Effects of Ring Design on CMP Process Stability and Slurry Usage
Effects of Ring Design on CMP Process Stability and Slurry Usage
Effects of Ring Design on CMP Process Stability and Slurry Usage
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<strong>Slurry</strong> <strong>Usage</strong> Measured In-Situ Two retaining rings with theindustry st<strong>and</strong>ard <strong>and</strong> optimizedslot designs were attached to a200-mm quartz waferUpside down for clarity The thickness <str<strong>on</strong>g>of</str<strong>on</strong>g> the slurry filmbetween the pad <strong>and</strong> wafer wasmeasured using dual emissi<strong>on</strong> UVenhanced fluorescence (DEUVEF)at different slurry flow rates (150<strong>and</strong> 220 ml/min), pad/wafer rotati<strong>on</strong>rates (80 <strong>and</strong> 120 RPM) <strong>and</strong>retaining ring/wafer pressures (1.8<strong>and</strong> 3.6 PSI) The next slide shows the slurry filmthickness measurementsassociated with the two rings.Page 6ENTEGRIS PROPRIETARY AND CONFIDENTIAL, Published <strong>on</strong>ly with Permissi<strong>on</strong>
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