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AANZFTA - Annex 1 (Myanmar) 1 Annex 1 Schedule of Tariff ...

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<strong>Annex</strong> 1<strong>Schedule</strong> <strong>of</strong> <strong>Tariff</strong> Commitments<strong>Myanmar</strong>Base RateHS Code Description 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024(2005 MFN)8454100000 - Converters 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%845420 - Ingot moulds and ladles:8454201000 - - Ingot moulds 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8454202000 - - Ladles 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8454300000 - Casting machines 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8454900000 - Parts 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8455 Metal-rolling mills and rolls therefor.8455100000 - Tube Mills 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%- Other rolling mills:8455210000 - - Hot or combination hot and cold 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8455220000 - - Cold 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8455300000 - Rolls for rolling mills 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8455900000 - Other parts 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456 Machine-tools for working any material byremoval <strong>of</strong> material, by laser or other light orphoton beam, ultrasonic, electro-discharge,electro-chemical, electron beam, ionic-beam orplasma arc processes.845610 - Operated by laser or other light or photon beamprocesses:8456101000 - - Machines for working any material by removal <strong>of</strong> 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%material, by laser or other light or photon beam in theproduction <strong>of</strong> semiconductor wafers [ITA1/A-121];lasercutters for cutting contacting tracks insemiconductor production by laser beam [ITA1/B-125]8456109000 - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456200000 - Operated by ultrasonic processes 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456300000 - Operated by electro-discharge processes 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%- Other:8456910000 - - For dry-etching patterns on semiconductor1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%materials [ITA1/A-123]845699 - - Other:8456991000 - - - Focused ion beam milling machine to produce 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%or repair masks and reticles for patterns onsemiconductor devices [ITA1/A-124]; apparatus forstripping or cleaning semiconductor wafers [ITA1/B-122]8456992000 - - - Machine tools, numerically controlled, for1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%working any material by removal <strong>of</strong> material, byplasma arc processes, for the manufacture <strong>of</strong>PCB/PWBs [ITA/2 (AS2)]8456993000 - - - Apparatus for dry etching patterns on flat panel 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%display substrates [ITA/2(AS2)]8456994000 - - - Wet processing equipment for the application by 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%immersion <strong>of</strong> electrochemical solutions, whether ornot for the purpose <strong>of</strong> removing material onPCB/PWB substrates [ITA/2(AS2)]8456999000 - - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8457 Machining centres, unit construction machines(single station) and multi-station transfermachines, for working metal.8457100000 - Machining centres 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8457200000 - Unit construction machines (single station) 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8457300000 - Multi-station transfer machines 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8458 Lathes (including turning centres) for removingmetal.- Horizontal lathes:2025 andsubsequentyears<strong>AANZFTA</strong> - <strong>Annex</strong> 1 (<strong>Myanmar</strong>) 291

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