MikroMasch Brochure (1.8 MB) - Schaefer Technology

contentThe New HQ Line & Test StructuresProbe chip specifications . . . . . . . . . . . . . . . . . . . . . . . . . 5regularNoncontact and Contact silicon probes . . . . . . . . . . . . . . . . 6TiplessNoncontact and Contact Tipless silicon probes . . . . . . . . . . . . 8Long Scanning / lifetimeHardened DLC coated silicon probes . . . . . . . . . . . . . . . . . . 9ConductiveDPER: High Resolution Conductive silicon probes. . . . . . . . . . 10DPE: Low Noise Conductive silicon probes . . . . . . . . . . . . . . 11Conductive Noncontact and Contact silicon probes . . . . . . . . 12MagneticMagnetic Noncontact silicon probes . . . . . . . . . . . . . . . . . 14High ResolutionHi’Res-C: High Resolution silicon probes . . . . . . . . . . . . . . . 15test structuresTGXYZ Series Calibration standards . . . . . . . . . . . . . . . . . . 16TGX Series Calibration standards . . . . . . . . . . . . . . . . . . . 16PA Series Calibration standards . . . . . . . . . . . . . . . . . . . . 17HOPG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17recomendationsRecommendations for specific applications . . . . . . . . . . . . . 18