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Index OMC_final - Harvard University

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OPTOMECHANICAL COOLING AND AMPLIFICATION IN A CHIP-SCALE<br />

INTEGRATED CIRCUIT<br />

Hong Tang<br />

Yale <strong>University</strong><br />

I will describe our efforts in developing integrated circuits of cavity optomechanics on a silicon<br />

compatible chip. A progressive path for scaling optomechanical structures to smaller size, higher<br />

frequency and stronger coupling will be presented. We will show several promising applications<br />

stemming out on-chip cooling and amplification functions.<br />

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