PUTTING CUSTOMERS FIRST - UMC

Partnering For Success, continued from page 1our customers to dominate theirmarkets.As the industry moves toeven deeper sub-micron processtechnologies, elevatedcomplexities have made itincreasingly important that wedevelop total product solutionsfor our customers. This processstarts with design, IP, and EDAsupport and extends throughmanufacturing, back-endassembly and test management,and all the way to end of productlife. Of course, in order to delivertruly valuable solutions, we willhave to build up even strongerinternal capabilities to addressthese issues effectively. I amhappy to report that we havealready made significantprogress in turning our effortsinto real-life results for ourcustomers, and I am confidentthat we will continue to progressat a rapid rate in the days tocome.I would like to share withyou some of the recentmilestones that characterize thetype of results we expect to seefrom our close partnerships withour customers. In March, UMCannounced the pure-playfoundry industry’s first delivery ofworking products built using 90-nanometer copper/low-ktechnology to Xilinx. We fullyexpect this achievement to furtherconsolidate Xilinx’s leadership inthe highly competitive FPGAmarket. Soon after, one of ouremerging fabless customers,HBA, achieved silicon successat 90nm for their newest productprototype. Only throughextremely close partnerships canfoundry customers expect to seethese types of early results.Going forward, UMC willcontinue to extend its leadershipin 300mm wafer manufacturingand 90nm and beyondtechnologies. We stronglybelieve that 300mmmanufacturing will play anincreasing role in our customers’success, especially for complexsystem chips. As process linewidthsshrink to 90nm and belowand die size increases due tomore sophisticated SoC designs,the potential for productivitygains increases greatly. WithFab12A in volume production for0.13um customer products andUMCi entering pilot production,UMC’s 300mm leadership with90nm and below designs will bea key tool to help our partnersrealize further competitiveadvantages.Finally, I hope that UMC’sstrengthened focus on customerorientedsolutions will greatlyenhance the competitiveness ofour customers, and I amconfident that together we canreap the benefits of strong andcompelling partnerships.Dr. Jackson Hu -Fact File-25-year semiconductor industryveteran-Former President and CEO ofSiRF Technology-Founded both IC Ensemble andVerticom-Former senior vice president andgeneral manager of S3-Earned BA in electricalengineering from National TaiwanUniversity-Earned Masters and PhD incomputer science from theUniversity of Illinois, Urbana, andan MBA from Santa ClaraUniversity.UMC’s operating priorities1. UMC will accelerate its 300mm investment to expand capacity at Taiwan’s Fab 12A to20,000 wafers per month, and capacity at UMCi to 10,000 wafers per month by the endof 2004.2. UMC will further strengthen its R & D efforts for 90nm and below process technologies,and ensure the availability of a complete catalog of relevant IP for integration in itscustomers’ leading-edge designs.2PROFOUNDRY SPRING 2003