Electronics Cooling Products - Advanced Cooling Technologies, Inc.
Electronics Cooling Products - Advanced Cooling Technologies, Inc.
Electronics Cooling Products - Advanced Cooling Technologies, Inc.
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Component, Board, and System Level <strong>Cooling</strong><br />
Analyzing all thermal resistances in the thermal path and determining which have the largest impact<br />
on the overall power dissipation are key to understanding and improving thermal solutions. Whether it is<br />
removing heat from a few key high power components, minimizing the interface between an Line Replaceable<br />
Unit and the chassis, or improving the efficiency of an air or liquid cooled heat sink, ACT can assist in<br />
addressing and solving thermal challenges at all levels in the system.<br />
Effective Heat Transfer at the Component and Board Level<br />
Conduction and Air-Cooled Frame Enhancements- ACT<br />
Works to VITA/VME Standards<br />
Component Level <strong>Cooling</strong> - Optimizing the Thermal Path<br />
From the Device to the Board to the Chassis<br />
Detailed Device Level Modeling<br />
0.072”<br />
THIN<br />
The Industry’s Thinnest Embedded Heat Pipe Assemblies<br />
Low Profile<br />
Low Thermal<br />
Resistance<br />
Retrofit into Current Design<br />
Conduction/Convection Cooled<br />
Cards<br />
System Level Solutions<br />
ACT routinely designs, develops and manufactures system level cooling<br />
solutions, moving heat from the electronics chassis to the ultimate sink. We<br />
have extensive experience with a variety of potential solutions including:<br />
Optimized Fin Geometries, Thermo-Electric Coolers, Heat Pipe Assemblies, and<br />
Liquid Cooled Cold Plates.<br />
Design: ACT's design engineers perform<br />
engineering analysis to optimize the thermal path<br />
from heat source to sink, and design proper<br />
thermal solutions to address your primary<br />
challenges.<br />
Geometry: ACT provides custom thermal<br />
solutions working within existing geometries and accommodating a variety of features<br />
from cabling, connectors, I/O's to mechanical features and mounting holes.<br />
Plating/Finishes: ACT offers a variety of plating finishes addressing harsh installation<br />
environments and meeting system specifications.<br />
Reliability: Enhanced heat transfer with proven, reliable thermal technology<br />
increases reliability and extends service life.<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>.<br />
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