Effects of Ring Design on CMP Process Stability and Slurry Usage

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Videos <strong>of</strong> DEUVEF StudyEmbedded videos will not play in pdfformat. Please e-mail David Stockbowerat david_stockbower@entegris.com for therelevant files and informationStandard Slot <strong>Design</strong>Generation <strong>of</strong> Bow WaveExcess Slurry UsageNovel Slot <strong>Design</strong>Suppression <strong>of</strong> Bow WaveReduced Slurry UsageMethod proprietary to Araca, IncPage 8ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published only with Permission
A Costly Step - <strong>Ring</strong> Break-In <strong>Ring</strong>s break-in varies at endusers– Defects, wafer count, timedriven, PM cycle– Highly dependant on speed,pressure, fluid– Usually concurrent with padchange and break-in Absolutely necessary, but costly Working to correlate ringcondition to ring break-in– Edge effects– Polymer type & quality– Surface finishSum All Defects2000180016001400120010008006004002000No breakinDefecitvity comparison breakin vs No breakinSP1 0.16µDWOAfter breakinDNOPage 9ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published only with Permission
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Page 3 and 4: Ring Lifetime Corr
Page 6 and 7: Slurry Usage Measured In-Situ Two r
Page 10 and 11: No RR Variation with Different Poly
Page 12 and 13: Understanding Retaining Rin

Effects of Ring Design on CMP Process Stability and Slurry Usage

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