Interface Selection Guide
Interface Selection Guide
Interface Selection Guide
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2 <strong>Interface</strong> <strong>Selection</strong> <strong>Guide</strong><br />
➔<br />
Table of Contents<br />
Introduction 3<br />
LVDS, xECL, CML . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4<br />
Multipoint-LVDS (M-LVDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8<br />
RS-485/422 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10<br />
RS-232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12<br />
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15<br />
CAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17<br />
SerDes (Serial Gigabit Transceivers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18<br />
USB HUB Controllers, Peripheral Devices and Power Managers . . . . . . . . . . . . . .20<br />
PCI CardBus Controllers, PCI Bridges, CardBus Power . . . . . . . . . . . . . . . . . . . . . .24<br />
1394 (FireWire ® ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29<br />
GTLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32<br />
VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34<br />
Clock Distribution Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35<br />
Cross-Reference <strong>Guide</strong> . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36<br />
Lead (Pb)-Free Solutions<br />
from Texas Instruments<br />
TI is a leader in<br />
the supply of<br />
Lead (Pb)-Free<br />
integrated<br />
circuit packages.<br />
Currently, more than 30 billion TI<br />
Pb-Free components are in the field,<br />
and many new Pb-Free devices are<br />
being added every year.<br />
Examples of Pb-Free package<br />
types available or planned for<br />
select devices by end of 2005:<br />
• LQFP<br />
• MicroStar BGA<br />
• MicroStar Junior<br />
• MSOP<br />
• NanoFree<br />
• PBGA<br />
• PDIP<br />
• PLCC<br />
• PowerPAD<br />
• QFN<br />
• QFP<br />
• QSOP<br />
• SC70<br />
• SIP<br />
• SOIC<br />
• SOP<br />
• SOT223<br />
• SOT23<br />
• SSOP<br />
• TO-220<br />
• TQFP<br />
• TSOT<br />
• TSSOP<br />
• TVSOP<br />
For all your Lead<br />
(Pb)-Free questions,<br />
visit<br />
www.ti.com/quality<br />
Check interface.ti.com<br />
for the latest IBIS Models<br />
and evaluation modules<br />
(EVMs).<br />
<strong>Interface</strong> <strong>Selection</strong> <strong>Guide</strong> Texas Instruments 3Q 2005
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