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INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. � Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/ processor_number for details. Intel ® Active Management Technology requires the computer system to have an Intel(R) AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of implementation of new business processes. With regard to notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see www.intel.com/ technology/platform-technology/intel-amt/ Intel® Trusted Execution Technology (Intel® TXT) requires a computer system with Intel® Virtualization Technology (Intel® Virtualization Technology (Intel® VT-x) and Intel® Virtualization Technology for Directed I/O (Intel® VT-d)), a Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security Intel ® Virtualization Technology requires a computer system with an enabled Intel ® processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor. Warning: Altering clock frequency and/or voltage may (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. * Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost Hyper-threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see http://www.intel.com/info/hyperthreading. 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel ® 64 architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information. Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality. Enhanced Intel SpeedStep ® Technology for specified units of this processor available Q2/06. See the Processor Spec Finder at http:// processorfinder.intel.com or contact your Intel representative for more information. Intel, Intel Core, Core Inside, Intel Speedstep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2009-2010, Intel Corporation. All rights reserved. 2 Datasheet, Volume 1
Contents 1 Introduction..............................................................................................................9 1.1 Processor Feature Details ................................................................................... 11 1.1.1 Supported Technologies .......................................................................... 11 1.2 Interfaces ........................................................................................................ 11 1.2.1 System Memory Support ......................................................................... 11 1.2.2 PCI Express* ......................................................................................... 12 1.2.3 Direct Media Interface (DMI).................................................................... 13 1.2.4 Platform Environment Control Interface (PECI)........................................... 13 1.3 Power Management Support ............................................................................... 14 1.3.1 Processor Core....................................................................................... 14 1.3.2 System ................................................................................................. 14 1.3.3 Memory Controller.................................................................................. 14 1.3.4 PCI Express* ......................................................................................... 14 1.4 Thermal Management Support ............................................................................ 14 1.5 Package ........................................................................................................... 14 1.6 Terminology ..................................................................................................... 15 1.7 Related Documents ........................................................................................... 17 2 Interfaces................................................................................................................ 19 2.1 System Memory Interface .................................................................................. 19 2.1.1 System Memory Technology Supported ..................................................... 19 2.1.2 System Memory Timing Support............................................................... 20 2.1.3 System Memory Organization Modes......................................................... 20 2.1.3.1 Single-Channel Mode................................................................. 20 2.1.3.2 Dual-Channel Mode—Intel ® Flex Memory Technology Mode ............ 21 2.1.4 Rules for Populating Memory Slots............................................................ 22 2.1.5 Technology Enhancements of Intel ® Fast Memory Access (Intel ® FMA).......... 23 2.1.5.1 Just-in-Time Command Scheduling.............................................. 23 2.1.5.2 Command Overlap .................................................................... 23 2.1.5.3 Out-of-Order Scheduling............................................................ 23 2.1.6 System Memory Pre-Charge Power Down Support Details ............................ 23 2.2 PCI Express* Interface....................................................................................... 24 2.2.1 PCI Express* Architecture ....................................................................... 24 2.2.1.1 Transaction Layer ..................................................................... 25 2.2.1.2 Data Link Layer ........................................................................ 25 2.2.1.3 Physical Layer .......................................................................... 25 2.2.2 PCI Express* Configuration Mechanism ..................................................... 26 2.2.3 PCI Express* Ports and Bifurcation ........................................................... 27 2.2.3.1 PCI Express* Bifurcated Mode .................................................... 27 2.3 Direct Media Interface (DMI)............................................................................... 27 2.3.1 DMI Error Flow....................................................................................... 27 2.3.2 Processor/PCH Compatibility Assumptions.................................................. 27 2.3.3 DMI Link Down ...................................................................................... 27 2.4 Platform Environment Control Interface (PECI)...................................................... 28 2.5 Interface Clocking ............................................................................................. 28 2.5.1 Internal Clocking Requirements................................................................ 28 3 Technologies ........................................................................................................... 29 3.1 Intel ® Virtualization Technology .......................................................................... 29 3.1.1 Intel ® VT-x Objectives ............................................................................ 29 3.1.2 Intel ® VT-x Features .............................................................................. 29 Datasheet, Volume 1 3
Page 1: Intel ® Core i7-800 and i5-700 Des
Page 5 and 6: 7 Electrical Specifications .......
Page 7 and 8: 7-9 Control Sideband and TAP Signal
Page 9 and 10: Introduction 1 Introduction The Int
Page 11 and 12: Introduction 1.1 Processor Feature
Page 13 and 14: Introduction nonzero) with an Unsup
Page 15 and 16: Introduction 1.6 Terminology Term D
Page 17 and 18: Introduction 1.7 Related Documents
Page 19 and 20: Interfaces 2 Interfaces This chapte
Page 21 and 22: Interfaces 2.1.3.2 Dual-Channel Mod
Page 23 and 24: Interfaces 2.1.5 Technology Enhance
Page 25 and 26: Interfaces Figure 2-4. Packet Flow
Page 27 and 28: Interfaces 2.2.3 PCI Express* Ports
Page 29 and 30: Technologies 3 Technologies 3.1 Int
Page 31 and 32: Technologies 3.1.5 Intel ® VT-d Fe
Page 33 and 34: Power Management 4 Power Management
Page 35 and 36: Power Management — All active pro
Page 37 and 38: Power Management Note: The P_LVLx I
Page 39 and 40: Power Management The processor exit
Page 41 and 42: Power Management 4.3 Integrated Mem
Page 43 and 44: Thermal Management 5 Thermal Manage
Page 45 and 46: Signal Description 6 Signal Descrip
Page 47 and 48: Signal Description Table 6-3. Memor
Page 49 and 50: Signal Description Table 6-5. Reset
Page 51 and 52: Signal Description 6.8 JTAG/ITP Sig
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Signal Description 6.10 Power Seque
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Signal Description 6.12 Graphics an
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Electrical Specifications 7 Electri
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Electrical Specifications Table 7-1
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Electrical Specifications 7.7 Test
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Electrical Specifications Figure 7-
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Electrical Specifications 7.10 Plat
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Processor Land and Signal Informati
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