References of Bioplastics technology - Nec

Dr. Masatoshi Iji and team’s main papers and presentations■Main Papers :International 22 (+Japanese 18)-Shukichi Tanaka, Hideki Honzawa, Masatoshi Iji, “Development ofcardanol-bonded cellulose thermoplastics: high productivity achieved by usingisocyanate-modified cardanol" Journal of Applied Polymer Science, in press.-Masatoshi Iji, Kiyohiko Toyama and Shukichi Tanaka, “Mechanical and othercharacteristics of cellulose ester bonded with modified cardanol from cashew nutshells and additional aliphatic and aromatic components”, Cellulose, 20, 1,559-569 (2013).-Masatoshi Iji, Naoki Morishita ,“Mechanical and Thermal Characteristics ofBio-Nanocomposites Consisting of Poly L-lactic Acid and Self-AssemblingSiloxane Nanoparticles with Three Phases”, Journal of Nanotechnology, 2012,Article ID 137614, 1-8 (2012).-Akinobu Nakamura, Masatoshi Iji, “Factors Affecting the Magnitudes andAnisotropies of the Thermal and Electrical Conductivities of Poly(L-lactic acid)Composites with Carbon Fibers of Various Sizes ”,J. Matter. Sci., 46,747-751(2011).-Masatoshi Iji, Sungil Moon and Shukichi Tanaka, ”Hydrophobic, Mechanical, andThermal Characteristics of Thermoplastic Cellulose Diacetate Bonded withCardanol from Cashew Nut Shell”, Polymer Journal, 43,738-741(2011).-Masatoshi Iji, Naoki Morishita and Hiroyuki Kai, ”Self-assembling SiloxaneNanoparticles with Three Phases That Increase Tenacity of Poly L-lactic Acid”,Polymer Journal, 43,101-104(2011).-Akinobu Nakamura, Masatoshi Iji,” “How Hybridization with Zinc Oxide Whiskers andCarbon Fibers Affects the Thermal Diffusivity and Mechanical Properties of Poly(L-lacticacid) Nanocomposites”, J. Mater. Sci. 46,1439-1445 (2011).-Akinobu Nakamura, Masatoshi Iji,” Enhancement of Thermal Diffusivity ofPoly(L-lactic Acid) Composites with Carbon Fibers”, J. Matter. Sci. , 44,4572-4576 (2009).-K. Inoue, M. Yamashiro, M. Iji, “Recyclable Shape-Memory Polymer: Poly(lacticacid) Crosslinked by a Thermoreversible Diels-Alder Reaction”, Journal ofApplied Polymer Science, 112,2,876-885(2009).-M. Yamashiro, K. Inoue, M. Iji, “Recyclable Shape-memory and MechanicalStrength of Poly(lactic acid) Compounds Cross-linked by Thermo-reversible1

Diels-Alder Reaction”, Polymer Journal, 40, 657-662(2008).-Sungil Moon, Masatoshi Iji, “Fabrication and Characterization of Poly(ButhyleneSuccinate) (PBS)-grafted Carbon Fiber / Poly(L-lactide) (PLLA) Nanocomposites”,Journal of Polymer Science Part A: Polymer Chemistry”, 46, 4433-4441(2008).-Pengju Pan, Bo Zhu, Weihua Kai, Shin Serizawa, Masatoshi Iji, YoshioInoue, ”Crystallization Behavior and Mechanical Properties of Bio-based GreenComposites Based on Poly(L-lactide) and Kenaf Fiber”, Journal of AppliedPolymer Science, 15,1511-1520 (2007).-Riko Ozao, Takashi Sawaguchi, Hedeya Ishida, Masatoshi Iji, Teruo Furuyama,Yoshikazu Shinohara, Katsutoshi Yamada, Kohmei Halada, ”Eco-MCPS: a NewlyWeb-Based Database for Eco-Material in Japan”, Material Transaction,48,12,3043-3049 (2007).-Makoto Soyama, Kazuhiko Inoue, Masatoshi Iji, ”Flame Retardancy ofPolycarbonate Enhanced by Adding Fly Ash 、 ” Polymers for AdvancedTechnologies, 18, 5, 386-391(2007).-Y. Kiuchi, M. Iji, H. Nagashima, and T. Miwa, “Increase in Flame Retardance ofGlass-Epoxy Laminates without Halogen or Phosphorous Compounds bySimultaneous Use of Incombustible-Gas Generator and Charring Promoter”,Journal of Applied Polymer Science, 101, 5, 3367-3375 (2006).-S. Serizawa, K. Inoue, M. Iji,” Kenaf-fiber-reinforced Poly(lactic acid) Used forElectronic Products”, Journal of Applied Polymer Science, 100, 1, 618-624(2006).-Akinobu Nakamura, Keiji Hirano, and Masatoshi Iji, “Decomposition ofTrichlorobenze with Different Radicals Generated by Alternating CurrentElectrolysis in Aqueous Solution”, Chemistry Letters, 34, 6, 802-803(2005).-Masatoshi Iji and Yukihiro Kiuchi, “Environmentally Friendly Flame-ResistantGlass-Epoxy Printed Wiring Boards with No Halogen or Phosphorus Compounds”,Journal of Material Science: Materials in Electronics, 15, 175-782 (2004).-Masatoshi Iji, Yukihiro Kiuchi, and Makoto Soyama, “Flame Retardancy and HeatResistance of Phenol-Biphenylene-Type Epoxy Resin Compound Modified withBenzoguanamine”, Polymers for Advanced Technologies, 14, 638-644 (2003).- Masatoshi Iji and Yukihiro Kiuchi, “Self-Extinguishing Epoxy Molding Compoundwith No Flame-Retarding Additives for Electronic Components”, Journal ofMaterial Science: Materials in Electronics, 12, 715-723 (2001).-Masatoshi Iji and Yukihiro Kiuchi, “Flame-Retardant Epoxy Resin CompoundsContaining Novolac Derivatives with Aromatic Compounds”, Polymers forAdvanced Technologies, 12, 393-406 (2001).2

-Masatoshi Iji and Shin Serizawa, “Silicone Derivatives as New Flame Retardantsfor Aromatic Thermoplastics Used in Electronic Devices”, Polymers for AdvancedTechnologies, 9, 593-600 (1998).-Masatoshi Iji and Yuji Ikuta, “Pyrolysis-Based Material Recovery from MoldingResin for Electronic Parts”, Journal of Environmental Engineering, 124, 9,821-828 (1998).-Masatoshi Iji, “Recycling of Epoxy Resin Compounds for Molding ElectronicComponents”, Journal of Material Science, 33, 45-53 (1998).-Masatoshi. Iji and Sadahiko Yokoyama, “Recycling of Printed Wiring Boards withMounted Electronic Components”, Circuit World, 23, 3, 10-15 (1997).■ Invited International Conference (16)First author・EcoBalance 2012,“Highly Functional Bioplastic Used for Electronic Products: Polylactic Acid Composites and Cellulose-Cardanol Resin”, Proceedings C3-06 /Yokohama, Japan・Innovation Takes Root 2012 ”Highly functional PLA composites used for electronicproducts” ,Proceedings 30(2012)/ Orlando, USA・4 th Bioplastic Market :“Environmentally Friendly Flame Retardant Bioplastic(PLA Composite)”(2010.) /Shanghai, China.・ICEM9 Committee in The Ecomaterials Forum(The Society of Non-TraditionalTechnology (SNTT) ) : ”Highly Functional Bioplastics Used for ElectronicProducts”, Proceedings of the 9 th International Conference on Eco-Material, E05、59-60 (2009) / Nara, Japan.・ INC5 Committee: “ Highly Functional Biomass-based Plastics UsingNano-Composite Technologies” 5th International Nanotechnology Conference onCommunication and Cooperation, SESSION 5: Energy & Resource Management(2009) / LA,USA.・BioJapan 2008: “Application of bioplastics to electronic products” BioJapan 2008Committee (2008) / Yokohama, Japan.・National Innovation Agency (NIA) of Thailand, Highly Functional BioplasticsUsed for Electronic Products ” Int. Conf. on Biofuel & Bioplastics (EcoInnovAsia)Proceeding 57(2008) / Bangkok, Thailand.3

・Netherlands Ministry of Economic Affairs:“ Highly Functional Bioplastics Used forDurable Products” Innovative Technologies in Bio-Based Economy (2008)/Wageningen, Netherlands・Advances in Eco-materials: ”Development of Highly Fuctional Bioplastics andTheir Application in Durable Products”, Proceedings of the 8 th InternationalConference on Eco-Material(ICEM8 2007), 1,3-11(2007) / London, UK, Key notespeaker・Inno Bio Plast 2006: ”Highly Functional Bioplastics (PLA Composites) Used forElectronic Products”, Proceedings of inno Bio Plast 2006 / Bangkok, Thailand.・KJGCW-2: ”Highly Functional PLA Composites Used for Electronic Products”,Proceedings of 2 nd Korea-Japan Green Composites Workshop,195-212(2006) /Gang Won, Korea.・Bioplastics 2005:“Using Bioplastics in Electronic Products in Japan andDeveloping High-Performance PLA /Kenaf Composites”, Proceedings ofBioplastic 2005 /Frankfurt, Germany. Key note speaker・ PAT 99: “Newly Designed Silicone Flame Retardant and ItsMechanisms ”,Proceedings of, the 5TH International Symposium on Polymer forAdvanced Technologies, Tokyo, Japan,14-15(1999).・Eco Design ’99: “New Environmentally Conscious Flame-Retarding Plastics forElectronic Products”, Proceedings of Eco Design ’99: First InternationalSymposium on Environmentally Conscious Design and Inverse Manufacturing,Tokyo, Japan, 245-249 (1999). Key note speakerCo-presentation・ Yukihiro Kiuchi, Masatoshi Iji, Bioplastics Compounding & Processing 2011,"Development of durable bio-plastics used in electronic products", Proceedings ofBCP 2011, (March 29-30, 2011), /FL, USA.■ International Conference (33)・ Shukichi Tanaka, Hideki Honzawa, Masatoshi Iji, “ Development ofcardanol-bonded cellulose thermoplastics: high productivity by usingdiisocyanate-modified cardanol”, IPC 2012, Kobe, Japan, Proceedings, 14C16、2012. Dec. 14.・ Shukichi Tanaka, Hideki Honzawa, Masatoshi Iji, “ Development of4

cardanol-bonded cellulose thermoplastics: high productivity by usingdiisocyanate-modified cardanol”, ICC 2012, Sapporo, Japan, Proceedings, O22(2012).・Shukichi Tanaka, Masatoshi Iji, “Mechanical, thermal and hydrophobic propertiesof cellulose diacetate bonded with cardanol and aromatic components”,IUMRS-ICEM 2012, Yokohama, Japan, Proceedings, D-2-O24-003 (2012).・Shukichi Tanaka, Masatoshi Iji, "Novel cellulose-based bioplastic with highrability: Cellulose diacetate bonded with cardanol from cashew nutshells andaromatic components"243st ACS National Meeting & Exposition, San Diego,California, USA, poster (2012).・ Sungil Moon, Shukichi Tanaka, Masatoshi Iji, "Durable Cellulose-BasedBioplastic: Cellulose Acetate Grafted with Cardanol Derived from Cashew NutShells", 241st ACS National Meeting & Exposition, Anaheim, California, USA,Proceedings, 104, 269-270 (2011).・Makoto Soyama, Yukihiro Kiuchi, Masatoshi Iji, ”Improvements in toughness ofpolylactic acid by adding specific silicones”,241st ACS National Meeting &Exposition, Anaheim, California, USA, Proceedings, 104, 151-152 (2011).・Makoto Soyama, Akinobu Nakamura, Masatoshi Iji "Improvement of Toughnessand Heat Diffusion of Polylactic Acid by Adding Reactive Silicone and CarbonFiber", 239th ACS National Meeting & Exposition, San Francisco, California,USA, Proceedings, 102, 363 (2010)・Yukihiro Kiuchi, Masatoshi Iji, “Development of Highly Functional Biomass-basedPlastics for Electronic Equipments”, 2010 IEEE Systems Packaging JapanWorkshop, Kyoto, Japan 2010・Akinobu Nakamura, Makoto Soyama and Masatoshi Iji "Thermally ConductivePolylactic Acid Composites with a Net-Like Structure of Carbon Fibers", 237thACS National Meeting & Exposition, Salt Lake City, Utah, USA, Proceedings,100,376-377 (2009).・Kazuhiko Inoue, Shin Serizawa, Midori Yamashiro, and Masatoshi Iji, "HighlyFunctional Bioplastics (PLA compounds) Used for Electronic Products",Polytronic 2007 - 6th International Conference on Polymers and Adhesives inMicroelectronics and Photonics, Tokyo, Japan, Proceedings, 73-76 (2007).・ Midori Yamashiro, Kazuhiko Inoue, Masatoshi Iji, “Intelligent Bio-plasticsPerforming Rewritable Shape Memory”, Green Sustainable ChemistryInternational Conference. Japan, Proceedings, 206 (2007).・ Midori Yamashiro, Kazuhiko Inoue, Masatoshi Iji, “Intelligent Bio-plastics5

Performing Rewritable Shape Memory”, Polymer Processing and Society (PPS)Japan, Proceedings,187 (2006).・ Kazuhiko Inoue, Midori Yamashiro, Masatoshi Iji, “Thermo-reversiblyCross-linked Biomass-plastic Acting Rewritable Shape Memory”, Int. Symp. onEnvironmentally Conscious Design & Inverse Manufacturing (EcoDesign), Japan,(2005).・ Kazuhiko Inoue, Midori Yamashiro, and Masatoshi Iji, "Thermo-reversiblycross-linked polylactic acid acting rewritable shape memory", 230th ACSNational Meeting & Exposition, Washington DC, USA, Proceedings, 93, 967(2005).・ Midori Yamashiro, Kazuhiko Inoue, Masatoshi Iji, “Intelligent Bio-plasticsPerforming Rewritable Shape Memory”, Int. Conf. on Organic MaterialsTechnology (ORGA TECHNO) , Japan , Proceedings, 290 (2005).・Shin Serizawa, Kazuhiko Inoue, Masatoshi Iji, “Kenaf Fiber-Reinforced PolylacticAcid Used for Electronic Products”, Int. Conf on Eco-Materials (ICEM),Singapore, (2005).・Yukihiro Kiuchi, Masatoshi Iji, “Flame-retarding Epoxy-laminate-type PrintedWiring Board with No Use of Halogen and Phosphorus Compounds”, Int. Conf. onEco-Materials (ICEM), Singapore, (2005).・ Shin Serizawa, Kazuhiko Inoue, Masatoshi Iji, “ Kenaf Fiber-ReinforcedBiomass-Plastic Used For Electronic Products”, Int. Symp. on EnvironmentallyConscious Design & Inverse Manufacturing (EcoDesign) , Japan, 120-121(2005).・ Yukihiro Kiuchi, Masatoshi Iji, “Environmentally Friendly Flame-RetardingPlastics for Electronic Devices”, Green Sustainable Chemistry InternationalConference (GSC), Japan,(2003).・ Yukihiro Kiuchi, Masatoshi Iji, “Environmentally Conscious IC MoldingCompound without Toxic Flame-Retardants”, Int. Symp. on SemiconductorManufacturing (ISSM), USA, Proceedings,147-150 (2000)・ Yukihiro Kiuchi, Masatoshi Iji, “Self-extinguishing Epoxy Resin Compoundwithout Toxic Flame Retardants”, Int. Flame Retardant (IFR) Beijing Inst ofTechnology, Chinese, (1999).・Shunji Kishida, Masatoshi Iji, Yukihiro Kiuchi, “Self-Extinguishing Epoxy ResinCompound without Flame-Retarding Additives and Its Potential Application toIC-Molding Compounds”, Int Conf on Halogen-Free Materials for Electronic &Electrical Products Inst for Production Engineering Research (IVF), Sweden,(1999).6

・ Sadahiko Yokoyama, Yukihiro Kiuchi, Masatoshi Iji “Development ofSeparation/Recovery Technology for Paper and Plastic”, Int. Conf onEco-Materials (ICEM) Japan, (1999).・Sadahiko Yokoyama, Masatoshi Iji, “Recycling System for Printed Wiring Boardswith Mounted Parts”, Int. Symp. on East Asian Recycling Technology,Japan, (1999).・Sadahiko Yokoyama, Yugi Ikuta, Masatoshi Iji, “Recycling System for PrintedWiring Boards with Mounted Parts”, Int. Symp. on Environmentally ConsciousDesign & Inverse Manufacturing (EcoDesign), Japan, (1999).・Shin Serizawa, Masatoshi Iji, “New Flame-Retarding Polycarbonate Resin with aSilicone Derivative”, Int. Conf. on the New Polymers Inst of Physics, UK, (1998).・Masatoshi Iji, “Recycling of IC Modeling resin Waste from IC Package ProductionProcess“ Int. Semiconductor Manufacturing Science (Symp. Semiconductor Equip& Materials Inst:SEMI) 197-200 Japan,(1997).・Masatoshi Iji, Sadahiko Yokoyama, ”Recycling of Printed Wiring Boards MountingElectronic Components Inst of Printed Circuits (IPC) Printed Circuits WorldConvention (PCWC), Swaziland, (1996).・Yuji Ikuta, Masatoshi Iji, Daisuku Ayukawa, Shinji Shibano “A Pyrolysis-basedTechnology for Recovering Useful Metrials from IC Package Modeling ResinWaste”, IEEE Int Symp on Electronics & Environment, USA, Proceedings,124-129 (1996).・Sadahiko Yokoyama, Masatoshi Iji “Recycling of Thermosetting Plastic Wastesfrom Electronic Component Production Processes ” , IEEE Int. Symp. onElectronics & Environment, USA, Proceedings, 132-137(1995).・Sadahiko Yokoyama, Masatoshi Iji “Material recycling of Thermosetting PlasticWastes for Electronic Components”, Workshop on Disposal & Recycling of OrganicConstruction Materials, RILEM, Japan, Proceedings, 126-136 (1995).・Sadahiko Yokoyama, Masatoshi Iji, “Recycling of Printed Wiring Board Waste”Int.Workshop on Advanced Robotics, IEEE /Intelligent Robots & Systems, USA,Proceedings, 55-58(1993).・Sadahiko Yokoyama, Masatoshi Iji,” Recycling of Silicon from Silicon SuspensionDrainage in Integrated Circuit Fabrication Process” Int. Conf on Industrial WasteMinimization, USA, Proceedings,3409-3416 (1992).7