Beamline G3 at DESY: Materials X-ray Imaging
Beamline G3 at DESY: Materials X-ray Imaging
Beamline G3 at DESY: Materials X-ray Imaging
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<strong>Beamline</strong> <strong>G3</strong>: Solder Alloy Measurement<br />
Solder alloy: 96.5Sn3Ag0.5Cu (wt. %).<br />
The alloy was soldered on copper (Cu) foil.<br />
Goal of the measurement: visualiz<strong>at</strong>ion of distribution and<br />
orient<strong>at</strong>ion of crystal phases of the solder (β-Sn, intermetallics –<br />
Ag 3 Sn, Cu 6 Sn 5 ) via CCD camera.<br />
Samples - 2 solder spots.<br />
Ag 3 Sn<br />
β-Sn<br />
Cu 6 Sn 5<br />
Fig. 19. PCB p<strong>at</strong>tern<br />
Fig. 20. Microstructure<br />
of the solder alloy<br />
[IMR SAS]
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