WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA

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Findings and Outcome Plating was poorly and unevenly applied. Resulting in unacceptable solderability. This illustrates the challenges lead free willhave on the US market. Inexperience andlack of knowledge will impact assembly inmany different ways.

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Solderability TestingSAC 305SnPb Using IPC specifications, we evaluated thesolderability of the plating with both tin leadand lead free

Page 1: SMTA DC Chapter Tutorial ProgramChi
Page 4 and 5: Challenges in AssemblySolderability
Page 6 and 7: IPC/JEDEC Moisture SensitivityLevel
Page 8 and 9: Temperature ExposureRe-qualificatio
Page 10: Board Characterization Drilling cha
Page 13: Failure Analysis Using SEM-EDX Evid
Page 17 and 18: Mixed Technology

WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA

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