WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA
WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA
WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA
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Board Characterization Drilling characteristics Plating thickness by XRF and dissolution techniquesTable 1. Thickness of Surface Finish (Micro Inches)Topside Pad Bottom Side Pad Barrel -1 Barrel 2Average 88.94 ± 16.44 63.97 ± 12.72 48.73 ± 9.12 38.02 ± 11.12 recommended levels: 4 - 20 mils (MacDermid)8 - 12 mils (EMS)
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