11.07.2015 Views

A Successful Strategy for Satellite Development and Testing - Inpe

A Successful Strategy for Satellite Development and Testing - Inpe

A Successful Strategy for Satellite Development and Testing - Inpe

SHOW MORE
SHOW LESS
  • No tags were found...

You also want an ePaper? Increase the reach of your titles

YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.

Measured accelerationtime histories are usedto derive shock test requirements.Shock levels are specifiedas shock responsespectra defined over afrequency range. Theshock response spectrauses the responseof single-degree-offreedomoscillators,computed in 1/6 octaveb<strong>and</strong>s to convertthe time history to thefrequency domain.300200100–100–200through the release of structural strain. Experiencehas shown that shock can induce ahard or intermittent failure or exacerbate alatent defect. Commonly encountered hardwarefailures include relay transfer, crackingof parts, dislodging of contaminants, <strong>and</strong>cracking of solder at circuit-board interfaces.Unit-level shock tests are accomplishedusing one of several methods, which generallyentail securing the component to afixture that is then subjected to impact. This“ringing plate” approach has provided thebest practicable simulation of unit exposureto shock. In addition, vibration shakers areused in some applications to impart a transientshock. Shock testing is typically notTemperatureFFHS, FFCS, FF0–300552.50 552.55 552.60 552.65 552.70 552.75 552.8010 310 210 1 10 310 2 10 4AFAFAFCS, FFper<strong>for</strong>med as a unit workmanship screen,but is deferred to the system level <strong>for</strong> greaterdetection of functional defects. System-levelshock tests usually activate the separationor deployment systems, providing a directsimulation of the mission event. Thus, theydo not include any amplitude margin. Testfixtures are used to support hardware thathas been deployed or separated to preventsubsequent contact or damage. System-levelshock tests provide an excellent opportunityto measure shocks incident on componentsthroughout the space vehicle.Accurate prediction of high-frequencyshock levels, such as those associated withexplosive ordnance, remains an elusive goal.HS, FFTimeFFA typical thermal cyclingor thermal vacuumtest profile. Theprofile shows temperaturehistory <strong>and</strong> alwaysstarts <strong>and</strong> ends at roomtemperature. Hot starts(HS), cold starts (CS),full functional tests (FF),<strong>and</strong> abbreviated functionaltests (AF) are per<strong>for</strong>medat temperatureplateaus.There<strong>for</strong>e, it is important that the shock environmentbe assessed during the developmentphase of the program through both analysis<strong>and</strong> test simulations. Shock analysis includesconsideration of the source amplitudes,durations, transmission paths, path materials,<strong>and</strong> path discontinuities. <strong>Development</strong>tests employ an accurate replica of the flightstructure with all significant constituentssimulated. Deployed hardware is <strong>for</strong>ced tophysically separate at least a small amountto provide realistic shock transmission paths.When practical, a shock-producing event isrepeated several times to permit meaningfulstatistical evaluation of the resultingdata. Qualification margins at the unit levelare typically 6 decibels on amplitude <strong>and</strong>twice the number of flight activations. At thesystem level, it is generally impractical toimpose an amplitude qualification margin;however, a margin of two or three activationsis imposed. Aerospace provides expertise <strong>for</strong>the prediction of test levels <strong>and</strong> the configurationof the hardware interfaces to achievean effective test.Thermal <strong>Testing</strong>Launch vehicles <strong>and</strong> spacecraft must endurea wide range of temperatures associated withliftoff <strong>and</strong> ascent through the atmosphere,direct impingement of solar radiation, <strong>and</strong>travel through the extreme temperatures ofspace. The thermal environment is generallyconsidered the most stressful operating environment<strong>for</strong> hardware in terms of fatigue,<strong>and</strong> it has a direct bearing on unit reliability.For example, the use of materials with differingcoefficients of thermal expansionhas resulted in unsuccessful deploymentsof mechanical assemblies <strong>and</strong> payloads.Outgassing increases significantly withtemperature, <strong>and</strong> the resulting contaminantswill more readily adhere <strong>and</strong> chemicallybond to colder surfaces. Electronic parts areespecially sensitive to the thermal conditions<strong>and</strong> are subject to problems such as cracks,delamination, bond defects, discoloration,per<strong>for</strong>mance drift, coating damage, <strong>and</strong>solder-joint failure.Thermal testing is used to screen outcomponents with physical flaws <strong>and</strong> demonstratethat a device can activate <strong>and</strong> operatein extreme <strong>and</strong> changing temperatures. Thefour most common thermal tests are thermalcycling, thermal vacuum testing, thermalbalance testing, <strong>and</strong> burn-in testing. Thermalcycling subjects the test article to a numberof cycles at hot <strong>and</strong> cold temperatures in anambient-air or gaseous-nitrogen environ-14 • Crosslink Fall 2005

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!