ALR Tablet Presentation
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OSP (Organic Solderability Preservative)<br />
OSP (Organic Solderability Preservative) or anti-tarnish preserves the copper<br />
surface from oxidation by applying a very thin protective layer of material over<br />
the exposed copper usually using a conveyorized process.<br />
It uses a water-based organic compound that selectively bonds to copper and<br />
provides an organometallic layer that protects the copper prior to soldering. It’s<br />
also extremely green environmentally in comparison with the other common<br />
lead-free finishes, which suffer from either being more toxic or substantially<br />
higher energy consumption.<br />
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Home<br />
Page<br />
Why<br />
Use<br />
<strong>ALR</strong> ?<br />
ADVANTAGES<br />
Flat, Coplanar pads<br />
Reworkable (at PCB<br />
Fabricator)<br />
Doesn’t Affect Finished<br />
Hole Size<br />
Short, Easy Process<br />
Low Cost<br />
Good Soldermask<br />
Integrity<br />
Helping you save Money on your PCBs when<br />
material costs are rising.<br />
DISADVANTAGES<br />
Assembly Line Changes May be<br />
Required; Not a “Drop-In” Situation<br />
Difficult to Inspect<br />
Question Remains Over Reliability of<br />
Exposed Copper After Assembly<br />
Limited Thermal Cycles<br />
Limited Shelf life<br />
Panels Need to be Routed and<br />
Electrically Tested Prior to Coating<br />
4<br />
Product<br />
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