AANZFTA - Annex 1 (Myanmar) 1 Annex 1 Schedule of Tariff ...

More documents

Recommendations

Info

Annex 1Schedule of Tariff CommitmentsMyanmarBase RateHS Code Description 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024(2005 MFN)8465911000 - - - For scoring PCB/PWBs or PCB/PWB substrates 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%[ITA/2 (AS2)], electrically operated8465912000 - - - Other, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465919000 - - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846592 - - Planing, milling or moulding (by cutting) machines:8465921000 - - - For routing PCB/PWBs or PCB/PWB substrates, 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%accepting router bits with a shank diameter notexceeding 3.175 mm, for scoring PCB/PWBs orPCB/PWB substrates [ITA/2 (AS2)]8465922000 - - - Other, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465929000 - - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846593 - - Grinding, sanding or polishing machines:8465931000 - - - Electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465932000 - - - Not electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846594 - - Bending or assembling machines:8465941000 - - - Electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465942000 - - - Not electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846595 - - Drilling or morticing machines:8465951000 - - - Drilling machines for the manufacture of1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%PCB/PWBs, with a spindle speed exceeding 50,000rpm and accepting drill bits of a shank diameternot exceeding 3.175 mm [ITA/2 (AS2)]8465952000 - - - Morticing machines, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465953000 - - - Other, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465959000 - - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846596 - - Splitting, slicing or paring machines:8465961000 - - - Electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465962000 - - - Not electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846599 - - Other:8465991000 - - - Woodworking presses, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465992000 - - - Woodworking presses, not electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465993000 - - - Lathes, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465994000 - - - Lathes, not electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465995000 - - - Machines for deburring the surfaces of1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%PCB/PWBs during manufacturing; for scoringPCB/PWBs or PCB/PWB substrates; laminatingpresses for the manufacture of PCB/PWBs [ITA/2(AS2)]8465996000 - - - Other, electrically operated 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8465999000 - - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8466 Parts and accessories suitable for use solely orprincipally with the machines of headings 84.56to 84.65, including work or tool holders, self -opening dieheads, dividing heads and otherspecial attachments for machine - tools; toolholders for any type of tool for working in thehand.846610 - Tool holders and self-opening dieheads:8466101000 - - For the machine-tools of subheadings1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456.99.20, 8456.99.30, 8456.99.40, 8460.31.10,8465.91.10, 8465.92.10, 8465.95.10 and 8465.99.50[ITA/2 (AS2)]2025 andsubsequentyearsAANZFTA - Annex 1 (Myanmar) 296
Annex 1Schedule of Tariff CommitmentsMyanmarBase RateHS Code Description 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024(2005 MFN)8466102000 - - For machines for sawing monocrystal1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%semiconductor boules into slices, or wafers intochips [ ITA1/B-129 ]; parts of dicing machines forscribing or scoring semiconductor wafers [ ITA1/B-130 ]; parts for lasercutters for cutting tracks insemiconductor production by laser beam [ITA1/B-133]; parts of machines for bending, folding andstraightening semiconductor leads [ITA1/B-157]8466109000 - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846620 - Work holders:8466201000 - - For the machine-tools of subheadings1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456.99.20, 8456.99.30, 8456.99.40, 8460.31.10,8465.91.10, 8465.92.10, 8465.95.10 and 8465.99.50[ITA/2 (AS2)]8466202000 - - For machines for sawing monocrystal1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%semiconductor boules into slices, or wafers intochips [ITA1/B-129]; parts of dicing machines forscribing or scoring semiconductor wafers [ ITAI/B-130 ]; parts of lasercutters for cutting contactingtracks in semiconductor production by laser beam[ITA1/B-133]; parts of machines for bending,folding and straightening semiconductor leads[ITAI/B-157]8466203000 - - For apparatus for wet etching, developing,1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%stripping or cleaning semiconductor wafers and flatpanel displays [ITA1/B-153,B-169]8466209000 - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%846630 - Dividing heads and other special attachments formachine-tools:8466301000 - - For the machine-tools of subheadings1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%8456.99.20, 8456.99.30, 8456.99.40, 8460.31.10,8465.91.10, 8465.92.10, 8465.95.10 and 8465.99.50[ITA/2(AS2)]8466302000 - - For machines for sawing monocrystal1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%semiconductor boules into slices, or wafers intochips [ITA1/B-129]; parts of dicing machines forscribing or scoring semiconductor wafers [ITA1/B-130]; parts of lasercutters for cutting contactingtracks in semiconductor production by laser beam[ITA1/B-133]; parts of machines for bending,folding and straightening semiconductor leads[ITAI/B-157]; parts of apparatus for stripping orcleaning semiconductor wafers [ITAI/B-135]2025 andsubsequentyears8466303000 - - For apparatus for wet etching, developing,1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%stripping or cleaning semiconductor wafers and flatpanel displays [ITAI/B-153, B-169]8466309000 - - Other 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%- Other:846691 - - For machines of heading 84.64:8466911000 - - - Parts of machines for sawing monocrystal1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 1% 0% 0% 0% 0% 0% 0%semiconductor boules into or wafers into chips[ITAI/B-129]; parts of grinding, polishing and lappingmachines for processing of semiconductor wafers[ITA1/A-131]; parts of dicing machines for scribingor scoring semiconductor wafers [ITA1/B-130];parts of apparatus for wet etching, developing,stripping or cleaning semiconductor wafers and flatpanel displays [ITA1/B-153, B-169]AANZFTA - Annex 1 (Myanmar) 297
Page 2 and 3:
Annex 1Schedule of Tariff Commitmen
Page 4 and 5:
Page 6 and 7:
Page 8 and 9:
Page 10 and 11:
Page 12 and 13:
Page 14 and 15:
Page 16 and 17:
Page 18 and 19:
Page 20 and 21:
Page 22 and 23:
Page 24 and 25:
Page 26 and 27:
Page 28 and 29:
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
Page 38 and 39:
Page 40 and 41:
Page 42 and 43:
Page 44 and 45:
Page 46 and 47:
Page 48 and 49:
Page 50 and 51:
Page 52 and 53:
Page 54 and 55:
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
Page 66 and 67:
Page 68 and 69:
Page 70 and 71:
Page 72 and 73:
Page 74 and 75:
Page 76 and 77:
Page 78 and 79:
Page 80 and 81:
Page 82 and 83:
Page 84 and 85:
Page 86 and 87:
Page 88 and 89:
Page 90 and 91:
Page 92 and 93:
Page 94 and 95:
Page 96 and 97:
Page 98 and 99:
Page 100 and 101:
Page 102 and 103:
Page 104 and 105:
Page 106 and 107:
Page 108 and 109:
Page 110 and 111:
Page 112 and 113:
Page 114 and 115:
Page 116 and 117:
Page 118 and 119:
Page 120 and 121:
Page 122 and 123:
Page 124 and 125:
Page 126 and 127:
Page 128 and 129:
Page 130 and 131:
Page 132 and 133:
Page 134 and 135:
Page 136 and 137:
Page 138 and 139:
Page 140 and 141:
Page 142 and 143:
Page 144 and 145:
Page 146 and 147:
Page 148 and 149:
Page 150 and 151:
Page 152 and 153:
Page 154 and 155:
Page 156 and 157:
Page 158 and 159:
Page 160 and 161:
Page 162 and 163:
Page 164 and 165:
Page 166 and 167:
Page 168 and 169:
Page 170 and 171:
Page 172 and 173:
Page 174 and 175:
Page 176 and 177:
Page 178 and 179:
Page 180 and 181:
Page 182 and 183:
Page 184 and 185:
Page 186 and 187:
Page 188 and 189:
Page 190 and 191:
Page 192 and 193:
Page 194 and 195:
Page 196 and 197:
Page 198 and 199:
Page 200 and 201:
Page 202 and 203:
Page 204 and 205:
Page 206 and 207:
Page 208 and 209:
Page 210 and 211:
Page 212 and 213:
Page 214 and 215:
Page 216 and 217:
Page 218 and 219:
Page 220 and 221:
Page 222 and 223:
Page 224 and 225:
Page 226 and 227:
Page 228 and 229:
Page 230 and 231:
Page 232 and 233:
Page 234 and 235:
Page 236 and 237:
Page 238 and 239:
Page 240 and 241:
Page 242 and 243:
Page 244 and 245:
Page 246 and 247: Annex 1Schedule of Tariff Commitmen
Page 346 and 347:
Page 348 and 349:
Page 350 and 351:
Page 352 and 353:
Page 354 and 355:
Page 356 and 357:
Page 358 and 359:
Page 360 and 361:
Page 362 and 363:
Page 364 and 365:
Page 366 and 367:
Page 368 and 369:
Page 370 and 371:
Page 372 and 373:
Page 374 and 375:
Page 376 and 377:
Page 378 and 379:
Page 380 and 381:
Page 382 and 383:
Page 384 and 385:
Page 386 and 387:
Page 388 and 389:
Page 390 and 391:
Page 392 and 393:
Page 394 and 395:
Page 396 and 397:
Page 398 and 399:
Page 400 and 401:
Page 402 and 403:
Page 404 and 405:
Page 406 and 407:
show all

AANZFTA - Annex 1 (Myanmar) 1 Annex 1 Schedule of Tariff ...

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?