WM8962B, Rev 4.1 - Wolfson Microelectronics plc

Production DataWM8962BTHERMAL CHARACTERISTICSThe WM8962B thermal performance is characterised by the Θ JA and Θ JB parameters, as noted below.Note that the thermal characteristics are based upon simulations in accordance with the JEDECthermal testing standards, JESD51-9. These test conditions may be very different to the applicationconditions, so these parameters should be used with caution.Theta-JA (Θ JA ) is the junction-to-air thermal resistance. It is determined by the following equation:whereT J = Junction temperature (the maximum temperature on the die)T A = Ambient temperature (the temperature of the surrounding environment)P A = Power dissipated from the device to the surrounding airTheta-JB (Θ JB ) is the junction-to-board thermal resistance. It is determined by the following equation:whereT J = Junction temperature (the maximum temperature on the die)T B = Board temperature (the temperature of the printed circuit board)P B = Power dissipated from the device to the circuit boardSee “Recommended Operating Conditions” for the recommended T J and T A operating limits.PARAMETER SYMBOL TYP UNITThermal resistance (Theta-JA) Θ JA 50 C/WThermal resistance (Theta-JB) Θ JB 20 C/WwPD, April 2013, Rev 4.121