DVD 88 cert exam.indd - IPC Training Home Page

Bare Board Defect Recognition (DVD-88C ) Test v.1page 3 of 321. Incoming inspection of sample bare boards consists ofa. checking board thickness, circuit trace thickness and drilled hole sizesb. a tape test to verify the strength of solder mask and markingsc. a visual inspection to detect defectsd. all of the above22. Measles always occura. on the landsb. on the circuit tracesc. at the intersection of the alternating bundles of fi berglass fi bersd. on the edges of the board23. Delamination usually becomes visible aftera. solder fusing processesb. hot air levelingc. wave solderingd. all of the above24. Any solder mask defect condition that exposes adjacent conductors isa. a process indicatorb. not acceptable for any class of productc. an acceptable condition, but not a target conditiond. acceptable as long as the components are soldered25. If gold fingers are scratched, the exposed copper or nickel cana. oxidizeb. delaminatec. shrinkd. crack26. If splatter from solder paste adheres to the critical contact area of the gold fingersa. there will be delamination in the contact areab. there will be a moisture problemc. there may not be a proper electrical connection between the board and mating connectorsd. there will be pinholes in the gold27. Burrs look likea. circular refl ectionsb. whiskersc. epoxy materiald. individual fl akes of metal28. The tiny piece of copper that can cause a plating short is called aa. hairb. whiskerc. traced. wire29. Minimum annular ring is defined as thea. shortest distance from the edge of the hole wall to the edge of the landb. the visible ring inside a plated through holec. width of a scratch on traces or landsd. all of the above30. When marking ink is accidentally applied to a portion of a land, it cana. cause a plating shortb. cause an ESD failurec. block the bonding of solder to the landd. physically damage the component