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Nové metody a postupy v oblasti přístrojové techniky, automatického řízení a informatikyÚstav přístrojové a řídicí techniky ČVUT v Prazeodborný seminář Jindřichův Hradec, 28. až 29. května 2009Fig. 4 Structure soldering device with peltier heaterFig. 5 Real device picture7. Test resultsWe ran the test with 5mm thick liquid, the average current was from 10A to 12A, andthen the current was reversed at the peak temperature to start cooling.Control of the current was independent for each layer. During liquid heating, thecurrent was increased from the bottom layer to the top layer, during cooling down of theliquid; the current was decreased from bottom layer to the top layer. The measured results areshown in figure 11. As the used peltier elements had endurance only to 230°C, themeasurement was stopped at temperature around 170°C.180160T140emp120er 100at 80ur 60e(°C)402000 50 100 150 200 250 300 350 400Time (s)Fig 6 Temperature profile7
Nové metody a postupy v oblasti přístrojové techniky, automatického řízení a informatikyÚstav přístrojové a řídicí techniky ČVUT v Prazeodborný seminář Jindřichův Hradec, 28. až 29. května 20098. ConclusionsSoldering device with peltier heater solves the problem of resistance heater (hightemperature inertia). As it can be seen from the obtained temperature profile, this constructionis able to achieve very rapid heating and cooling of the liquid. As this device is supposed tobe used for soldering in laboratory or small development team environments, the necessity isto have the soldering process as fast as possible but by maintaining the componentsmanufacturers recommended reflow process. By controlling the peltier elements currents, it iseasy to control the temperature profile. But, the biggest advantage of this type of constructionis the removal of the temperature inertia and of the second necessary device used only forcooling. On the other hand, compared to resistive heating, as the peltier elements are moreexpensive, the price of the device is higher. Also, high temperature peltier elements are noteasily available yet today. According to manufacturer information’s, some of them aredeveloping high temperature elements capable to endure up to 250°C, some have themalready available. Our goal for the near future is to test these high temperature types and toget the device operational for lead free soldering process with temperatures up to 240°C.References (styl literatura)[1] Munroe, A.: Today's Vapor Phase Soldering, Chris Publication: Circuits Assembly, Mar1, 2008[2] Solder reflow, online at http://www.siliconfareast.com/solder-reflow.htm (as from17.4.2009)[3] Walker, J.: Pb-Free Author: Walter, Markus Publication: Circuits Assembly Dec 1, 2005[4] Rudometov, V., Rudometov, E. Peltier basics : Charles River Media., January 2001ISBN-10: 1584500794[5] Žák, P.: Tvorba whiskerů při měkkém pájení v elektronice, ČVUT v Praze, fakutaelektrotechnická, online athttp://www.cez.cz/edee/content/file/vzdelavani/soutez/zak.pdf (as from 17.4.2009)[6] Kotrčová, E. Implementation of lead-free soldering technology, ČVUT v Praze, fakutaelektrotechnická, online athttp://www.cez.cz/edee/content/file/vzdelavani/soutez/kotrcova.pdf (as from 17.4.2009)Kontaktní adresaČVUT v Praze, Fakulta strojní, Ústav přístrojové a řídicí techniky, odbor elektrotechniky,Technická 4, 166 07 Praha, Česká republika, tel: +420 2 2435 2646, E-mail:MaiLam.Do@fs.cvut.cz8
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