PCB + ASSEMBLY It is
PCB + ASSEMBLY It is recommended to consult with a cleaning fluid manufacturer to offer the knowledge on the cleaning resolution according to specific needs. There is a variety of advanced cleaning products that are consistent and reliable, even for difficult to remove fluxes and pastes. Source: MicroCare Corporation Source: MicroCare Corporation Zusammenfassung Da die Nachfrage nach hochzuverlässigen miniaturisierten elektronischen Bauteilen weiter steigt, wird die Notwendigkeit einer kritischen Reinigung noch wichtiger. Dies bedeutet die Verwendung von passenden Reinigungsflüssigkeiten und -verfahren, aber auch die Berücksichtigung von Arbeitssicherheit, regulatorische Anforderungen und Umweltbelange. Résumé Comme la demande de composants électroniques miniaturisés continue d’augmenter, le besoin de nettoyage devient encore plus important. Cela implique l‘utilisation de fluides et de procédures de nettoyage approprié, mais également la prise en compte de la sécurité du travail, les exigences réglementaires et les préoccupations environnementales. Zusammenfassung russisch Так как спрос на высоконадежные миниатюризированные электронные компоненты продолжает расти, то необходимость критичной очистки становится ещё важнее. Это означает использование подходящих очищающих жидкостей и методов очистки, а также учет безопасности работы, требований законодательства и защиты окружающей среды. Advanced chemistries ‘future-proof’ electronics Highly advanced cleaning fluid manufacturers now have products that are completely ozone-safe and meet, for example, the EU’s rules of Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) requirements. These innovative new cleaning fluids are not only gentle on the planet but also deliver consistent and reliable cleaning, even on difficult to remove ‘no-clean’ fluxes and other solder pastes. One solution that has proven to work well and has the power to clean difficult to remove contaminant, like no-clean flux, is a circuit cleaner based on ultra-pure siloxanes. This easily removes cured silicone conformal coatings and silicone adhesives, and works well on fluxes, pastes, organic residues, ionics, silicone-based conformal coatings, adhesives, grease and oils. What makes these innovative cleaning chemistries even more impressive is that they also have ‘green credentials’ with a low VOC formula, which is ozone-friendly and complies with many regulations including RoHS and REACH. New flux and paste formulations have an important role in today’s electronics assembly. In turn, modern, non-flammable, environmentally-progressive precision cleaning can make a substantial and relatively inexpensive enhancement to the performance, reliability and longevity of miniature electronic devices. As the continued demand for high-reliability miniaturized electronic components continues to grow, the need for critical cleaning becomes even more important. This means implementing cleaning fluids and methods that possess all the essential cleaning capabilities for smaller, more tightly packed PCBs, but also address worker safety, regulatory requirements and environmental concerns. Before selecting a cleaning solution, consult with a cleaning fluid manufacturer who has the knowledge, experience and expertise to offer the best cleaning resolution depending on specific requirements. www.microcare.com 46 EPP EUROPE November 2018
PRODUCT UPDATES PCB + ASSEMBLY Improved no-clean, halogen-free flux-cored solder wire Nihon Superior Co. Ltd., a joining material supplier, has developed a flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures. This solder wire is a general purpose, noclean, halogen-free cored-flux. When paired with the SN100C lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering. (032) cored-flux is available with the company’s SN100CV lead-free alloy that gains its strength from solute atoms in the tin matrix, as well as SAC305 solder. Flux spattering test The following were the test conditions: • Solder material: SN100C (032) • Supply quantity: 6.4 mm • Line diameter: 1.0 mm • Supply speed: 20 mm/second • Tip temperature: 350 °C, 380 °C, 410 °C Source: Nihon Superior Co., Ltd. The test was conducted as a simulated „post soldering process“ which is performed as touch-up or repair of parts after initial soldering. Evaluation was conducted with solder tip temperatures of different temperatures. www.nihonsuperior.co.jp The (032) is a general purpose, no-clean, halogen-free cored-flux. Source: Nihon Superior Co., Ltd. The results from the evaluation test (comparison with conventional cored wire). Source: Nihon Superior Co., Ltd. EPP EUROPE November 2018 47
