Effects of Ring Design on CMP Process Stability and Slurry Usage

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Outline and Motivation <strong>Ring</strong> wear rates and lifetime Thermal environment at <strong>Ring</strong> interface <strong>Ring</strong> Surface Interactions Optimization <strong>of</strong> slurry usage Wafer results with alternate polymer and geometry– Break-In, removal rate, defects Process optimization with lower process COOPage 2ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published only with Permission
<strong>Ring</strong> Lifetime Correlates to Wear RatePPSPEEKPrePost Many studies have detailed wear rate, generally indicating lower CoFand wear rates for PEEK as compared to PPS– End user operating conditions have significant impact on final results Lower CoF results in lower energy states, as reflected in the thermalenvironment on the pad/ring interface Results indicated that there was no significant difference in the shearforce associated with the two ring designs, thus removing anyconcerns that the optimized retaining ring could increase pad wearPage 3ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published only with Permission
Page 1: purifyEffects <str
Page 6 and 7: Slurry Usage Measured In-Situ Two r
Page 8 and 9: Videos of DEUVEF S
Page 10 and 11: No RR Variation with Different Poly
Page 12 and 13: Understanding Retaining Rin

Effects of Ring Design on CMP Process Stability and Slurry Usage

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