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XFP Host System – Via Designs<br />
■ Buried Stripline Important for Minimizing EMI<br />
Finisar<br />
■ Vias for Transition from ASIC to Stripline and Stripline to XFP Connector<br />
�� Good Via Design is Critical to Meet XFI Specs<br />
■ Via Tradeoffs<br />
�� Blind Vias Offer Minimum Parasitics – Most Expensive<br />
�� Through Vias are Standard Technology but Result in Via Stub<br />
■ Design Balances Via Inductance with Capacitance to Ground Planes<br />
■ Fullwave Analysis by Ansoft Resulted in Practical Via Designs Used in<br />
Finisar Reference Board.<br />
Lew Aronson October 17, 2002
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