Surface Finishing - The Hong Kong Polytechnic University

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Surface FinishingReferences1. “Electrodeposition -The Materials Science of Coatings and Substrates”.Jack W Dini, 1993, Noyes Publications.2. “Surface Finishing Systems”. George J. Rudzki, American Society ForMetals Finishing Publications.3. “AESF Third International Pulse Plating Symposium” .October 28-29.4. “Electroforming”. Peter Spiro,1971, Robert Draper5. “Electroplating Engineering Handbook”. Lawrence J. Durnet, 1984, NewYork.6. ELECTROPLATING –Fundamentals of Surface Finishing. Frederick A.Lowenheim.7. PRINTED CIRCUIT BOARD MATERIALS HANDBOOK. Martin W. Jawitz.8. Electroless copper and nickel-phosphorus plating processing,characterisation and modelling. W. Sha, X. Wu and K.G. Keong.9. COATING AND SURFACE TREATMEN0T SYSTEMS FOR METALS. J Edwards.Page 42IC Professional Training
Page 1 and 2: IC LEARNING SERIESSurface Finishing
Page 5 and 6: Surface Finishing2.1.2 Abrasive bla
Page 7 and 8: Surface FinishingAnodic cleaning, t
Page 9 and 10: Surface FinishingConsumable anodes
Page 11 and 12: Surface Finishing10 x 10 x 0.0001 =
Page 13 and 14: Surface FinishingCu + + e Cu +0.52
Page 15 and 16: Surface Finishingi. Stringent contr
Page 17 and 18: Surface Finishing4.2.2 EquipmentTan
Page 19 and 20: Surface FinishingNickel Sulphate Ni
Page 21: Surface FinishingThe solution const
Page 24 and 25: Surface FinishingOxalic acid 1-2 A/
Page 26 and 27: Surface Finishingσ The thickness i
Page 28 and 29: Surface FinishingNickel43600psi30%E
Page 30 and 31: Surface FinishingTensile strength M
Page 32 and 33: Surface Finishingsolution should be
Page 34 and 35: Surface Finishingcastings for indus
Page 36 and 37: Surface FinishingA colloidal [Pdm .
Page 38 and 39: Surface FinishingProblemsPartial vo
Page 40 and 41: Surface FinishingThe initial applie
Page 42 and 43: Surface Finishing10.5 SafetyElectri

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