DVD-18C Soldering Terminals - IPC
DVD-18C Soldering Terminals - IPC
DVD-18C Soldering Terminals - IPC
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<strong>DVD</strong>-<strong>18C</strong> Transcript<br />
Another method of forming a solder heat bridge is to first place the soldering iron tip in contact<br />
with the wire and the terminal – and then add a small amount of solder to the contact point.<br />
Again, additional solder is applied on the opposite side of the contact point to form the necessary<br />
solder fillet.<br />
At this point, we'll remove the flux to inspect the joint. The cleaning requirements are the same<br />
as any other hand solder connections on a circuit board. Some companies use low residue or noclean<br />
fluxes which may not require cleaning. Other fluxes can cause corrosion or contribute to<br />
dendritic growth. These residues will need to be cleaned off. It is important to adhere to the<br />
manufacturer's specification for solder temperature and cleaning requirements. Your company<br />
will supply you with a compatible cleaning solvent and instructions for its use. They will make<br />
the decision whether to clean or not based on customer requirements for reliability or cosmetic<br />
quality.<br />
Once the flux is cleaned, we’re ready to inspect the solder joint. Do you know how to determine<br />
the correct amount of solder? What exactly do you look for when examining a solder joint?<br />
<strong>IPC</strong>-A-610, J-STD-001 and <strong>IPC</strong>-A-620 all provide acceptance criteria for soldering terminals.<br />
Check that the solder is feathered out smoothly – showing good wetting action over the wire and<br />
the terminal. Wetting is the adhesion of a smooth, unbroken film of solder onto a base metal.<br />
The outline of the wire should be visible under a thin film of solder. This connection location is<br />
called a fillet. On a proper solder joint, the solder fillet is slightly concave, or curved inward. A<br />
concave fillet that tapers to a feathered edge not only looks good, but also reassures us that the<br />
solder bonded to the two surfaces we were trying to join.<br />
When there is insufficient solder, the joint may not have acceptable mechanical strength. When<br />
there is excessive solder, the fillet will be convex and the outline of the wire will be buried in the<br />
mound of solder. This is undesirable because the excess solder can hide defects in the<br />
connection.<br />
It is important to solder so that the joint can be visually inspected. <strong>Soldering</strong> for inspectability<br />
means you're always able to see the outline of the wire in the joint. When excess solder is<br />
evident, the outline of the wire will not be visible.<br />
Cup <strong>Terminals</strong><br />
The next type of terminal we’ll discuss is the cup terminal. The cup part is a hollow cylinder.<br />
The wire will be inserted into the cup and then soldered. During any soldering process nothing<br />
except the technician’s hands should move. This will eliminate the risk of disturbed solder. The<br />
terminal needs to be mounted securely – and the non-soldered wire end should be held by a third-<br />
hand tool, or equivalent.<br />
The wire size must be matched to the terminal. Never modify the wire or the terminal to make the<br />
wire fit. Several smaller wires may be placed into a single cup – as long as the wires do not<br />
exceed the diameter of the cup. It is not acceptable to twist multiple wires together before<br />
inserting them. The twisted wires may trap flux inside and may also change the acceptable<br />
diameter of the wires that are inserted.<br />
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