ALR Tablet Presentation
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Immersion Silver<br />
Due to it special handling requirements, and limited shelf life it is not a<br />
commonly used board finish.<br />
Immersion Silver is typically in the thickness range of 0.125uM to 0.50uM.<br />
Galvanic Displacement- Simply an Exchange of Copper and Silver Atoms; No<br />
Reducing Agent Required<br />
ADVANTAGES<br />
Good for Fine Pitch Product<br />
Planar Surface<br />
Inexpensive<br />
Short, Easy Process Cycle<br />
Eliminates Nickel<br />
Doesn’t Affect Hole Size<br />
Long Shelf-Life<br />
OK for Multiple Insertions<br />
DISADVANTAGES<br />
High Friction Coefficient; Not Suited<br />
for Compliant-Pin Insertion (Ni-Au Pins)<br />
Some Systems Cannot Throw Into<br />
Microvias with Aspect Ratios > 1:1<br />
Tarnishing Must be Controlled<br />
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