Tachyon
Data Sheet (.pdf) - Brion Technologies, Inc.
Data Sheet (.pdf) - Brion Technologies, Inc.
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brion.com<br />
<strong>Tachyon</strong> <br />
LAD<br />
A COMPREHENSIVE SOLUTION FOR HIGH FIDELITY<br />
LITHOGRAPHY MODELING DURING THE INTEGRATED<br />
CIRCUIT (IC) DESIGN IMPLEMENTATION PHASE<br />
......................................................<br />
Tech node,<br />
litho layer GDSII layout<br />
<strong>Tachyon</strong> Lithography-Aware Design (LAD)<br />
sets new standards for fast, accurate and<br />
robust lithography modeling in the IC<br />
implementation flow. Discover and correct<br />
design induced lithography hot spots<br />
before tapeout. Extract more from your target process - performance, density<br />
and yield with lower power. <strong>Tachyon</strong> LAD is compatible with existing design<br />
flows and tools.<br />
Built on a Solid Foundation<br />
Brion Technologies, an ASML company, is the largest, fastest growing pure-play computational lithography<br />
company in the industry. More customers have qualified Brion’s process window lithography verification<br />
model than any other company’s. Brion also represents an emerging standard for optical proximity<br />
correction (OPC) generation.<br />
With such a deep core competency in post-tapeout lithography modeling and optimization, Brion is the<br />
perfect partner to bring this information to the pre-tapeout IC implementation flow. Using <strong>Tachyon</strong> LAD,<br />
designers can now discover and correct a wide range of design-induced lithography hot spots before<br />
tapeout. Timing analysis is also enhanced, resulting in better performing designs with reduced time<br />
to volume.<br />
Early Adoption<br />
IC Design Flow<br />
Layout Editor<br />
/ Viewer<br />
Place and<br />
Route<br />
Timing<br />
Analysis<br />
Model - Based<br />
DRC<br />
Calibrating semiconductor lithography models is a long, time consuming and error-prone task. <strong>Tachyon</strong> LAD<br />
makes maximum use of the same calibrated and robust models used in today’s advanced wafer<br />
manufacturing facilities. No new models and no model availability time lag.<br />
Silicon contours,<br />
hot spot markers,<br />
fixing hints
<strong>Tachyon</strong> LAD<br />
LAD Product Features<br />
Accurate Full Process-Window Modeling<br />
■<br />
The same fully calibrated models<br />
are used in OPC generation and<br />
OPC verification<br />
■ Fast modeling for the entire process -<br />
mask, optics, resist and etch<br />
■<br />
■<br />
Mask and wafer process<br />
variability analysis<br />
Dense image-based computation<br />
Inputs to Third Party EDA Tools<br />
■ Cross-process window contours<br />
with and without mask CD errors<br />
■<br />
Lithography manufacturability hot<br />
spot check reports (contours and<br />
hot spot markers)<br />
■ Hot spot resolutions<br />
Speed and Performance<br />
■<br />
■<br />
■<br />
■<br />
■<br />
Fully integrated hardware<br />
accelerated platform for full<br />
chip applications<br />
Fast, predictable turnaround time<br />
Linearly scales with chip area<br />
Linearly scales with leaf node<br />
additions<br />
Insensitive to design hierarchy,<br />
pattern complexity and file size<br />
Applications Include<br />
■<br />
■<br />
■<br />
■<br />
■<br />
Library and memory<br />
cell optimization<br />
Full chip place and<br />
route optimization<br />
Timing analysis<br />
Model based design rule check<br />
(DRC) sign-off<br />
Real-time contour review for<br />
custom layout and RET review<br />
<strong>Tachyon</strong> LAD is architected to interface easily to existing IC<br />
implementation and verification tools. Users will be able to upgrade their<br />
existing flows to support critical manufacturing information. <strong>Tachyon</strong> LAD<br />
communicates this information in a form that is familiar to designers –<br />
GDSII compatible data with hot spot markers. While the analysis engines<br />
inside <strong>Tachyon</strong> LAD contain detailed lithography information, that<br />
complexity is hidden from the user.<br />
No new models to verify, no new tools to adopt, no new technology to<br />
learn, just manufacturable, robust designs.<br />
Unified Models, Simplified Analysis<br />
.......................<br />
Computational Lithography Enabled Design & Manufacturing<br />
Library<br />
Custom<br />
Layout<br />
P&R<br />
Design Intent<br />
Extraction<br />
Power<br />
Timing<br />
Process Information<br />
DRC<br />
LVS<br />
CL<br />
Model<br />
Process window<br />
Process window<br />
RET<br />
OPC<br />
LMC<br />
Mask<br />
Data<br />
Prep<br />
MEEF defects<br />
Hot spots<br />
Statistics<br />
Thru-PW defects<br />
Full chip contour Thru PW defects<br />
Hot spots<br />
Process Information<br />
Mask<br />
Writer<br />
Mask<br />
Inspect<br />
Mask<br />
Metrology<br />
Design Intent<br />
The same process model used<br />
in the entire design to manufacturing flow<br />
Wafer<br />
Scanner<br />
Wafer<br />
Metrology<br />
With <strong>Tachyon</strong> LAD, there is now one accurate and production proven<br />
model used throughout the entire design and manufacturing flow. Clear<br />
manufacturability ownership is established. Lithography process models<br />
and resolution enhancement techniques (RET) are owned by the Fab;<br />
chip performance and robustness are owned by the designer.<br />
<strong>Tachyon</strong> LAD is being integrated with third party EDA tools and design<br />
flows through a well defined client-server interface architecture. Ask your<br />
EDA vendor about <strong>Tachyon</strong> LAD support today.<br />
Brion Technologies, Inc.<br />
Phone: +1 (408) 653-1500<br />
Email: info@brion.com<br />
brion.com<br />
© 2007 Brion Technologies, Inc. All rights reserved.