Effects of Ring Design on CMP Process Stability and Slurry Usage
Effects of Ring Design on CMP Process Stability and Slurry Usage
Effects of Ring Design on CMP Process Stability and Slurry Usage
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240Thermal Envir<strong>on</strong>ment due to Polymer Choice Operating temperatures mayplay a role in the morechemically dominated <strong>CMP</strong>processes Overall, temperature effects aredriven by the pad/ring/waferinterface rather than thepad/pad c<strong>on</strong>diti<strong>on</strong>er interface. Platen <strong>and</strong> head asymptoteover time APD-800 tool for200/300 mm processingenables real timein-situ analysis504846444240153045607590105120135150165180195225210240Temperature ( ºC )464442403836Polishing Time ( min )153045607590105120135150165180195225210PPS / PU InterfacePEEK / PU InterfaceTemperature ( ºC )Polishing Time ( min )Page 4ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published <strong>on</strong>ly with Permissi<strong>on</strong>
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