ALR Tablet Presentation
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ENIG (Electroless Nickel Immersion Gold (Ni-Au))<br />
ENIG is a two layer metallic coating of 0.05um- 0.10uM of Gold over 3uM to<br />
8UM of electroless nickel. The Nickel is the barrier to the copper and is the<br />
surface to which the components are actually soldered to. The gold protects the<br />
nickel during storage and also provides the low contact resistance required for<br />
the thin gold deposits. ENIG is now arguably the most used finish in the PCB<br />
industry due the growth and implementation of the RoHs regulation.<br />
ADVANTAGES<br />
Gold Wire-Bondable<br />
Planar Surface<br />
Consistent Thicknesses<br />
Multiple Thermal Cycles<br />
Long Shelf Life<br />
Solders Easily<br />
Good for Fine Pitch Product<br />
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DISADVANTAGES<br />
Solder Joint Embrittlement<br />
Potential When Incorrectly Specified<br />
Difficult to Control<br />
Cannot be Reworked at PCB Manufacturer<br />
Helping you save Money on your PCBs when<br />
material costs are rising.<br />
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