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Critical Modeling Issues for XFP<br />
■ Host Board Design<br />
�� Via Structures, Transmission Lines<br />
■ Host Board ASIC<br />
�� I/O Return Loss from Package Design and IC Circuit Combination<br />
■ XFP Connector<br />
�� Presently Very Significant Source of Reflections (but good enough)<br />
�� Improved Connector Designs will Increase Margins<br />
■ XFP Module<br />
�� Return Loss of CDR I/O<br />
�� Many Internal Modeling Problems.<br />
�� New Issues Associated with Very Small Optoelectronic Packages<br />
■ EMI Issues<br />
�� Potential Host Board Design, Cage, and Module Details Affect EMI<br />
�� Compliance Always More Difficult at Higher Frequencies<br />
Finisar<br />
Lew Aronson October 17, 2002
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