SoC Design Flow & Tools: SoC Testing

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BypassBypassBypassBypassScan ChainScan ChainCore AScan ChainScan ChainCore BScan ChainScan ChainCore CTest ControlTest ControlTest Control66
IEEE P1500Standard for Embedded Core Test (SECT)
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SoC Design Flow & Tools:SoC Testing
Page 3 and 4:
SoC Test Challenges
Page 5 and 6:
The Role of Testingl The role of te
Page 7 and 8:
l Fabrication defects (caused by im
Page 9 and 10:
Characterization Testingl For desig
Page 11 and 12:
Burn-In Testingl Occurrence of pote
Page 13 and 14:
Incoming Inspectionl Type of tests-
Page 15 and 16: Test QualityNumber of acceptable pa
Page 17 and 18: Technology Trend:System-on-Board to
Page 19 and 20: Separation of Responsibilitiesl The
Page 21 and 22: Distributed Design & Testl In gener
Page 23 and 24: Test Accessl Direct access to deepl
Page 25 and 26: A Conceptual SoC TestArchitecture
Page 27 and 28: A Conceptual Test ArchitectureDACmP
Page 29 and 30: Test Access Mechanism(TAM)
Page 31 and 32: TAM Widthl Determines the test data
Page 33 and 34: TAM ImplementationslllllDirect acce
Page 35 and 36: Direct Access SchemelModification t
Page 37 and 38: Remarksl Advantages- Embedded cores
Page 39 and 40: Test BuslArchitecture overview.TDI/
Page 44 and 45: AMBA Bus-Based Testing44
Page 46 and 47: TransparencyDACmPSRAMSourcePCICUTSi
Page 48: Remarksl Advantages- Low area overh
Page 52 and 53: Test RaillCore level view.CoreParal
Page 54 and 55: Remarksl Advantages- FlexibleEnable
Page 56 and 57: Daisy Chain ArchitectureCore A Core
Page 58 and 59: Remarksl Different types of TAMs ma
Page 60 and 61: Core Test Wrapperl Function- Interf
Page 62 and 63: Wrapper & TAMBypassBypassBypassScan
Page 64 and 65: InTestBypassBypassBypassScan ChainS
Page 68 and 69: Core-Based Testl The core provider
Page 70 and 71: A System Chip with P1500 Wrapped Co
Page 72 and 73: The P1500 Wrapper Architecture72
Page 74 and 75: P1500 Wrapper Parametersl Bandwidth
Page 76 and 77: Problem Statementl Given the test r
Page 78 and 79: Tree Growing Approaches[Jone et al.
Page 80: ILP Formulation[Chakrabarty et al.
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