ALR Tablet Presentation
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HASL (Hot Air Solder Level ( Leaded or Lead free (LF))<br />
HASL was the predominant surface finish used in the industry. The process consists of<br />
immersing circuit boards in a molten pot of a tin/lead alloy and then removing the excess<br />
solder by using ‘air knives’, which blow hot air across the surface of the board.<br />
This is the standard default for practically all manufacturers and is NOT an additional cost.<br />
Advantages<br />
•“Nothing Solders Like Solder”<br />
•Easily Applied<br />
•Lengthy Industry Experience<br />
•Easily Reworked<br />
•Multiple Thermal Excursions<br />
•Good Bond Strength<br />
•Long Shelf Life<br />
•Easy Visual Inspection<br />
Disadvantages<br />
Huge Co-Planarity Difference, Resulting in Off-<br />
Contact Printing and Assembly Defects (pitch<br />
dependant)<br />
Not Suited for High Aspect Ratios<br />
Not Suited for < 20 Mil pitch SMT and<br />
BGAs<br />
Bridging Problems on Fine Pitch Assemblies<br />
Inconsistent Coating Thicknesses (on<br />
Varying Pad Sizes)<br />
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