A 2-Slot Time-Division Multiplexing (TDM) Interconnect ... - SLIP

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Metal Layers% reduction in metal layers23.52322.52221.52120.52019.5Cut off = 400 gpCut off = 500 gpCut off = 600 gpCut off = 700 gpCut off = 800 gpCut off = 900 gpCut off = 1000 gpCut off = 1100 gpSaturation forhigher die areasOver 20%reduction inthe numberof metallayers190 1 2 3 4 5 6 7Wire-limited area (sq cm)19 <strong>SLIP</strong> 2004

A Fast Hierarchical Quadratic Placement Algorithm - UCSD VLSI ...

System Level Interconnect Prediction 2004 - SLIP

Highly Scalable Algorithms for Rectilinear and Octilinear Steiner Trees

2001 technology roadmap for semiconductors - Computer - SLIP

Assumptions for Case Study!0.1µ technology!100M transistors distributed uniformly!Operating Frequency = 1.5 GHz!40% Wiring efficiency!60% Wire sharing efficiency!Rent’s exponent = 0.66!Rent’s coefficient = 4.018 <strong>SLIP</strong> 2004

Page 2: Outline!Motivation!TDM technique fo
Page 10 and 11: Source/Sink ProximitySet of sources
Page 12 and 13: Run Length ProximitySource!TDM tech
Page 15 and 16: System Level ModelTechnologyparamet
Page 20 and 21: Dynamic Power30% increase in dynami
Page 22 and 23: Test Case30Area = 3 sq. cm.25% chan
Page 24 and 25: Conclusion!Simple wire sharing tech

A 2-Slot Time-Division Multiplexing (TDM) Interconnect ... - SLIP

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