Page 1 of 360 Indonesia 2007.xls Indonesia's 2007 CEPT Package ...

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Indonesia's 2007 CEPT PackagePriorityAHTN CodeNegativeCC Description IntegrationStatus(ver.2007)ListSectorMFNTariffRates(datedNov2006)01.01 Live horses, asses, mules and hinnies.ID 8486.30.90.00 --Othernone/ICT/electronicsIL 5 08486.40 -Machines and apparatus specified in Note 9(C) to this Chapter :ID 8486.40.10.00 --Focused ion beam milling machines to IL 0 0produce or repair masks and reticles forpatterns on semiconductor devicesID 8486.40.20.00 --Die attach apparatus, tape automatednone/ICT/electronicsIL 5 0bonders, wire bonders and encapsulationequipment for assembly of semiconductors;automated machines for transport, handlingand storage of semiconductor wafers, wafercassettes, wafer boxes and other materialsfor semiconductor devicesID 8486.40.30.00 --Moulds for manufacture of semiconductor electronics IL 0 0devicesID 8486.40.40.00 --Optical stereoscopic microscopes fittedICT/electronicsIL 0 0with equipment specifically designed forthe handling and transport of semiconductorwafers or reticlesID 8486.40.50.00 --Photomicrographic microscopes fitted withICT/electronicsIL 0 0equipment specifically designed for thehandling and transport of semiconductorwafers or reticlesID 8486.40.60.00 --Electron beam microscopes fitted withICT/electronicsIL 5 0equipment specifically designed for thehandling and transport of semiconductorwafers or reticlesID 8486.40.70.00 --Pattern generating apparatus of a kindICT/electronicsIL 0 0used for producing masks or reticles fromphotoresist coated substratesID 8486.40.90.00 --Othernone/ICT/electronicsIL 5 08486.90 -Parts and accessories :--Of machines and apparatus for themanufacture of boules or wafers :ID 8486.90.11.00 ---Of apparatus for rapid heating ofICT/electronicsIL 5 0semiconductor wafersID 8486.90.12.00 ---Of spin dryers for semiconductor wafer ICT IL 0 0processingID 8486.90.13.00 ---Of machines for working any material by ICT IL 0 0removal of material, by laser or otherlight or photon beam in the production ofsemiconductor wafers---Of machines for sawing monocrystalsemiconductor boules into slices, orwafers into chips :ID 8486.90.14.00 ----Tool holders and self-opening dieheads; electronics IL 0 0work holders; dividing heads and otherspecial attachments for machine toolsID 8486.90.15.00 ----OtherICT/electronicsIL 0 0ID 8486.90.16.00 ---Of grinding, polishing and lappingICT/electronicsIL 0 0machines for processing of semiconductorwafersCEPTRates2007Page 278 of 360Indonesia 2007.xls
Indonesia's 2007 CEPT PackagePriorityAHTN CodeNegativeCC Description IntegrationStatus(ver.2007)ListSectorMFNTariffRates(datedNov2006)01.01 Live horses, asses, mules and hinnies.ID 8486.90.17.00 ---Of apparatus for growing or pullingICT/electronicsIL 0 0monocrystal semiconductor boulesID 8486.90.19.00 ---Othernone/ICT/electronicsIL 5 0--Of machines and apparatus for themanufacture of semiconductor devices or ofelectronic integrated circuits :ID 8486.90.21.00 ---Of chemical vapour deposition apparatusICT/electronicsIL 5 0for semiconductor productionID 8486.90.22.00 ---Of epitaxial deposition machines forICT/electronicsIL 0 0semiconductor wafers; of spinners forcoating photographic emulsions onsemiconductor wafersID 8486.90.23.00 ---Of ion implanters for doping semiconductorICT/electronicsIL 5 0materials; of apparatus for physicaldeposition by sputtering on semiconductorwafers; of physical deposition apparatusfor semiconductor production; of directwrite-on-wafer apparatus, step and repeataligners and other lithography equipment---Of spraying appliances for etching,stripping or cleaning semiconductor wafers;of apparatus for wet etching, developing,stripping or cleaning semiconductor wafers;of dry-etching patterns on semiconductormaterials :ID 8486.90.24.00 ----Tool holders and self-opening dieheads;none/ICT/electronicsIL 0 0work holders; dividing heads and otherspecial attachments for machine toolsID 8486.90.25.00 ----OtherICT/electronicsIL 5 0---Of dicing machines for scribing or scoringsemiconductor wafers; of lasercutters forcutting tracks in semiconductor productionby laser beam; of machines for bending,folding and straightening semiconductorleads :ID 8486.90.26.00 ----Tool holders and self-opening dieheads; electronics IL 0 0workholders; dividing heads and otherspecial attachments for machine toolsID 8486.90.27.00 ----OtherICT/electronicsIL 0 0ID 8486.90.28.00 ---Of resistance heated furnaces and ovensICT/electronicsIL 0 0for the manufacture of semiconductordevices on semiconductor wafers; ofinductance or dielectric furnaces andovens for the manufacture of semiconductordevices on semiconductor wafersID 8486.90.29.00 ---Othernone/ICT/electronicsIL 5 0--Of machines and apparatus for themanufacture of flat panel displays :ID 8486.90.31.00 ---Of apparatus for dry etching patterns onICT/electronicsIL 0 0flat panel display substrates---Of apparatus for wet etching, developing,stripping or cleaning flat panel displays :CEPTRates2007Page 279 of 360Indonesia 2007.xls
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