WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA

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Case StudyTHE PROBLEMImproper joint formation during a lead freewave process.

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Temperature ExposureRe-qualification of MSLratings.Higher vapour pressure inthe package.Higher thermal mismatch.Decreasing adhesion alongthe internal interfaces.Higher failure rate becauseof delamination and cracks.225C250C

Case StudyTHE PROBLEMImproper joint formation during a lead freewave process.

Page 1: SMTA DC Chapter Tutorial ProgramChi
Page 4 and 5: Challenges in AssemblySolderability
Page 6 and 7: IPC/JEDEC Moisture SensitivityLevel
Page 10: Board Characterization Drilling cha
Page 13 and 14: Failure Analysis Using SEM-EDX Evid
Page 15 and 16: Findings and Outcome Plating was po
Page 17 and 18: Mixed Technology

WAVE SOLDERING REFLOW SOLDERING SELECTIVE ... - SMTA

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