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C - DTU Nanotech - Danmarks Tekniske Universitet

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18 3 Theoretical Considerations of Polymers for Bio-Microsystems<br />

CH 2<br />

CH3<br />

C<br />

C O<br />

OCH 3<br />

n<br />

Figure 3.1: Structure of PMMA [33]<br />

provided by a laser. Infrared laser machining evaporates substrate material directly by<br />

applying heat with the laser beam [35]. If UV radiation is used, the irradiated polymer<br />

decomposes, presumably by a mixture of two mechanisms: thermal and direct bond breaking<br />

[11]. As with infrared radiation, thermal bond breaking is induced by heat. In direct bond<br />

breaking, polymer molecules directly absorb ultraviolet photons so that the chemical bonds<br />

within the polymer chains will break if they absorb enough energy, which is often the case.<br />

The resulting smaller polymer chains are volatile or melt at much lower temperatures than<br />

the bulk polymer, thereby leaving a void in the material [11]. The smallest feature size<br />

attainable with laser machining depends strongly on the quality of the optical system, the<br />

laser wavelength and also the material properties of the polymer. As shown in equation 3.1<br />

for small feature sizes, short–wavelength radiation together with a high relative aperture of<br />

the optical system should be used.<br />

d = πλf<br />

4D<br />

d = Focal spot diameter<br />

λ = Wavelength<br />

f = Focal length<br />

D = Pre–focus diameter<br />

(3.1)<br />

From this the advantage of UV over infrared radiation can be seen: In practical terms<br />

the spot size that can be obtained with a UV system can be as small as 1.5 µm, whereas the<br />

feature size for an infrared laser is typically around 200 µm [2]. An advantage of the infrared<br />

laser is that fast prototyping is possible and it is available at moderate prices [35]. A disad-<br />

vantage of the infrared laser is, that the machined channels have Gaussian shape like shown<br />

in Fig. 3.2. For this research project only an infrared laser (CO2–laser, 1060 nm, Fig. 3.3)

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