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FUTURE NON-VOLATILE MEMORY TECHNOLOGIES

FUTURE NON-VOLATILE MEMORY TECHNOLOGIES

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<strong>FUTURE</strong><br />

<strong>NON</strong>-<strong>VOLATILE</strong><br />

<strong>MEMORY</strong><br />

<strong>TECHNOLOGIES</strong><br />

ANKIT SHAH<br />

VINEETH VIJAYAKUMARAN<br />

1


Outline<br />

• Current Memory Technologies<br />

• Future Memory Technologies<br />

• What is MRAM ?<br />

• Working of MRAM<br />

• Advantages & Disadvantages - MRAM<br />

• What is Ferroelectric RAM (FeRAM or FRAM) ?<br />

• FeRAM -Superior Features<br />

• Compare FeRAM with EEPROM & FLASH<br />

• FeRAM –Memory cell , Write , Read , Application<br />

2


Current Memory Technologies<br />

‣ DRAMs<br />

• Volatile<br />

• Require standby power<br />

‣ Flash Memories<br />

• Limited write endurance<br />

• Low write speed<br />

‣ SRAMs<br />

• Volatile<br />

• Large cell size<br />

Combined revenues of these 3 memory<br />

technologies were ~26B$ in 2002<br />

3


Future Memory Technologies<br />

4


Magnetoresistive RAM<br />

(MRAM)<br />

5


What is MRAM ??<br />

• It is non-volatile memory.<br />

• Made up of millions of pairs of tiny ferromagnetic<br />

plates called as memory cells (Magnetic plates with<br />

very thin insulating material sandwiched between the<br />

plates).<br />

• Data is not stored as electric charge but by magnetic<br />

storage elements.<br />

6


Magnetoresistive Effect<br />

• Magnetic layer has a polarity – north pole and the<br />

south pole.<br />

• Their magnetic moments can have a parallel<br />

orientation or anti-parallel orientation.<br />

• Memory cell has low resistance when magnetic<br />

moments have parallel orientation and high resistance<br />

when magnetic moments have anti-parallel<br />

orientation.<br />

7


Continued<br />

• The magnetic moments and hence the resistance of<br />

the memory cell can be changed by application of<br />

magnetic field.<br />

• This effect is called as Magnetoresistive Effect.<br />

8


Working of MRAM<br />

• MRAM uses Magnetoresistive Effect.<br />

• Working of MRAM consists of mainly 2 parts<br />

i. Reading data from the memory cell.<br />

ii.<br />

Writing data to the memory cell.<br />

9


Read Operation<br />

• MRAM reads information<br />

by measuring the electric<br />

resistance of the specific<br />

cell.<br />

• Resistance is measured by<br />

passing a current through<br />

the memory cell.<br />

• It reads a ‘1’ if resistance is<br />

low and ‘0’ if resistance is<br />

high<br />

10


Write Operation<br />

• Current pulses are<br />

passed through the digit<br />

line and the bit line.<br />

• Currents generates a<br />

magnetic field that<br />

changes the orientation<br />

of the magnetic<br />

moments of particular<br />

memory cell.<br />

11


CONT‟D<br />

• Write takes place only on the bit in the array which is<br />

at cross point of the 2 lines.<br />

• The value stored depends on the resultant of the<br />

applied magnetic fields.<br />

• The “1” or “0” is stored by putting the free layer<br />

magnetic moment into the anti-parallel or parallel<br />

state.<br />

12


Advantages of MRAM<br />

• Non-volatile memory.<br />

• High speed read writes.<br />

• Unlimited Endurance.<br />

• Low power as compared to DRAM.<br />

• Magnetic polarization does not leak away with time<br />

like charge does.<br />

13


Disadvantages of MRAM<br />

• Cost ( $25 for 0.5 MB).<br />

• Limitation to reduction in cell size. Sense lines cannot<br />

get narrower than 1 micron.<br />

• Power required to write data is 3 to 8 times higher<br />

than power required to read data.<br />

14


Applications of MRAM<br />

• Current Application<br />

i. Cache buffers<br />

ii. Configurable Storage memories.<br />

• Potential Applications<br />

i. Cell phones, PDA’s, Notebooks.<br />

ii. Computing and Networking.<br />

iii. RFID<br />

iv. Military<br />

v. Cell phones and Mobile computing<br />

July 10 th 2006<br />

Freescale moved<br />

MRAM in volume<br />

production (4 MB<br />

product).<br />

15


FeRAM / FRAM<br />

16


Ferroelectric RAM (FeRAM or<br />

FRAM)<br />

• Random access memory similar in construction to DRAM<br />

• Uses a ferroelectric layer instead of a dielectric layer to<br />

achieve non-volatility<br />

• 320 patents granted by the U.S. patent office in last 3<br />

years. More than 120 ,during the past year alone.<br />

17


Superior Features<br />

• Short programming time<br />

• Lower power usage<br />

• Faster write performance<br />

FeRAM – A possible alternative for Flash<br />

18


Compare FeRAM with<br />

EEPROM & FLASH<br />

19


FeRAM- FerroElectric Materials<br />

Unique Characteristics<br />

• Upon the application of an electric field, there exists a Spontaneous<br />

electric polarization inherent to the crystal structure of the material<br />

• Furthermore, the polarization does not disappear even when the<br />

electric field is removed<br />

• Exhibits Hysteresis<br />

Example - Perovskites - PZT (PbO,ZrO2, TiO2) Lead-Zirconate-Titanate<br />

20


Electric Field on Ferroelectric<br />

Material<br />

•Applied External Electric Field moves the<br />

Center Atom in the direction of the field<br />

•Remain in that state even after the field is<br />

removed.<br />

•The position of the „central‟ atom affects the<br />

voltage which is used to determine whether it<br />

represents a 0 or a 1<br />

Electric Field<br />

Central Atom<br />

Stable States<br />

21


FeRAM - Ferroelectric capacitor<br />

• Ferroelectric capacitor?<br />

A regular capacitor substituted with a ferroelectric<br />

material instead of a dielectric<br />

• Hence provides non-volatility .<br />

Ferroelectric<br />

Material<br />

22


FeRAM – 1T-1C (one transistor, one<br />

capacitor) Memory cell<br />

• When the Access Transistor is ON, the Ferroelectric<br />

Capacitor(FE) is connected to the bitline(BL) and can be<br />

written to or read by the plateline (PL).<br />

• “CBL ” represents the total parasitic capacitance of the<br />

bitline.<br />

Access<br />

Transistor<br />

Ferroelectric<br />

Capacitor<br />

23


WRITE “1” OPERATION<br />

Timing Diagram<br />

State Sequence For the FE Capacitor<br />

24


WRITE “0” OPERATION<br />

Timing Diagram<br />

State Sequence For the FE Capacitor<br />

25


READ OPERATION<br />

(Destructive Read)<br />

•Precharge BL to 0 V<br />

•Activating WL establishes a capacitor<br />

divider between the PL and the ground is<br />

established<br />

•Depending on the data stored, FE<br />

capacitor can be approximated by C0 or C1<br />

and thus voltage could be V0 or V1<br />

•PL raised to VDD<br />

•At this point, the sense amplifier is<br />

activated to drive the BL<br />

If BL is V1 then full VDD<br />

If BL is V0 then full 0V<br />

•The WL is kept activated until the sensed<br />

voltage on the BL restores the original data<br />

back into the memory cell<br />

26


Salient Features –<br />

‣Low Write Access time<br />

‣Low power consumption<br />

Application - FeRAM<br />

Digital Camera –Fast frequent writes in order to store and restore<br />

images into the memory in less than 0.1 s.<br />

Contactless smart cards –Only use electromagnetic coupling to power up<br />

the electronic chips on the card.<br />

NOTE:<br />

FeRAM may play a major role in future 3G phones and personal digital<br />

systems .<br />

27


Conclusion<br />

28


References<br />

‣ MRAM<br />

“The future of things” website (http://thefutureofthings.com/articles/36/mram-the-birthof-the-super-memory.html)<br />

MRAM from wikipedia<br />

(http://en.wikipedia.org/wiki/Magnetoresistive_random_access_memory)<br />

‣ FeRAM<br />

A Survey of Circuit Innovations in Ferroelectric Random-Access Memories, Ali<br />

Sheikholeslami, MEMBER, IEEE, AND P. Glenn Gulak, SENIOR MEMBER,<br />

IEEE (http://www.eecg.utoronto.ca/~ali/papers/survey_proc.pdf)<br />

FeRAM from wikipedia (http://en.wikipedia.org/wiki/Ferroelectric_RAM)<br />

Presentation from Stefan Lai Co-Director, California Technology and<br />

Manufacturing February<br />

2003(http://www.ece.umd.edu/courses/enee759h.S2003/references/Stefan_Korea_0<br />

22703.pd)<br />

29


QUESTIONS?<br />

30

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