total 16 bits are transmitted). 

23/44

4.6.2.1 Sign-extended linear code 

PCM digital audio data transmission between the Nokia 12 module and the 

application is handled with four signals: PCMDCLK, PCMSCLK, PCMTX, and 

PCMRX. The format of the data transmission is sign-extended 13-bit linear 

code. A total of 16 bits are transmitted, and higher order bits must be signextended. 

Transmission of data commences after frame sync (PCMSCLK) rises 

high for one PCMDCLK clock cycle. After returning low, each data bit is 

transmitted on the falling edge of PCMDCLK. 

PCMDClk 

PCMSClk 

PCMTxData 

PCMRxData 

15 14 13 12 11 10 

MSB 

Sign extended 

15 14 13 12 11 10 

MSB 

Sign extended 

0 

LSB 

0 

LSB 

Figure 8. Timing of clock and transmission signals 

The application must provide both the PCMDCLK and PCMSCLK. PCMDCLK 

frequency is 512 kHz and PCMSCLK is repeated at 8 kHz, that is, at every 64th 

clock cycle. All bits but the 16 data bits following the frame sync are discarded. 

PCMDCLK has a typical 50 % duty-cycle; a variation of 5 % can be tolerated. 

For detailed timing, refer to Figure 9 and Table 16. Tcyc is the cycle time (1.953 

microseconds) of the 512 kHz clock. The PCMSCLK rising edge must occur at 

the maximum of 8 ns after the PCMSCLK rising edge. 

The pulse width of the frame sync pulse should be one data clock cycle. 

PCMDClk 

Td(SCL) 

PCMSClk 

Td(PCMTxData) 

PCMTxData 

PCMRxData 

Th(PCMRxData) 

Tsu(PCMRxData) 

MSB 

MSB 

Figure 9. PCM timing diagram 

24/44

PCM timing characteristics are described in Table 16. The coding format 

presented in Table 16 is supported, for example, by the Motorola type 

MC145483 codec. 

Table 16. PCM timing characteristics 

Parameter Symbol Min Max Unit 

Delay time (PCMSClk valid after 

PCMDClk rising) 

Delay time (PCMTxData valid 

after PCMDClk rising) 

PCMRxData setup time before 

PCMDClk falling edge 

PCMRxData hold time after 

PCMDClk falling edge 

Td(SClk) 0 8 ns 

Td(TxData) 5 25 ns 

Tsu(RxData) 20 Tcyc-20 ns 

Th(RxData) 20 Tcyc-20 ns 

25/44

5. RF AND ANTENNA INTEGRATION 

The RF requirements for the Nokia 12 module are type-dependent: 

• RF requirements for the RX-2 type follow the ETSI EGSM900/GSM1800 

phase2+ specifications. 

• RF requirements for the RX-9 type follow the ETSI GSM850/GSM1900 

phase2+ specifications. 

Table 17. RF specifications for the Nokia 12 GSM module 

Parameter Value Description 

RF impedance 50 ohm 

RF power 2W (class 4) EGSM900 & GSM 850 

1W (class 1) GSM1800 & GSM 1900 

The RF signal from the Nokia 12 module to an external antenna goes trough 

the MMCX connector. 

An adapter cable between the MMCX connector and the antenna may be 

needed. Suitable connectors and cables are available, for example, from 

Amphenol, TYCO, and IMS Connector Systems. 

The Nokia 12 module is certified with a Smarteq dual-band antenna (art no: 

1140.26 for 900/1800MHz and 1140.27 for 850/1900MHz). Suitable antennas 

are available, for example, from Smarteq and Hirschmann. 

For more information on the RF exposure, see Chapter 7.2.5. 

5.1 ANTENNA INSTALLATION 

The antenna must be placed within a good RF field; a location where the signal 

strength is adequate. A hand-portable phone can be used to check the best 

location for the antenna. 

Note: Electronic devices can cause interference, which affects the performance of 

the Nokia 12 module. Do not place the antenna close to electronic devices or 

other antennas. 

If an additional cable is needed between the antenna and the Nokia 12 module, 

use low-loss cables (for example RG-58. Amphenol, Suhner, etc.) and 

connectors. Every additional cable, adapter, and connector increases the loss 

of signal power. 

26/44

When designing the hardware application to which the Nokia 12 module is 

integrated into, it is important to take care of RF emissions. Do not place any 

sensitive components or striplines near the antenna or the antenna connector. 

For more information on the RF exposure, see Chapter 7.2.5. 

27/44

6. TEST BOARD FOR THE NOKIA 12 GSM MODULE 

The Nokia 12 test board is a hardware development tool for application 

developers and system integrators. It manages DC voltages, SIM card, I/O’s, 

and audios. You can measure several interfaces by pin headers, and the 

software interfaces of the D9 connectors can be seen and handled. The device 

can be reset with the reset button on the test board PCB. 

The Nokia 12 module has been type approved with the Nokia 12 test board. For 

more information on the Nokia 12 test board, see Appendix: Nokia 12 test 

board part list, assembly drawing and schematics. 

6.1 POWERING 

A 3A step down converter is used to produce module V CC . Low ESR capacitors 

are used. 

Table 18. Powering for the Nokia 12 test board 

6.2 SIM CARD READER 

The SIM card reader is directly connected to the M2M System Connector. The 

VSIM (pin47) decoupling capacitor must be present in all designs. To see the 

connections between the SIM card reader and the M2M System Connector, see 

Figure 4. 

6.3 RS-232 CONVERTERS 

All three serial ports of the Nokia 12 module are equipped with RS-232 level 

translators and D9 connector in the test board. If they are not used, there is a 

switch that can be used to set the converters in the Hi-Z mode. 

28/44

6.4 AUDIO 

For testing analog audio, the test board includes a connector for the Nokia 

HSU-3 handset. The HSU-3 handset can be purchased from Nokia dealers. 

Figure 10. Nokia 12 test board microphone amplifier 

The Nokia 12 test board and its key components are shown in Figure 11. 

Figure 11. Nokia 12 test board components 

The Nokia 12 test board includes the following switches: 

29/44

• RS-232 translator switches for PORT1 and PORT2/PORT3 

− 

− 

When the RS-232 translators are on, PORT1 and PORT2/PORT3 are 

connected the Nokia 12 module via the M2M System Connector. 

When the RS-232 translators are off, PORT1 and PORT2/PORT3 are 

not connected the Nokia 12 module via the M2M System Connector. 

When the RS-232 translators are off, it is possible to establish a 

connection to the Nokia 12 module by using the pin headers (1-4). 

• Microphone input selection switches 

− 

− 

MIC FROM HSU-3 means that microphone signals are routed from the 

HSU- 3 connector on the testboard to the Nokia 12 module. 

MIC FROM PIN HEADER means that microphone signals are routed to 

pins 10 and 11 in pin header X100 on testboard edge. 

• Communication mode switches 

− 

− 

When the switches are in the normal mode position, the BSI line of the 

Nokia 12 module is floating. 

When the switches are in the AT mode position, a 68 kohm resistor is 

connected between the Nokia 12 module BSI line and ground. 

Note: To use the normal mode/AT mode settings on the test board, the 

connection type setting on the Nokia 12 Configurator must be set to ‘HW 

Detection’. If the connection type setting on the Nokia 12 Configurator is set to 

‘AT’, the communication mode switch settings on the Nokia 12 test board are 

overridden. 

The use of the switches on the Nokia 12 test board is illustrated in Figure 12. 

30/44

Figure 12. Nokia 12 test board switch usage 

31/44

7. CERTIFICATIONS 

The test house requires the following documentation from the application 

integrator for type approval tests: 

• Hardware description 

• Schematics 

• Block diagram 

• PWB/component layout 

• Bill of materials 

• HW/SW versions used in tests. 

• Summary of application 

• User’s guide 

If the application HW or SW changes, the integrator is responsible for verifying 

the effect, and if needed, to perform all required tests again in an accredited 

laboratory. 

7.1.1 RX-2 

The Nokia 12 module (RX-2) is a CE marked device. In order to show 

compliance to R&TTE requirements, the integrator has to show that all the 

instructions in this document have been followed in the integration, and a 

declaration of conformity has been written. 

The final product must carry CE marking to show compliance with all the 

directives that are applicable to it. The numbers of all the Notified Bodies 

involved in every aspect of the conformity assessment must be shown next to 

the CE marking with any additional markings that can be needed (for example, 

Alert symbol for WLAN). The technical documentation explains the role of each 

Notified Body. If external elements are designed according to this document, 

only the following tests must be carried out in an accredited laboratory: 

• EMC tests in all working modes (EN 301 489-1/7, 3GPP TS 51.010) 

• Safety (Europe: EN/IEC 60950) 

7.1.2 RX-9 

The Nokia 12 module (RX-9) is an FCC equipment authorized device (47CFR 

15, 22, 24). If external elements are designed according to this document, only 

the following tests must be carried out in an accredited laboratory: 

32/44

• FCC equipment authorization (all applicable parts of 47CFR15) 

7.2 TECHNICAL REQUIREMENTS 

7.2.1 SIM testing 

SIM testing is not needed, because the SIM card reader is a passive 

component. In the implementation, SIM presence must follow the type approval 

conditions of the Nokia 12 module. 6- or 8-pin SIM card readers can be used. 

For more information on the SIM interface, see Chapter 4.5. 

7.2.2 Power supply 

The power supply must be designed as advised in Chapter 4.3. If this 

specification is exactly followed and fulfilled, the number of required RF tests is 

minimized in the type approval process. 

Note: If the power supply specification is not followed, the Nokia 12 module type 

approval is not valid. 

7.2.3 EMC/ESD and safety tests 

EMC and safety tests according to GSM standards (EN 301 489-1/7, 3GPP TS 

51.010 and EN 60 950) are mandatory and must be completed by the 

application integrator. The integrator should guarantee overall ESD protection 

in the integrated application (EN 301 489). 

Note: The Nokia 12 test board is an ESD supersensitive device. 

7.2.4 RF testing 

The antenna must be connected to the Nokia 12 module as this document 

instructs. The antenna impedance has to be as specified in Chapter 5. Further 

passive RF testing for the type approval is not required. Radiation performance 

is always the responsibility of the integrator. 

Note: If the antenna specification is not followed, the Nokia 12 type approval is not 

valid. 

33/44

7.2.5 RF exposure 

In order to comply with the RF exposure requirements, install the antenna so 

that a minimum separation distance of 20 cm/7.9 inch can be maintained 

between the antenna and all persons. 

If some other antenna than the one in the sales package is used, it must be 

ensured that the maximum antenna gain of 3 dBi is not exceeded. 

RX-2 

If the application does not provide a separation distance of at least 20 cm/7.9 

inch, the integrator must carry out all needed certifications. 

RX-9 

The Nokia 12 module cannot be used in applications that allow the separation 

distance between antenna and all persons to be less than 20 cm/7.9 inch. 

7.2.6 Additional type approval notes 

Changes in the application software have no effect on type approval issues. 

If the Nokia 12 module software is updated, no type approval actions are 

required from the application integrator. All Nokia products are officially type 

approved. 

Any changes to the RF path are not allowed. Power supply instructions must be 

followed. 

RX-9 

The Nokia 12 module (RX-9) type label has the FCC ID number to indicate that 

it is FCC equipment authorized. If the application prevents the label from being 

visible, the application must be labeled so that it contains the text: “Contains 

FCC ID LJPRX-9”. 

34/44

REFERENCES 

Nokia M2M customer documents 

The following Nokia M2M customer documents are available at 

http://www.forum.nokia.com/m2m or http://www.americas.forum.nokia.com. 

/1/ Nokia M2M Platform Software Developer’s Guide 

/2/ Nokia M2M Platform Nokia 12 GSM Module IMlet Programming Guide 

/3/ Nokia 12 GSM Module Product Specification 

General standards and specifications 

/1/ 3GPP TS 51.010, Digital cellular telecommunication system (Phase 2+) 

Mobile Station (MS) conformance specification 

/ 3rd Generation Partnership Project (3GPP) 

/2/ 47CFR 15, 22, 24,Code of Federal Regulations, 47: Telecommunication 

Part 15: Radio frequency devides 

Part 22: Public mobile services 

Part 24: Personal communications services 

/ Federal Communications Commission (FCC) 

/3/ DIN 72300-3 Electrical and electronic equipment for road vehicles - 

Environmental condititons - Part 3: Mechanical loads 

/ Deutsches Institut fur Normung (DIN) 

/4/ EN 301 489-1/7 Electromagnetic compatibity and Radio spectrum Matters 

(ERM); Electro-Magnetic Compatibility (EMC) standard for radio 

equiment and services 

Part 1: Common tecnical requirements 

Part 7: Specific conditions for mobile and portable radio and ancillary 

equipment of digital cellular radio telecommunications systems (GSM and DCS) 

/ European Telecommunications Standards Institute (ETSI) 

/5/ EN/IEC 60950 Safety of Information technology equipment 

/ European Committee for Electrotecnical Standardization (Cenelec) 

35/44

APPENDIX: NOKIA 12 TEST BOARD PART LIST, ASSEMBLY 

DRAWING AND SCHEMATICS 

This appendix includes the Nokia 12 test board part list, assembly drawing and 

schematics. The reference numbers and x/y axis indicators on the part list can 

be used to locate the Nokia 12 test board parts on the assembly drawing. 

Table 19. Nokia 12 test board part list 

Ref. X Y Component 

Component 

value 

C100 J 13 Chipcap X7R 10% 50V 0402 1n0 50V 

C101 J 14 Cer. cap 10uF 16V Z 1210 10u 16V 

C102 I 14 Tantal cap 20% 35V 100n_35V 35V 

C103 I 14 Tantal cap 20% 35V 100n_35V 35V 

C104 K 13 CHIPCAP X5R 100N K 10V 0402 100n 10V 

C105 K 13 Chipcap 5% NP0 22p 50V 


C107 K 13 CHIPCAP X5R 100N K 10V 0402 100n 10V 


C109 K 14 CHIPCAP NP0 180P J 25V 0402 180p 25V 


C111 K 13 CHIPCAP NP0 180P J 25V 0402 180p 25V 

C112 K 12 Chipcap 5% NP0 22p 50V 

C113 M 14 CHIPCAP X5R 1U0 10V 0805 1u0 10V 

C114 M 13 CHIPCAP X5R 1U0 10V 0805 1u0 10V 

C115 M 13 Chipcap 5% NP0 150p 50V 

C116 M 13 CHIPCAP X7R 18N J 25V 0603 18n 25V 

C117 M 12 Chipcap X7R 10% 16V 0402 10n 16V 

C118 K 13 CHIPCAP X5R 1U0 10V 0805 1u0 10V 

C119 J 12 Chipcap 5% NP0 22p 50V 

C120 J 12 chipcap x7r 47n k 10v 0402 47n 10V 

C121 J 12 CHIPCAP X5R 4U7 K 6V3 0805 4u7 6V3 

Voltage 

C122 I 13 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V 

C123 J 12 Chipcap X7R 5% 16V 0402 10n 16V 

C124 I 13 Chipcap 5% NP0 22p 50V 

C125 G 14 Cer. cap 10uF 16V Z 1210 10u 16V 

36/44


Component 

value 

C126 H 14 Cer. cap 10uF 16V Z 1210 10u 16V 

C400 P 11 CHIPCAP X5R 4U7 K 6V3 0805 4u7 6V3 

Voltage 

C401 O 11 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V 

C402 M 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V 

C403 L 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V 

C404 K 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V 

C405 J 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V 

C406 H 10 CHIPTCAP 470U M 10V L7.3X4.3X4.1 470u_10V 10V 

C412 P 14 CHIPCAP X7R 100N K 25V 0805 100n 25V 

C413 P 11 CHIPCAP X7R 100N K 25V 0805 100n 25V 

C414 O 13 CHIPCAP X7R 100N K 25V 0805 100n 25V 



C417 J 15 Chipcap X7R 10% 50V 0402 220p 50V 


C419 K 15 Chipcap X7R 10% 50V 0402 220p 50V 


C421 P 14 Chipcap X7R 10% 50V 0402 220p 50V 

C422 P 15 Chipcap X7R 10% 50V 0402 220p 50V 

C423 Q 14 Chipcap X7R 10% 50V 0402 220p 50V 






C429 S 12 CHIPCAP X5R 1U K 6V3 0603 1u0 6.3V 

C430 Z 8 CHIPCAP X5R 100N K 10V 0402 100n 10V 

C431 J 11 Chipcap 5% NP0 22p 50V 

C432 U 11 Chipcap 5% NP0 22p 50V 



C435 T 11 Chipcap 5% NP0 22p 50V 

C436 V 11 CHIPCAP X7R 100N K 25V 0805 100n 25V 

37/44


Component 

value 

C437 U 14 CHIPCAP X7R 100N K 25V 0805 100n 25V 



C440 V 12 CHIPCAP X7R 100N K 25V 0805 100n 25V 



C443 W 14 Chipcap X7R 10% 50V 0402 220p 50V 






C449 X 14 Chipcap X7R 10% 50V 0402 220p 50V 


C451 Y 14 Chipcap X7R 10% 50V 0402 220p 50V 

C452 Y 15 Chipcap X7R 10% 50V 0402 220p 50V 







C459 A 6 Chipcap 5% NP0 56p 50V 

C461 A 8 CHIPTCAP 68U M 25V 7.3X4.3X4.1 68u_25V 25V 

C462 B 7 Chipcap X7R 10% 50V 0402 1n0 50V 

C463 C 7 Chipcap 5% NP0 56p 50V 

C464 C 7 CHIPCAP X7R 100N K 16V 0603 100n 16V 

C465 D 7 CHIPTCAP 68U M 25V 7.3X4.3X4.1 68u_25V 25V 

Voltage 

C466 I 6 POSCAP 100UF+-20M 100u 6.3V 

C467 H 7 CHIPCAP X7R 100N K 16V 0603 100n 16V 

C468 H 7 Chipcap X7R 10% 50V 0402 220p 50V 

C469 H 8 CHIPTCAP 68UF M 6V3 68u 6.3V 

C470 H 8 CHIPCAP X7R 100N K 16V 0603 100n 16V 

38/44


Component 

value 

C490 D 6 Chipcap X7R 10% 16V 0402 10n 16V 

Voltage 

C491 G 5 ELCAP 470U M 6V3 0R025 105C 8X10 470u_6V3 6.3V 

C492 I 5 ELCAP 470U M 6V3 0R025 105C 8X10 470u_6V3 6.3V 

C493 P 11 Chipcap X7R 5% 16V 0402 10n 16V 

F400 A 4 SM FUSE F2A 63V 1206 2.0A ~ 

L100 I 13 FERRITE BEAD 0R6 600R/100M 0402 600R/100MHz ~ 

L101 I 13 FERRITE BEAD 0R6 600R/100M 0402 600R/100MHz ~ 

L400 J 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 

L401 K 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 

L402 P 14 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 

L403 Q 14 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 



L406 W 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 



L409 X 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 

L410 Y 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 


L412 Y 15 FERRITE BEAD 0R35 240R/100M 0402 240R/100MHz ~ 


L414 A 4 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~ 

L415 B 8 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~ 

L416 B 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~ 

L418 H 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805 42R/100MHz ~ 

L490 F 7 CHOKE 33U M 3.0A 65MR 12X12X8 33uH ~ 

N100 L 13 4XOPAMP 2.7-12V TS974 SO14 ~ ~ 

N101 I 13 REG 3.3V/150MA LP2985A-3.3 SOT23-5 ~ 3.3V 

N400 P 11 REG 3.3V/150MA LP2985A-3.3 SOT23-5 ~ 3.3V 

N401 C 5 SW REG 1.2-37V 3A LM2676 TO263-7 ~ ADJ 

N402 P 13 MAX3237EAI RS323 5TX3RX SSOP28 ~ ~ 

N403 U 13 MAX3237EAI RS323 5TX3RX SSOP28 ~ ~ 

R100 Y 6 Resistor 5% 63mW 560R ~ 

39/44


Component 

value 

R101 L 8 Resistor 5% 63mW 560R ~ 











R112 L 4 Resistor 5% 63mW 560R ~ 








R120 Y 6 Resistor 5% 63mW 560R ~ 












R132 P 8 Chipres 0W06 jumper 0402 0R ~ 

R133 P 8 Chipres 0W06 jumper 0402 0R ~ 

Voltage 

40/44


R140 F 14 

R141 E 14 

Component 

value 

VARISTOR ARRAY 2XVWM16V VC50 

0405 2XVWM16V ~ 

VARISTOR ARRAY 2XVWM16V VC50 

0405 2XVWM16V ~ 

R142 J 13 Resistor 5% 63mW 1k0 ~ 






R148 J 14 Resistor 5% 63mW 330R ~ 

R149 K 14 Resistor 5% 63mW 330k ~ 

R150 K 13 Resistor 5% 63mW 330k ~ 

R151 K 14 Resistor 5% 63mW 1k0 ~ 

R152 M 14 Resistor 5% 63mW 4k7 ~ 

R153 K 12 Resistor 5% 63mW 1k0 ~ 

R154 M 12 Resistor 5% 63mW 4k7 ~ 

R155 M 13 Resistor 5% 63mW 47R ~ 

R156 N 13 Resistor 5% 63mW 47R ~ 



R159 M 12 Resistor 5% 63mW 2k2 ~ 

R160 J 13 Resistor 5% 63mW 10k ~ 

R161 J 13 Resistor 5% 63mW 10k ~ 

R400 F 12 Resistor 5% 63mW 100R ~ 

R401 F 12 Resistor 5% 63mW 100R ~ 

R402 G 11 Resistor 5% 63mW 68k ~ 

R403 G 11 Resistor 5% 63mW 1k0 ~ 

R406 Q 11 Chipres 0W06 jumper 0402 0R ~ 

R410 B 7 Resistor 5% 63mW 47k ~ 

R413 Q 12 Resistor 5% 63mW 47k ~ 


R416 R 12 Resistor 5% 63mW 10k ~ 

R417 T 13 Resistor 5% 63mW 47k ~ 

Voltage 

41/44


Component 

value 

R418 T 12 Resistor 5% 63mW 10k ~ 

R419 A 6 CHIP VARISTOR VWM18V VC50 0603 18V ~ 

R420 B 6 Resistor 1% 63mW 12k ~ 

R421 B 6 CHIPRES 0W06 10K F 0402 10k ~ 

R422 B 7 CHIPRES 0W06 10K F 0402 10k ~ 

S100 M 11 Slide Switch 1-pole 2-pos ~ ~ 

S101 M 12 Slide Switch 1-pole 2-pos ~ ~ 

S400 G 13 Slide Switch 1-pole 2-pos ~ ~ 

S401 G 12 Slide Switch 1-pole 2-pos ~ ~ 

S402 I 11 SM SW TACT SPST 12V 50MA ~ ~ 

S403 R 13 Slide Switch 1-pole 2-pos ~ ~ 

S404 T 13 Slide Switch 1-pole 2-pos ~ ~ 

V100 Y 6 LED CL190HR RED>5MCD 20MA 0603 ~ ~ 

V101 M 8 LED CL190HR RED>5MCD 20MA 0603 ~ ~ 











V112 M 4 LED CL190HR RED>5MCD 20MA 0603 ~ ~ 








V120 Y 6 LED CL190HR RED>5MCD 20MA 0603 ~ ~ 

Voltage 

42/44


Component 

value 












V132 X 6 

V133 M 8 

V135 M 8 

V137 M 7 

V139 M 6 

V141 M 5 

V143 M 4 

V145 M 4 

V147 X 3 

V148 X 4 

V150 M 6 

V153 X 7 

V154 X 5 

TRX2+RX4 UMH2N N 50V 0.03A 

SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 

Voltage 

43/44


V156 X 6 

V158 X 5 

V161 X 7 

Component 

value 


SOT363 ~ ~ 


SOT363 ~ ~ 


SOT363 ~ ~ 

V400 A 5 SCH DI 40V 3A SOD6 ~ ~ 

V490 E 5 SCH DI 40V 3A DO214AB ~ ~ 

X100 L 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~ 

X101 F 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~ 

X102 R 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~ 

X103 X 2 SM CONN 2X10M P2.54 3A 90DEG ~ ~ 

X150 F 16 

X400 B 16 

CONN MOD JACK 6POL 125V 1.5A 

90DEG ~ ~ 

PC MODULAR JACK 10POL P1.27 

90DEG ~ ~ 

X401 R 10 SM SOCKET STRIP 2X30F P1.27MM ~ ~ 

X402 C 10 

X403 C 12 

X404 Q 11 

X406 J 17 

X407 Q 17 

X408 X 17 

CONN F 90DEG PCB RED BANANA 

SOCK ~ ~ 

CONN F 90DEG PCB BLACK BANANA 

SOC ~ ~ 

SINGLE ROW STRAIGHT PIN HEADER 

2X1 ~ ~ 

CONN D9 F 90DEG B/LOCK 4-40UNC 

AU ~ ~ 


AU ~ ~ 


AU ~ ~ 

X409 B 2 SMD JACK 3.0MM F DC 20V 2A ~ ~ 

X410 Y 11 SM SIM CARD READER 2X3POL P2.54 ~ ~ 

Voltage 

44/44

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

3 

1 

2 

3 

1 

2 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

3 

1 

2 

2 

1 

3 

1 

2 

2 

1 

2 

1 

2 

1 

2 

1 

2 

4 

1 

3 

2 

1 

2 

1 

INPUT10 

OUTPUT6 

OUTPUT7 

INPUT9 

OUTPUT9 

PORT1TX 

5 

(SCK/MBUS) 

2 

2 

1 

C 

D9 FEMALE 

8=CTS 

PORT2CTS 

SERVICE 

1=DCD 

9=RI 

6=DSR 

9=RI 

B 

A 

AD3 

INPUT11 

7=RTS 

6=DSR 

5=GND 

4=DTR 

(TXD/FBUSTXO) 

3 

AD2 

2=RxD 

3=TxD 

D 

7=RTS 

8=CTS 

A 

RESET_T 

RESET_A 

OUTPUT8 

3=TxD 

OUTPUT4 

INPUT4/P3TX 

1 

INPUT5 

INPUT6 

1 3 6 

MICP 

PCMDCLK 

PORT2RTS 

B 

5=GND 

1=DCD 

2=RxD 

VSIM 

(BSI) 

4=DTR 

5=GND 

NC 

NC 

A 

C 

D 

2 

9=RI 

D9 FEMALE 

SIMRST 

4=DTR 

4 

PORT2RX 

NC 

MBUS 

BSI 

NC 

OUPUT2 

8=CTS 

4 

PCMTX 

EARP 

SIMDET 

PORT2TX 

PORT1RX 

OUTPUT1/P3RX 

3=TxD 

1=DCD 

INPUT8 

OUTPUT3 

(RXD/FBUSRXO) 

6=DSR 

7=RTS 

D9 FEMALE 

6 

INPUT7 

PCMRX 

EARN 

PCMSCLK 

SIMDATA 

AD1 

IO_VOLTAGE 

SLEEPX 

SIMCLK 

MICN 

2=RxD 

OUTPUT5 

5 

STPS340U 

V400 

36 

NC 

XAUD(3:0) 

12 

13 

14 

34 

470u_10V 

C406 

ANA_AUDIO(3:0) 

E425 

5 

6 

7 

8 

S2 

S1 9 

L413 

240R/100MHz 

VBB 

M-C707_10M006_522_2 

X410 

1 

2 

3 

220p 

C468 

9 

X408 

1 

2 

3 

4 

5 

6 

7 

8 

9 

VCC 

27 

C1+ 28 

C2- 3 

4 V- 

T1OUT 

5 

T2OUT 

6 

T3OUT 

7 

R1IN 8 

R2IN 

18 

19 

T4IN 

R2OUT 

20 

R1OUT 

21 

T3IN 22 

T2IN 23 

T1IN 24 

C1- 25 

V+ 

10 T4OUT 

R3IN 11 

12 T5OUT 

_EN 13 

14 _SHDN 

15 MBAUD 

16 R1OUTB 

17 

T5IN 

R3OUT 

E422 

MAX3237EAI 

GND 2= 

3V3 26= 

N403 

C2+ 1 

C401 

1u0 

C492 

2517865 

470u_6V3 

470u_6V3 

2517865 

GND 

GND 

GND 

GND 

C491 

GND 

C463 

56p 

42R/100MHz 

L416 

240R/100MHz 

L405 

GND 

220p 

C454 

27 

R416 

38 

29 

GND 

10k 

220p 

C456 

GND 

L412 

240R/100MHz 

C414 

100n 

23 

24 

25 

GND 

GND 

GND 

GND 

GND 

GND 

R421 

10k 

10k 

R422 

470u_10V 

C405 

470u_10V 

C404 

470u_10V 

C403 

12k 

R420 

26 

17 

C466 

100u 

47k 

R417 

10n 

C493 

59 

C421 

220p 

37 

GND 

45 

48 

GND 

E421 

20 

VCC 

R419 

18V 

C432 

42 

43 

GND 

C433 

22p 

220p 

C458 

22p 

220p 

C452 

2611689 

C402 

L410 

240R/100MHz 

470u_10V 

GND 

GND 

L401 

240R/100MHz 

100R 

R401 

GND 

GND 

GND 

GND 

GND 

GND 

R400 

100R 

9 3V3 

60 

GND 

GND 

49 

5 

50 

51 

52 

53 

54 

55 

56 

57 

58 

59 

6 

60 

7 

8 

9 

34 

35 

36 

37 

38 

39 

4 

40 

41 

42 

43 

44 

45 

46 

47 

48 

20 

21 

22 

23 

24 

25 

26 

27 

28 

29 

3 

30 

31 

32 

33 

X401 

1 

10 

11 


13 

14 

15 

16 

17 

18 

19 

2 

C434 

GND 

C435 

22p 

22p 

E424 

GND 

GND 

68u_25V 

E423 

4341603 

SW_OUT 

IN 

CBOOST 

G 

FB 

ON/_OFF 

G 

C461 

GND 

GND 

3 

2 

1 

0 

LM2676S-ADJ 

N401 

C441 

22p 

GND 

C442 

22p 

3V3 

44 

47k 

C455 

220p 

GND 

3V3 

R413 

220p 

C445 

GND 

C446 

220p 

GND 

GND 

C464 

100n 

GND 

GND 

C428 

220p 

1k0 

R403 

L411 

240R/100MHz 

220p 

C423 

C419 

220p 

220p 

C450 

GND 

L409 

240R/100MHz 

C457 

220p 

GND 

GND 

GND 

GND 

GND GND 

E411 

GND 

GND 

GND 

L402 

240R/100MHz 

100n 

C467 

GND 

GND 

GND 

49 

22 

4 

C469 

68u 

2.0A 

F400 

X409 

2 

3 

220p 

C422 

E400 

GND 

GND 

GND 

21 

C412 

100n 

100n 

C413 

E420 

240R/100MHz 

L403 

C424 

220p 

GND 

E415 

GND 

GND 

GND 

15 

GND 

GND 

E410 

16 

GND 

X407 

1 

2 

3 

4 

5 

6 

7 

8 

9 

E409 

4u7 

GND 

LP2985AIM5X 

-3.3_NOPB 

BYPASS 

GND 

ON_OFF 

VIN 

VOUT 

GND 

C400 

100n 

S404 

1 

2 

3 

N400 

1 

2 

3 

GND 

C430 

50 

E419 

X403 

S400 

GND 

GND 

GND 

3V3 

53 

220p 

C420 

GND 

GND 

GND 

GND 

220p 

C417 

E408 

100n 

C438 

220p 

C426 

240R/100MHz 

GND 

GND 

L404 

C431 

220p 

C427 

R415 

22p 

32 

33 

GND 

4k7 

51 

X402 

GND 

220p 

11 

10 

0R 

R406 

C443 

GND 

S401 

1 

2 

3 

GND 

3V3 

L490 

3640155 

33uH 

GND 

GND 

L406 

240R/100MHz 

GND 

C425 

220p 

GND 

E418 

E417 

GND 

57 

C470 

100n 

GND 

E416 

R402 

GND 

GND 

E413 

E414 

GND 

68k 

68u_25V 

C465 

S403 

1 

2 

3 

V490 

MBRS340T3 

4110032 

C418 

220p 

GND 

240R/100MHz 

L400 

1u0 

C429 

10k 

GND 

X404 

1 

2 

R418 

100n 

GND 

GND 

E412 

C416 

T1OUT 

6 T2OUT 

7 T3OUT 

8 

R1IN 

9 

R2IN 

C415 

100n 

T3IN 

23 

T2IN 

24 

T1IN 

25 

C1- 

27 V+ 

28 

C1+ 

3 

C2- 

V- 

4 

5 

MBAUD 

15 

R1OUTB 

16 

T5IN 17 

18 R3OUT 

T4IN 19 

20 R2OUT 

21 R1OUT 

22 

2= 

GND 

MAX3237EAI 

1 

C2+ 

T4OUT 

10 

11 

R3IN 

T5OUT 


13 

_EN 

_SHDN 

14 

3V3 

GND 

N402 

26= 

3V3 

220p 

100n 

C440 

6 

7 

8 

9 

35 

C453 

GND 

X400 

1 

10 

2 

3 

4 

5 

3 

4 

5 

6 

7 

8 

9 

E401 

E402 

GND 

GND 

X406 

1 

2 

C449 

220p 

L415 

42R/100MHz 

GND 

C462 

1n0 

E405 

E406 

E407 

40 

41 

GND 

GND 

L414 

C451 

220p 

3V3 

42R/100MHz 

47 

240R/100MHz 

L407 

GND 

B400 

- 

+ 

GND 

56p 

C459 

S402 

1 

2 

3 

4 

55 

56 

46 

52 

E404 

54 

31 

C490 

10n 

18 

19 

28 

3V3 

30 

47k 

GND 

42R/100MHz 

L418 

GND 

R410 

220p 

220p 

C448 

C447 

L408 

240R/100MHz 

100n 

C436 

58 

E403 

C437 

100n 

220p 

C444 

100n 

C439 

39 

AIF(60:1) 

XAUD(3:0) 

AIF(60:1)

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

2 

1 

GENIO13 

GENIO22 

PORT1RTS 

PORT1DTR 

PCMRX_G16 

BSI 

MICP 

A 

D 

C 

PORT1CTS 

SIMDATA 

SIMDET 

SLEEPX 

B 

AD1 

AD2 

5 

Reset_T 

Reset_A 

GENIO10 

PORT2RX 

PORT1RI 

VSIM 

SIMRST 

PCMDCLK_G14 

MICN 

PCMTX_G15 

EARP 

SIMCLK 

1 2 3 

IO_VOLTAGE 

GENIO4 

GENIO8 

PORT1TX 

AD3 

GENIO28 

PORT1DCD 

PORT1DSR 

A 

D 

C 

EARN 

PORT1RX 

6 

PORT3RX 

PORT3TX 

GENIO21 

B 

4 5 6 

1 2 3 4 

GENIO12 

UMH2N-TN 

47k 

4219953 

V135 

47k 

3 

4 

5 

PORT2TX 

GENIO11 

PORT2RTS 

PORT2CTS 

BUZZO 

MBUS 

PCMSCLK_G17 

24 

25 

26 

27 

36 

10 

11 

22 

23 

GND 

560R 

R127 

R116 

560R 

47k 

V158 

4219953 

47k 

UMH2N-TN 3 

4 

5 

UMH2N-TN 

47k 

4219953 

V145 

47k 

3 

4 

5 

34 

35 

VCC 

GND 

V114 

CL-190HR-CD-T 

CL-190HR-CD-T 

V123 


CL-190HR-CD-T 

31 

UMH2N-TN 

47k 

4219953 

V139 

47k 

3 

4 

5 

52 

53 

V108 

CL-190HR-CD-T 

1 

2 

R101 

560R 

GND 

VCC 

UMH2N-TN 

47k 

4219953 

V133 

47k 

6 

560R 


GND 

45 

46 

47 

55 

40 

41 

42 

43 

44 

GND 

UMH2N-TN 

47k 

4219953 

V148 

47k 

6 

1 

2 

R102 

560R 

R108 

560R 

GND 

GND 

VCC 


560R 

UMH2N-TN 

47k 

4219953 

V145 

47k 

6 

1 

2 

R113 

560R 

28 

29 

30 

VCC 

GND 

VCC 


CL-190HR-CD-T 

6 

1 

2 

560R 


CL-190HR-CD-T 


47k 

V156 

4219953 

47k 

UMH2N-TN 

UMH2N-TN 3 

4 

5 

GND 

GND 

VCC 

47k 

V141 

4219953 

47k 

UMH2N-TN 3 

4 

5 

47k 

V154 

4219953 

47k 

GND 

VCC 

CL-190HR-CD-T 

V110 

1 

2 

560R 

R109 

CL-190HR-CD-T 

V109 

47k 

V141 

4219953 

47k 

UMH2N-TN 6 

E426 

E427 

VCC 

560R 

GND 

UMH2N-TN 

47k 

4219953 

V153 

47k 

6 

1 

2 

R131 

CL-190HR-CD-T 

V106 

V131 

CL-190HR-CD-T 

CL-190HR-CD-T 

V105 

V107 

CL-190HR-CD-T 

560R 

R106 

GND 

CL-190HR-CD-T 

V103 

5 

48 

49 

CL-190HR-CD-T 

V130 

47k 

V161 

4219953 

47k 

UMH2N-TN 3 

4 

GND 

GND 

VCC 

GND 

VCC 

560R 

R117 

VCC 

47k 

V161 

4219953 

47k 

UMH2N-TN 6 

1 

2 

GND 

VCC 

CL-190HR-CD-T 


3 

4 

5 


560R 

CL-190HR-CD-T 

UMH2N-TN 

47k 

4219953 

V147 

47k 

E465 

GND 

VCC 


E462 

E463 

E464 

560R 

R115 

E454 

E455 

4219953 

47k 

UMH2N-TN 6 

1 

2 

CL-190HR-CD-T 


CL-190HR-CD-T 

V117 

47k 

V147 

R112 

GND 

GND 

VCC 

V156 

47k 

3 

4 

5 

560R 

6 

7 

8 

9 

GND 

UMH2N-TN 

47k 

4219953 

14 

15 

16 

17 

18 

19 

2 

20 

3 

4 

5 

9 

GND 

X100 

1 

10 

11 


13 

18 

19 

2 

20 

3 

4 

5 

6 

7 

8 

1 

10 

11 


13 

14 

15 

16 

17 

19 

2 

20 

3 

4 

5 

6 

7 

8 

9 

X103 

1 

10 

11 


13 

14 

15 

16 

17 

18 

4 

5 

6 

7 

8 

9 

GND 

X101 

13 

14 

15 

16 

17 

18 

19 

2 

20 

3 

E437 

X102 

1 

10 

11 


GND 

VCC 

CL-190HR-CD-T 

V115 

6 

1 

2 


560R 

GND 

VCC 

VCC 

UMH2N-TN 

47k 

4219953 

V154 

47k 


560R 

E459 

E460 

E461 

E457 

E458 

VCC 

V116 

CL-190HR-CD-T 

VCC 

E456 

47k 

V132 

4219953 

47k 

UMH2N-TN 3 

4 

5 

GND 

560R 

R130 

560R 


GND 


47k 

V137 

4219953 

47k 

UMH2N-TN 3 

4 

5 

560R 

R118 

GND 

CL-190HR-CD-T 

V100 

47k 

V150 

4219953 

47k 

UMH2N-TN 6 

1 

2 

E446 

GND 

VCC 

VCC 

VCC 

47k 

V148 

4219953 

47k 

UMH2N-TN 3 

4 

5 

560R 

R103 

GND 

VCC 

47k 

UMH2N-TN 6 

1 

2 

GND 

VCC 

VCC 

13 

47k 

V135 

4219953 

21 

560R 

R110 

17 

18 

19 

20 

3 

4 

5 

V101 

CL-190HR-CD-T 

16 

47k 

4219953 

V158 

47k 

6 

1 

2 

UMH2N-TN 

47k 

4219953 

V133 

47k 


CL-190HR-CD-T 

UMH2N-TN 

E445 


560R 

E442 

E443 

E444 

E439 

E440 

E441 

E438 

E436 

R114 

560R 

E432 

E433 

E434 

E435 

E430 

E431 

E428 

E429 

0R 

R132 

R133 

0R 

3 

4 

5 

32 

CL-190HR-CD-T 

V112 

47k 

V143 

4219953 

47k 

UMH2N-TN 

GND 

VCC 

UMH2N-TN 

47k 

4219953 

V143 

47k 

6 

1 

2 

R111 

560R 

VCC 

V111 

CL-190HR-CD-T 

3 

4 

5 

R119 

560R 

3 

2 

UMH2N-TN 

47k 

4219953 

V150 

47k 

E450 

E451 

E452 

E453 

E448 

E449 

V104 

CL-190HR-CD-T 

14 

15 

E447 

1 

0 

33 

V102 

CL-190HR-CD-T 

38 

39 

56 

57 

560R 

R100 

GND 

VCC 

47k 

V132 

4219953 

47k 

UMH2N-TN 6 

1 

2 

560R 


58 

59 

60 

9 

VCC 

UMH2N-TN 

47k 

4219953 

V153 

47k 

3 

4 

5 


CL-190HR-CD-T 

CL-190HR-CD-T 


V119 

CL-190HR-CD-T 

CL-190HR-CD-T 

V118 

2 

R107 

560R 

50 

51 

UMH2N-TN 

47k 

4219953 

V139 

47k 

6 

1 

V113 

CL-190HR-CD-T 

37 

GND 

560R 

R105 

GND 

VCC 

VCC 

47k 

UMH2N-TN 6 

1 

2 

GND 

VCC 

54 

47k 

V137 

4219953 

XAUD(3:0) 

R104 

560R 

AIF(60:1)

1 2 3 4 5 6 

A 

A 

VA 

R148 

GND 

C101 

10u 

R146 

1k8 

330R 

C102 

100n_35V 

GND 

GND 

C103 

100n_35V 

C109 

180p 

R149 

330k 

GND 

C110 

22p 

L101 

600R/100MHz 

R145 

1k0 

R147 

2k2 

C104 

100n 

2 

- 

3 

+ 

N100 

TS974ID 

1 

R151 

1k0 

VA_2 

4= VA 

11= GND 

R152 

4k7 

GND 

B 

GND 

HANDSET_CONNECTOR 

X150 

VCC 1 

HOOK 2 

GND 3 

EAR 4 

MIC- 5 

MIC+ 6 

R140 

1 /2 VWM16V 

R140 

/2 VWM16V 

2 

L102 

C125 

10u 


10u 


22p 

L100 

600R/100MHz 

R142 

1k0 

C100 

1n0 

R143 

1k8 

GND 

GND 

R144 

2k2 

VA_2 

GND 

C105 

22p 

C108 

22p 

C107 

100n 

C106 

22p 

C111 

180p 

R150 

330k 

N100 

TS974ID 

6 

- 

7 

5 

+ 

4= VA 

11= GND 

GND 

C112 

22p 

R153 

1k0 

R154 

GND 

4k7 

C113 

1u0 

C114 

1u0 

C115 

150p 

R155 

47R 

R157 

47R 

C116 

18n 

R156 

47R 

R158 

47R 

C117 

10n 

R159 

2k2 

3 

2 

2 3 

3 

2 

2 3 

S101 

S100 

1 

1 

1 

1 

0 

1 

2 

3 

B 

/2 VWM16V 

R141 

1 

R141 

ANA_AUDIO(3:0) 

2 /2 VWM16V 

GND 

XAUD(3:0) 

2 

3 

C 

0 

1 

VCC 

C 

VA_2 

VA 

VIN N101 

VOUT 

ON_OFF 

LP2985AIM5X 

BYPASS 

-3.3_NOPB 

10k 

R160 

C119 

22p 


47n 


4u7 

GND 

GND 


10n 


1u0 

GND 

GND 

GND 

GND 

GND 

C118 

1u0 

10k 

R161 

GND 

GND 

A101 

RF-SHIELD 

FRAME 

W2 

DTE-1 

D 

D 

GND 

1 2 

3 4 

5 

6

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