of MEMS - Institute of Microelectronics - A*Star

Singapore – a research capital
Singapore has a world-class electronics sector that is moving rapidly towards high
value-added, knowledge-intensive manufacturing. Many of the world’s most innovative
electronics companies have established state-of-the art manufacturing facilities and R&D
facilities here.
To stay at the forefront, research is a top priority that enjoys strong public funding and
record private investment. Singapore has excellent research infrastructure and institutes
like IME have attracted globally respected research scientists and engineers, making it a
hotspot for groundbreaking innovations.
For more information, please contact:
Dr Janak Singh
Micro-Electro-Mechanical-Systems
Institute of Microelectronics
Tel: +65 6770 5909
Email: Janak@ime.a-star.edu.sg
About IME
IME’s mission is to add value to Singapore’s
semiconductor industry by developing strategic
competencies, innovative technologies and intellectual
property; enabling enterprises to be technologically
competitive; and cultivating a technology talent
pool to inject new knowledge to the industry. Its key
research areas are in integrated circuits design,
nano-electronics & photonics, advanced packaging,
bioelectronics, medical devices and MEMS.
A member of A*STAR
Singapore’s lead government agency for scientific
research and developing research talent
Dr Tang Min
Micro-Electro-Mechanical-Systems
Institute of Microelectronics
Tel: +65 6770 5769
Email: tangm@ime.a-star.edu.sg
For more information, visit IME on the Internet: http://www.ime.a-star.edu.sg.
Unleash the potential
of MEMS
Institute of Microelectronics Singapore
Established since 1991, the Institute of Microelectronics (IME)
has accumulated expert knowledge to help entrepreneurs
and innovators stretch the incredible potential of MEMS in
applications for medicine, science and technology. Join us
in realizing your boldest ideas as we empower you with
commercially viable, production-ready solutions.
We provide the vital link between
your idea and mass manufacture
IME has a dedicated R&D foundry, staffed by a highly experienced research
team–a facility that is unique to the region. We are in partnership with our
customers at every stage of the development cycle, from proof-of-concept,
prototype creation and identifying a manufacturing partner right through to
the design of standardized modules and small volume pilot production.
We shape the future
of MEMS production
Going beyond MEMS development, IME is actively shaping its entire
manufacturing eco-system. We are spearheading Singapore’s first MEMS
consortium to standardize MEMS design, fabrication and packaging
processes and build a sustainable MEMS supply chain in Singapore.

Access a unique facility
like no other
IME offers fabless and fab-lite customers access
to the region’s first and only R&D foundry where
experienced research teams are on hand to
support every need with a full suite of research and
development services. Take advantage of IME’s fully
integrated MEMS design, fabrication packaging and
characterization capabilities and our proven expertise
in MEMS and CMOS integration to achieve costeffective
production.
R&D FOUnDRy BUSInESS MODEl
IME: R&D Partner
• Facility, Expertise,
Solutions, IPs
• Prototyping and
Qualification
Fabless Product Company
Enter the future of MEMS manufacturing
Manufacturing Partner
• Wafer fabs; Equipment
Seller
• Packaging/Assembly;
Substrates
Backed by A*STAR and the Economic Development
Board, IME has mobilized industry players from every
stage of the MEMS supply chain to form the Singapore
MEMS Consortium. This game-changing collaboration
promotes the manufacturing of MEMS devices for
multiple applications using standardized technology
platforms.
Ultimately, our success can help you lower costs and
other barriers to entry, increase productivity and
speed up the growth of a sustainable MEMS industry in
Singapore capable of meeting urgent global demand.
8” wafer fab facilities for CMOS and MEMS prototyping
A 2100m2 , Class 1/100 clean room with state-ofthe-art
8” wafer fabrication equipment and separate
clean rooms for MEMS and CMOS to avoid crosscontamination.
Packaging, assembly and microsystem technology
Advanced equipment for photonics, bio, nano and SiP
packaging and assembly, as well as thermal, electrical,
mechanical and optical modeling and simulation
expertise under one roof.
Materials characterization and failure analysis
expertise
A full set of analytical and test support services
(M-STEM, TEM, SEM, Auger, SIMS, TXRF, FIB, AFM, FTIR)
State-of-the-art laboratories
• Circuit Design Lab with industry standard CAD tools
for RF, Analog, Mixed-Signal and Digital designs
• High-frequency device characterization Lab featuring
110GHz characterization equipment with 12-inch
wafer prober
• Optoelectronics and photonics Lab with full set
of characterization set-ups for 10 Gb/s and above
testing
• Organic electronics Lab with full sets of processing
tools and capabilities for OPV
• Bio Lab featuring microfluidics-based platforma for
nucleic acid, protein and cells analyses
Device Design and
Modeling
Available
Available
• Resonator
(Piezoelectric/
Electrostatic type)
• Low power Signal
conditioning &
processing circuits
• Actuator
(ES/ Thermal/
Piezo)
• RF MEMS switch
for capacitive
accelerometer and
pressure sensor
(Capacitive/
metal-contact type)
• Magnetic and
• Wireless link
transceiver circuits
NEMS switch • MEMS display
• Accelerometer driver signal
(2D/ 3D)
• Pressure sensor
conditioning circuits
• NEMS pressure Upcoming
sensor
• Signal conditioning
• Micro-mirror & processing
• IR sensor
circuits for
• Piezoelectric filter Biomedical
& impedance
tuner
applications
• Energy harvester
(Thermoelectric /
Capacitive)
• RF MEMS-based
transceiver
Upcoming
• Ultrasonic
transducer
Partner the Best
With two decades of expertise in MEMS research and firsthand experience shaping the industry, IME is
the research partner of choice.
Benefits
MEMS ASIC
Design Capability
IME MEMS Core Capabilities
MEMS Process
Technology
Available
• Bulk & surface
micromachining
• Wafer bonding
(direct & adhesive)
• VHF/XeF 2 release &
anti-stiction coating
• Bio-compatible
polymers
• CMOS & MEMS
integration
• Stress compensation
thin film processes
• Sacrificial polymer
via fill process
and suspended
microstructures
• Void free Cu and
Polysilicon TSV
technology
Upcoming
• Low-temp C2W
packaging
• Thin film
encapsulation
• MEMS-ASIC 3D stack
with TSV
MEMS Packaging
Technology
Available
• Micro fluidic
packaging process
• Wafer thinning with
capped wafer
• WLP by Frit-glass &
solder bonding
• Hermetic & vacuum
WLP (Frit-glass and
solder-based)
• Released MEMS
wafer dicing
• TSV for surface
mountable WLP
• Embedded packaging
• Packages with small
form factor
(e.g. < 1mm x 1mm)
Upcoming
• Low-temp C2W
vacuum packaging
• Thin film
encapsulation
• MEMS & ASIC 3D
stacking with TSV
• Strong intellectual property protection with no conflict of interest from partners
• Production-ready research strategy and third-party manufacturing partner involvement
• Extensive industry and academic network
• Strategic location in Singapore with in-depth insights and ready access to regional markets
MEMS Device
Characterization
Available
• Resonant frequency
(using Impedance
Analyzer & MMA)
• Quality factor vs
pressure
(in vacuum chamber)
• Motion analysis
(using MMA)
• Surface profile
(using WYKO)
• Accelerometer
(CV & ASIC)
• Energy harvester
• Pressure sensor
(temp & pressure
chamber)
• Optical MEMS
(Optical bench with
laser source)
• Mode shape, in-plane
and out-of-plane
motion (using MSA
motion analyzer)
• RF S-parameter
measurement