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Customer Concerns with XFP<br />
■ Host PCB Concerns<br />
�� Need up to 8 – 12” on FR-4 Substrates with Buried Stripline<br />
�� Fears of Routing <strong>10</strong>G Traces.<br />
■ PCI Card Compliance (Limits Device Height)<br />
■ Difficulty of One Form Factor for All Reachs<br />
�� Up to 40km (datacom) or 80 km (telecom)<br />
■ Thermal <strong>Solution</strong> to Support Proposed High Density<br />
■ Difficulty of Suppressing Electromagnetic Emissions (EMI)<br />
■ Overall SONET Jitter Compliance for Telecom<br />
■ Availability of ICs with <strong>10</strong>G Serial Interface<br />
Finisar<br />
Lew Aronson October 17, 2002
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